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AM3703CUSNEST

Texas Instruments

AM3703CUSNEST by Texas Instruments

AM3703CUSNEST by Texas Instruments is a 32-bit microprocessor with integrated cache and 16-bit external data bus width. It operates at a max clock frequency of 54 MHz, suitable for low power mode applications in various industries. The package style is grid array, low profile, fine pitch, making it ideal for compact designs requiring high processing speeds.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,933 parts In-Stock

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4,933

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Digiode

USA . 1,561 parts In-Stock

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1,561

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Distributors (Availability)

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One Stop Electronics

USA . 883 parts In-Stock

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$1.000

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883

$1.000

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AZTECH Wire

Italy . 312 parts In-Stock

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$7.657

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312

$7.657

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Parana Technologies

USA . 2,098 parts In-Stock

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$66.908

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2,098

$66.908

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ChromeModa Solutions

Germany . 2,651 parts In-Stock

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$75.177

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$61.645

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2,651

$75.177

$61.645

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IDEA Electronic Components Group

UK . 2,352 parts In-Stock

1+ parts

$75.177

100+ parts

$71.418

1k+ parts

$67.659

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2,352

$75.177

$71.418

$67.659

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Native Components

USA . 861 parts In-Stock

1+ parts

$81.752

100+ parts

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$78.482

861

$81.752

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$78.482

Northwest PG Solutions

USA . 603 parts In-Stock

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$89.927

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603

$89.927

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DigiPath Technology Company

USA . 1,794 parts In-Stock

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$67.780

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$67.780

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Corphita

USA . 826 parts In-Stock

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826

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Overview

Unleash the power of innovation with the AM3703CUSNEST by Texas Instruments, a cutting-edge microprocessor that redefines efficiency and performance. Manufactured with precision and expertise, this product boasts integrated cache, surface mount capability, and a wide range of applications in various industries. Offering unmatched value and benefits to customers, this microprocessor delivers superior speed, reliability, and versatility without compromise. Elevate your projects to new heights with the AM3703CUSNEST and experience a world of possibilities at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used in microprocessors for its durability and cost-effectiveness.

Integrated Cache: YES

Having an integrated cache improves the performance of the microprocessor by reducing memory access times.

Surface Mount: YES

Surface mount technology allows for easy and cost-effective assembly of the microprocessor onto a circuit board.

Maximum Supply Voltage: 1.2 V

Operating at a low maximum supply voltage helps in reducing power consumption and heat generation.

Address Bus Width: 26

A wider address bus width allows the microprocessor to access a larger range of memory locations, improving overall performance.

Package Shape: SQUARE

Square package shape helps in efficient space utilization on the circuit board and aids in thermal management.

Bit Size: 32

A 32-bit microprocessor is capable of handling larger chunks of data at a time, enhancing computational efficiency.

No. of Terminals: 423

Having a high number of terminals allows for more connectivity options and functionality in the microprocessor.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This package style offers high density mounting, low profile design, and fine pitch for improved electrical performance.

Minimum Supply Voltage: 0.9 V

The ability to operate at a low minimum supply voltage enables energy-efficient operation of the microprocessor.

Maximum Operating Temperature: 90 °C

Being able to operate at high temperatures makes the microprocessor suitable for demanding industrial applications.

Minimum Operating Temperature: 0 °C

The microprocessor can function even in cold environments, making it versatile in various operating conditions.

Terminal Finish: TIN SILVER COPPER

This terminal finish provides good conductivity, corrosion resistance, and solderability for reliable connections.

Terminal Position: BOTTOM

Bottom terminal position aids in better thermal dissipation and ease of PCB layout design.

Maximum Seated Height: 1.4 mm

Low seated height allows for compact integration of the microprocessor into space-constrained devices.

Width: 16 mm

Compact width dimension enables the microprocessor to be used in small form factor applications.

Boundary Scan: YES

Boundary scan capability allows for efficient testing and debugging of the microprocessor during manufacturing.

External Data Bus Width: 16

A wider external data bus width enables faster data transfers between the microprocessor and external components.

Maximum Clock Frequency: 54 MHz

Operating at a high clock frequency enhances the processing speed and performance of the microprocessor.

Maximum Time At Peak Reflow Temperature (s): 30

This specification ensures that the microprocessor can withstand peak reflow temperatures for a sufficient duration during manufacturing.

Peak Reflow Temperature °C: 260

The microprocessor is designed to withstand high peak reflow temperatures during the assembly process.

Length: 16 mm

Compact length dimension enables the microprocessor to be used in space-constrained applications.

Peripheral IC Type: MICROPROCESSOR, RISC

A RISC architecture microprocessor is known for its simplicity and efficiency in executing instructions quickly.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microprocessor efficient and reliable.

Terminal Form: BALL

Ball terminal form facilitates easy soldering and connection of the microprocessor to the PCB.

Nominal Supply Voltage: 1.1 V

Operating at a nominal supply voltage of 1.1 V balances power efficiency and performance in the microprocessor.

Terminal Pitch: 0.65 mm

The small terminal pitch allows for a high density of terminals, enabling more functionality in a compact package.

Format: FLOATING POINT

Having floating-point capability enhances the microprocessor's ability to handle complex mathematical operations.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates that the microprocessor can withstand exposure to moderate levels of moisture during storage and handling.

Speed: 800 rpm

Operating at a speed of 800 rpm makes the microprocessor suitable for high-performance computing and data processing tasks.

Low Power Mode: YES

The low power mode feature helps in conserving energy and extending the battery life of devices using the microprocessor.

Technical Specifications

Microprocessors AM3703CUSNEST attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

26

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

54 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B423

JESD-609 Code:

e1

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

423

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.4 mm

Speed:

800 rpm

Maximum Supply Voltage:

1.2 V

Minimum Supply Voltage:

.9 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Trade Compliance

AM3703CUSNEST Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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