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AM3703CUS100

Texas Instruments

AM3703CUS100 by Texas Instruments

AM3703CUS100 by Texas Instruments is a 32-bit microprocessor with integrated cache and 423 terminals. It operates at a max clock frequency of 54 MHz, suitable for low power applications in various industries like automotive and industrial automation. With a package style of grid array, it features an address bus width of 26 bits and on-chip data RAM width of 8 bits.

Median Price

$20.210

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 52 parts In-Stock

1+ parts

$8.078

100+ parts

$7.970

1k+ parts

$7.921

10k+ parts

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52

$8.078

$7.970

$7.921

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Verical

USA . 52 parts In-Stock

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$8.078

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52

$8.078

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Rochester

USA . 95 parts In-Stock

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$20.210

100+ parts

$19.810

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$19.400

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95

$20.210

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$19.400

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Chip1Stop

Japan . 52 parts In-Stock

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$20.400

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$20.400

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DigiKey

USA . 90 parts In-Stock

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$38.840

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$27.997

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$38.840

$27.997

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Distributors (In-Stock)

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Digiode

USA . 3,250 parts In-Stock

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$16.482

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$16.482

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Nova Conductors

Japan . 50 parts In-Stock

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$21.332

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$21.332

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Vyrian

USA . 4,512 parts In-Stock

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VNN

France . 773 parts In-Stock

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Chip Stock

USA . 163 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 19 parts In-Stock

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Distributors (Availability)

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$12.917

100+ parts

$11.754

1k+ parts

$10.592

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2,000

$12.917

$11.754

$10.592

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Corphita

USA . 535 parts In-Stock

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$15.615

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535

$15.615

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AZTECH Wire

Italy . 497 parts In-Stock

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$17.927

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497

$17.927

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Ampacity Inc.

Singapore . 48 parts In-Stock

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$22.260

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$22.260

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Parana Technologies

USA . 582 parts In-Stock

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$24.955

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$25.654

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582

$24.955

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$25.654

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DigiPath Technology Company

USA . 2,180 parts In-Stock

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$27.478

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$27.478

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ChromeModa Solutions

Germany . 1,740 parts In-Stock

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$28.039

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$22.992

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1,740

$28.039

$22.992

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IDEA Electronic Components Group

UK . 1,457 parts In-Stock

1+ parts

$28.039

100+ parts

$26.637

1k+ parts

$25.235

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1,457

$28.039

$26.637

$25.235

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Corohmni

South Africa . 45 parts In-Stock

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$45.518

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$45.518

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Alle Elektronik GmbH

Germany . 4,983 parts In-Stock

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Perfect Parts

USA . 2,165 parts In-Stock

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Kepictronics

USA . 605 parts In-Stock

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605

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Netroflash

USA . 100 parts In-Stock

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$20.905

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$20.265

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$19.838

100

-

$20.905

$20.265

$19.838

S.R.D Solutions

India . 100 parts In-Stock

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A-Z Elektronik GmbH

Germany . 100 parts In-Stock

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100

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Overview

Discover the cutting-edge AM3703CUS100 microprocessor by Texas Instruments, a top-tier manufacturer known for their quality and innovation. As a leader in the industry, Texas Instruments delivers superior products that excel in performance and reliability. The AM3703CUS100 is ideal for a wide range of applications due to its integrated cache and advanced features. Experience seamless operation and unparalleled efficiency with this powerful microprocessor. Upgrade your systems with the AM3703CUS100 and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable.

Integrated Cache: YES

Having integrated cache enhances the speed and efficiency of the microprocessor.

Maximum Supply Voltage: 1.2 V

The maximum supply voltage of 1.2V ensures efficient power consumption.

On Chip Data RAM Width: 8

Having a width of 8 for on-chip data RAM allows for fast data processing.

Address Bus Width: 26

A wider address bus width of 26 allows for a larger memory addressing range.

Package Shape: SQUARE

The square package shape makes it easy to integrate the microprocessor into different systems.

Bit Size: 32

With a bit size of 32, the microprocessor can handle complex calculations and data processing efficiently.

Power Supplies (V): 1.1,1.8

The availability of multiple power supply voltages allows for flexibility in power management.

No. of Terminals: 423

Having a large number of terminals provides ample connectivity options for external devices.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style allows for compact and space-saving installation.

Minimum Supply Voltage: 0.9 V

The low minimum supply voltage of 0.9V ensures energy efficiency in operation.

Maximum Operating Temperature: 90 °C

With a maximum operating temperature of 90°C, the microprocessor can function reliably even under high temperature conditions.

Minimum Operating Temperature: 0 °C

The ability to operate at low temperatures down to 0°C enables usage in various environments.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

The use of tin, silver, and copper as terminal finish materials ensures good conductivity and corrosion resistance.

Terminal Position: BOTTOM

Bottom terminal position simplifies the installation process and improves thermal management.

Maximum Seated Height: 1.4 mm

The low maximum seated height of 1.4mm allows for slim and compact device designs.

RAM Words: 65536

With a large number of RAM words, the microprocessor can store and process a significant amount of data.

Width: 16 mm

The compact width of 16mm enables easy integration into various equipment and systems.

Boundary Scan: YES

Having boundary scan capability allows for efficient testing and debugging of the microprocessor.

External Data Bus Width: 16

A data bus width of 16 facilitates high-speed data transfer between the microprocessor and external devices.

Maximum Clock Frequency: 54 MHz

The maximum clock frequency of 54MHz enables fast processing and execution of instructions.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C ensures reliable soldering during the manufacturing process.

Length: 16 mm

The compact length of 16mm contributes to the overall small form factor of the microprocessor.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC microprocessor, it offers enhanced performance and efficiency in executing instructions.

Technology: CMOS

Using CMOS technology allows for low power consumption and high-speed operation of the microprocessor.

Terminal Form: BALL

The ball terminal form provides reliable connections and ease of soldering during assembly.

Maximum Supply Current: 740 mA

Being able to operate at a maximum supply current of 740mA ensures stability and performance under load.

Nominal Supply Voltage: 1.1 V

The nominal supply voltage of 1.1V is optimal for efficient power utilization and performance.

Terminal Pitch: 0.65 mm

The small terminal pitch of 0.65mm allows for high-density mounting and space-saving designs.

Format: FLOATING POINT

The floating-point format enables precise numerical calculations and processing in scientific and engineering applications.

Moisture Sensitivity Level (MSL): 3

Having an MSL of 3 indicates good moisture resistance, ensuring reliability in various environmental conditions.

Speed: 1000 rpm

Operating at a speed of 1000rpm, the microprocessor can handle rapid data processing and transfer.

Low Power Mode: YES

The availability of a low power mode enhances energy efficiency and extends battery life in portable devices.

Technical Specifications

Microprocessors AM3703CUS100 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

26

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

54 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B423

JESD-609 Code:

e1

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

423

On Chip Data RAM Width:

8

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA423,24X24,25

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.1,1.8

Qualification:

Not Qualified

RAM Words:

65536

Maximum Seated Height:

1.4 mm

Speed:

1000 rpm

Sub-Category:

Microprocessors

Maximum Supply Current:

740 mA

Maximum Supply Voltage:

1.2 V

Minimum Supply Voltage:

.9 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

16 mm

Peripheral IC Type:

Trade Compliance

AM3703CUS100 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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