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AM3703CBP

Texas Instruments

AM3703CBP by Texas Instruments

AM3703CBP by Texas Instruments is a 32-bit microprocessor with integrated cache and a max clock frequency of 54 MHz. It is commonly used in applications requiring low power mode and floating point format, such as embedded systems and industrial automation.

Median Price

$19.875

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 8,565 parts In-Stock

1+ parts

$19.370

100+ parts

$18.980

1k+ parts

$18.600

10k+ parts

-

8,565

$19.370

$18.980

$18.600

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Chip1Stop

Japan . 168 parts In-Stock

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-

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$20.380

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168

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$20.380

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Distributors (In-Stock)

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Nova Conductors

Japan . 150 parts In-Stock

1+ parts

$25.239

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150

$25.239

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Vyrian

USA . 8,274 parts In-Stock

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8,274

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Digiode

USA . 2,950 parts In-Stock

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Chip Stock

USA . 2,600 parts In-Stock

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2,600

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TME

Poland . 1,176 parts In-Stock

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$19.880

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$19.880

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VNN

France . 100 parts In-Stock

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100

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Zilex Electronics Inc.

Canada . 50 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 357 parts In-Stock

1+ parts

$9.670

100+ parts

-

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357

$9.670

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Ampacity Inc.

Singapore . 168 parts In-Stock

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$17.320

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$17.320

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Netroflash

USA . 500 parts In-Stock

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$25.239

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$25.239

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Microchip USA

USA . 1,284 parts In-Stock

1+ parts

$58.050

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$57.040

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$56.530

10k+ parts

$56.030

1,284

$58.050

$57.040

$56.530

$56.030

Parana Technologies

USA . 2,160 parts In-Stock

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$66.372

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$66.372

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DigiPath Technology Company

USA . 259 parts In-Stock

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$73.084

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259

$73.084

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ChromeModa Solutions

Germany . 5,389 parts In-Stock

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$74.575

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$61.152

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$74.575

$61.152

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IDEA Electronic Components Group

UK . 1,561 parts In-Stock

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$74.575

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$70.846

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$67.118

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1,561

$74.575

$70.846

$67.118

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A-Z Elektronik GmbH

Germany . 7,208 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,805 parts In-Stock

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Corphita

USA . 4,540 parts In-Stock

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S.R.D Solutions

India . 3,000 parts In-Stock

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Kepictronics

USA . 2,000 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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Overview

Discover a world of possibilities with the AM3703CBP by Texas Instruments, the ultimate choice for high-quality microprocessors. With its cutting-edge technology and superior manufacturing, Texas Instruments ensures that every detail of the AM3703CBP is designed to perfection. This versatile device is suitable for a wide range of applications, offering unmatched performance and reliability. Experience the value and benefits it brings to your projects, with features like integrated cache, low power mode, and a wide variety of supply voltages. Say goodbye to limitations and unlock the true potential of your designs with the exceptional AM3703CBP.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microprocessor, ensuring long-lasting performance.

Integrated Cache: YES

Having integrated cache helps in improving the processing speed and efficiency of the microprocessor.

Maximum Supply Voltage: 1.2 V

Operating within this voltage range ensures safe and efficient power consumption.

Surface Mount: YES

Surface mount technology allows for easy installation and compact design of the microprocessor.

Address Bus Width: 26

Having a wider address bus width increases the memory addressing capability of the microprocessor.

Minimum Operating Temperature: 0 °C

With a low minimum operating temperature, this microprocessor can function in a variety of environments.

Technology: CMOS

CMOS technology helps in reducing power consumption and improving overall performance efficiency.

Maximum Clock Frequency: 54 MHz

A high clock frequency allows for faster processing speeds and better performance of the microprocessor.

Technical Specifications

Microprocessors AM3703CBP attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

26

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

54 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B515

JESD-609 Code:

e1

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

515

On Chip Data RAM Width:

8

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA515,28X28,16

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.1,1.8

Qualification:

Not Qualified

RAM Words:

65536

Maximum Seated Height:

.71 mm

Speed:

800 rpm

Sub-Category:

Microprocessors

Maximum Supply Current:

740 mA

Maximum Supply Voltage:

1.2 V

Minimum Supply Voltage:

.9 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

12 mm

Peripheral IC Type:

Trade Compliance

AM3703CBP Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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