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AM3703CBP100

Texas Instruments

AM3703CBP100 by Texas Instruments

AM3703CBP100 by Texas Instruments is a 32-bit microprocessor with integrated cache and 8-bit on-chip data RAM. It operates at a max clock frequency of 54 MHz, suitable for applications requiring high-speed processing. With low power mode and boundary scan features, it is ideal for compact devices needing efficient performance.

Median Price

$34.740

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 14 parts In-Stock

1+ parts

$23.240

100+ parts

$22.780

1k+ parts

$22.310

10k+ parts

-

14

$23.240

$22.780

$22.310

-

Arrow

USA . 94 parts In-Stock

1+ parts

$34.740

100+ parts

$28.540

1k+ parts

$27.480

10k+ parts

-

94

$34.740

$28.540

$27.480

-

DigiKey

USA . 168 parts In-Stock

1+ parts

$47.500

100+ parts

$36.799

1k+ parts

$33.779

10k+ parts

-

168

$47.500

$36.799

$33.779

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 26 parts In-Stock

1+ parts

$30.390

100+ parts

-

1k+ parts

-

10k+ parts

-

26

$30.390

-

-

-

Digiode

USA . 2,650 parts In-Stock

1+ parts

$33.003

100+ parts

-

1k+ parts

-

10k+ parts

-

2,650

$33.003

-

-

-

Vyrian

USA . 7,311 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,311

-

-

-

-

TME

Poland . 672 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$32.700

10k+ parts

-

672

-

-

$32.700

-

VNN

France . 431 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

431

-

-

-

-

Chip Stock

USA . 146 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

146

-

-

-

-

Zilex Electronics Inc.

Canada . 5 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 784 parts In-Stock

1+ parts

$10.087

100+ parts

-

1k+ parts

-

10k+ parts

-

784

$10.087

-

-

-

Ampacity Inc.

Singapore . 120 parts In-Stock

1+ parts

$29.530

100+ parts

-

1k+ parts

-

10k+ parts

-

120

$29.530

-

-

-

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$30.390

100+ parts

-

1k+ parts

$28.870

10k+ parts

$28.263

2,000

$30.390

-

$28.870

$28.263

Corphita

USA . 4,650 parts In-Stock

1+ parts

$31.266

100+ parts

-

1k+ parts

-

10k+ parts

-

4,650

$31.266

-

-

-

Parana Technologies

USA . 1,768 parts In-Stock

1+ parts

$36.444

100+ parts

-

1k+ parts

-

10k+ parts

-

1,768

$36.444

-

-

-

ChromeModa Solutions

Germany . 2,903 parts In-Stock

1+ parts

$40.948

100+ parts

$33.577

1k+ parts

-

10k+ parts

-

2,903

$40.948

$33.577

-

-

IDEA Electronic Components Group

UK . 1,862 parts In-Stock

1+ parts

$40.948

100+ parts

$38.901

1k+ parts

$36.853

10k+ parts

-

1,862

$40.948

$38.901

$36.853

-

Authorized Procurement Solutions

USA . 7,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,000

-

-

-

-

DigiPath Technology Company

USA . 1,364 parts In-Stock

1+ parts

-

100+ parts

$36.919

1k+ parts

-

10k+ parts

-

1,364

-

$36.919

-

-

Overview

Enhance your electronic devices with the AM3703CBP100 by Texas Instruments, a top-quality microprocessor that offers unparalleled performance and reliability. Manufactured by the trusted name in the industry, this innovative product boasts integrated cache, advanced technology, and a wide range of applications in various fields. Elevate your projects with this powerful processor, featuring low power mode, high-speed processing capabilities, and a compact design for seamless integration. Trust Texas Instruments to deliver cutting-edge solutions that exceed your expectations. Unlock the potential of your creations with the AM3703CBP100 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microprocessor, ensuring a longer lifespan.

Integrated Cache: YES

Improved performance and speed as data can be accessed quickly from the cache memory.

Maximum Supply Voltage: 1.2 V

Efficient power usage while maintaining optimal performance.

Address Bus Width: 26

Allows for a larger range of memory addresses, enabling more complex computing tasks.

Bit Size: 32

Higher capacity for processing data, suitable for modern computing needs.

Maximum Operating Temperature: 90 °C

Can withstand high temperatures, ensuring stability during operation.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microprocessor energy-efficient.

Maximum Clock Frequency: 54 MHz

Fast processing speed, suitable for demanding computing tasks.

Peripheral IC Type: MICROPROCESSOR, RISC

RISC architecture allows for simplified instructions, leading to efficient performance.

Speed: 1000 rpm

Works at high speeds, making it suitable for applications requiring quick data processing.

Technical Specifications

Microprocessors AM3703CBP100 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

26

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

54 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B515

JESD-609 Code:

e1

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

515

On Chip Data RAM Width:

8

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA515,28X28,16

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.1,1.8

Qualification:

Not Qualified

RAM Words:

65536

Maximum Seated Height:

.71 mm

Speed:

1000 rpm

Sub-Category:

Microprocessors

Maximum Supply Current:

740 mA

Maximum Supply Voltage:

1.2 V

Minimum Supply Voltage:

.9 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

12 mm

Peripheral IC Type:

Trade Compliance

AM3703CBP100 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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