Loading...

AM3715CBP

Texas Instruments

AM3715CBP by Texas Instruments

AM3715CBP by Texas Instruments is a 32-bit microprocessor with integrated cache and 26-bit address bus width. It operates at a max clock frequency of 54 MHz, making it suitable for high-speed applications. With low power mode enabled, this CMOS technology-based processor is ideal for power-efficient devices in various industries.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,779 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,779

-

-

-

-

Digiode

USA . 3,378 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,378

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,170 parts In-Stock

1+ parts

$5.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,170

$5.000

-

-

-

AZTECH Wire

Italy . 378 parts In-Stock

1+ parts

$15.266

100+ parts

-

1k+ parts

-

10k+ parts

-

378

$15.266

-

-

-

Parana Technologies

USA . 1,106 parts In-Stock

1+ parts

$20.824

100+ parts

-

1k+ parts

$20.993

10k+ parts

-

1,106

$20.824

-

$20.993

-

DigiPath Technology Company

USA . 872 parts In-Stock

1+ parts

$22.930

100+ parts

$21.096

1k+ parts

-

10k+ parts

-

872

$22.930

$21.096

-

-

ChromeModa Solutions

Germany . 6,884 parts In-Stock

1+ parts

$23.398

100+ parts

$19.186

1k+ parts

-

10k+ parts

-

6,884

$23.398

$19.186

-

-

IDEA Electronic Components Group

UK . 449 parts In-Stock

1+ parts

$23.398

100+ parts

$22.228

1k+ parts

$21.058

10k+ parts

-

449

$23.398

$22.228

$21.058

-

One Stop Electronics

USA . 1,042 parts In-Stock

1+ parts

$29.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,042

$29.000

-

-

-

Microchip USA

USA . 1,410 parts In-Stock

1+ parts

$79.330

100+ parts

$77.950

1k+ parts

$77.260

10k+ parts

$76.570

1,410

$79.330

$77.950

$77.260

$76.570

Component Stockers USA

USA . 490 parts In-Stock

1+ parts

$99.990

100+ parts

-

1k+ parts

-

10k+ parts

-

490

$99.990

-

-

-

Lixinc

USA . 11,012 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

11,012

-

-

-

-

A-Z Elektronik GmbH

Germany . 6,297 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,297

-

-

-

-

Alle Elektronik GmbH

Germany . 4,198 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,198

-

-

-

-

Corphita

USA . 2,355 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,355

-

-

-

-

Northwest PG Solutions

USA . 1,022 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,022

-

-

-

-

Native Components

USA . 862 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

862

-

-

-

-

Kepictronics

USA . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

500

-

-

-

-

Overview

Elevate your projects with the AM3715CBP microprocessor by Texas Instruments. Known for their top-notch quality and innovative technology, Texas Instruments delivers unmatched performance in the realm of microprocessors. Ideal for a wide range of applications, this versatile chip offers integrated cache, low power mode, and boundary scan capabilities. With a maximum clock frequency of 54 MHz and a width of only 12mm, the AM3715CBP provides exceptional value and efficiency to customers looking to elevate their designs. Trust in Texas Instruments to deliver cutting-edge solutions for all your microprocessor needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic and epoxy material used in the package body provides durability and protection to the microprocessor.

Integrated Cache: YES

Having integrated cache improves the overall performance and speed of the microprocessor.

Maximum Supply Voltage: 1.2 V

The maximum supply voltage of 1.2V ensures efficient power usage while maintaining optimal performance.

On Chip Data RAM Width: 8

The wide on-chip data RAM width of 8 enhances the processing capability and efficiency of the microprocessor.

Address Bus Width: 26

The large address bus width of 26 allows for efficient data transfer and communication within the microprocessor.

Package Shape: SQUARE

The square package shape helps in easy and compact integration of the microprocessor into various electronic devices.

Bit Size: 32

With a bit size of 32, the microprocessor can handle a wide range of data processing tasks efficiently.

Power Supplies (V): 1.1, 1.8

Having multiple power supply options allows for flexibility in usage depending on power requirements.

No. of Terminals: 515

The high number of terminals enables seamless connectivity and integration of the microprocessor into electronic circuits.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The advanced package style of grid array, thin profile, and fine pitch enhances electrical performance and thermal management of the microprocessor.

Minimum Supply Voltage: 0.9 V

The low minimum supply voltage requirement of 0.9V ensures energy efficiency and reduced power consumption.

Maximum Operating Temperature: 90 °C

The high maximum operating temperature of 90°C allows for reliable performance even in elevated temperature environments.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature requirement of 0°C ensures the microprocessor can function in a wide range of temperature conditions.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

The terminal finish of tin, silver, and copper provides excellent conductivity and reliability in electrical connections.

Terminal Position: BOTTOM

The bottom terminal position facilitates easy installation and connection of the microprocessor in electronic circuits.

Maximum Seated Height: 0.71 mm

The low maximum seated height of 0.71mm allows for compact and slim design applications.

RAM Words: 65536

The high RAM word capacity of 65536 enhances memory storage and data processing capabilities of the microprocessor.

Width: 12 mm

The slim width of 12mm enables easy integration and placement of the microprocessor in various electronic devices.

Boundary Scan: YES

Having boundary scan capability allows for efficient testing and debugging of the microprocessor during development and production stages.

External Data Bus Width: 16

The wide external data bus width of 16 enables fast data transfer and communication with external devices.

Maximum Clock Frequency: 54 MHz

The high maximum clock frequency of 54MHz allows for rapid data processing and overall performance of the microprocessor.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C ensures reliable soldering and assembly of the microprocessor.

Length: 12 mm

The compact length of 12mm enables space-saving design in electronic applications.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC (Reduced Instruction Set Computing) microprocessor enhances the efficiency and speed of data processing tasks.

Technology: CMOS

The CMOS technology used in the microprocessor provides low power consumption and high speed performance.

Terminal Form: BALL

The terminal form of ball ensures easy and secure connections with other electronic components.

Maximum Supply Current: 740 mA

The maximum supply current of 740mA allows for sufficient power delivery to the microprocessor for optimal performance.

Nominal Supply Voltage: 1.1 V

The nominal supply voltage of 1.1V ensures stable and consistent power supply to the microprocessor.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5mm enables high-density packaging and efficient connection layout.

Format: FLOATING POINT

The floating-point format enhances numerical accuracy and precision in mathematical calculations performed by the microprocessor.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level of 3 indicates the resistance of the microprocessor to moisture during storage and operation.

Speed: 800 rpm

The high speed of 800rpm allows for quick data processing and execution of tasks by the microprocessor.

Low Power Mode: YES

Having a low power mode option provides energy efficiency and extends the battery life of devices powered by the microprocessor.

Technical Specifications

Microprocessors AM3715CBP attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

26

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

54 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B515

JESD-609 Code:

e1

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

515

On Chip Data RAM Width:

8

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA515,28X28,16

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.1,1.8

Qualification:

Not Qualified

RAM Words:

65536

Maximum Seated Height:

.71 mm

Speed:

800 rpm

Sub-Category:

Microprocessors

Maximum Supply Current:

740 mA

Maximum Supply Voltage:

1.2 V

Minimum Supply Voltage:

.9 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

12 mm

Peripheral IC Type:

Trade Compliance

AM3715CBP Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 19