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AM3703CUS

Texas Instruments

AM3703CUS by Texas Instruments

AM3703CUS by Texas Instruments is a 32-bit microprocessor with 8-bit data RAM width and 26-bit address bus width. It operates at a max clock frequency of 54 MHz, suitable for low power applications in various industries like automotive and consumer electronics. The package style is grid array, low profile, fine pitch with a terminal pitch of 0.65 mm.

Median Price

$32.100

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 895 parts In-Stock

1+ parts

$16.840

100+ parts

$16.500

1k+ parts

$16.170

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895

$16.840

$16.500

$16.170

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Mouser Electronics

USA . 89 parts In-Stock

1+ parts

$32.100

100+ parts

$24.120

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$23.750

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89

$32.100

$24.120

$23.750

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DigiKey

USA . 80 parts In-Stock

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$32.100

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80

$32.100

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Distributors (In-Stock)

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Digiode

USA . 3,696 parts In-Stock

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$17.898

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3,696

$17.898

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Vyrian

USA . 2,138 parts In-Stock

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Chip Stock

USA . 783 parts In-Stock

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Bristol Electronics

USA . 3 parts In-Stock

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Atlantic Semiconductor

USA . 3 parts In-Stock

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Distributors (Availability)

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Native Components

USA . 900 parts In-Stock

1+ parts

$0.187

100+ parts

-

1k+ parts

-

10k+ parts

$0.179

900

$0.187

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-

$0.179

Northwest PG Solutions

USA . 789 parts In-Stock

1+ parts

$0.206

100+ parts

-

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10k+ parts

$0.181

789

$0.206

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$0.181

Corphita

USA . 1,237 parts In-Stock

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$16.956

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$16.956

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Parana Technologies

USA . 651 parts In-Stock

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$47.130

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651

$47.130

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DigiPath Technology Company

USA . 999 parts In-Stock

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$51.896

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$47.744

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999

$51.896

$47.744

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IDEA Electronic Components Group

UK . 1,980 parts In-Stock

1+ parts

$52.955

100+ parts

$50.307

1k+ parts

$47.660

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1,980

$52.955

$50.307

$47.660

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ChromeModa Solutions

Germany . 195 parts In-Stock

1+ parts

$52.955

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$43.423

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195

$52.955

$43.423

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Microchip USA

USA . 1,928 parts In-Stock

1+ parts

$64.080

100+ parts

$62.960

1k+ parts

$62.410

10k+ parts

$61.850

1,928

$64.080

$62.960

$62.410

$61.850

Lixinc

USA . 7,508 parts In-Stock

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7,508

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A-Z Elektronik GmbH

Germany . 5,894 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,929 parts In-Stock

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3,929

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Futuretech Components

Singapore . 1,680 parts In-Stock

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1,680

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Kepictronics

USA . 69 parts In-Stock

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Overview

Discover the ultimate solution for your microprocessor needs with the AM3703CUS by Texas Instruments. This high-quality product offers integrated cache, 32-bit processing power, and a wide range of applications in a compact package. With a maximum clock frequency of 54 MHz and low power mode capabilities, this microprocessor provides incredible value and benefits to customers looking for reliable performance and efficiency. Trust in Texas Instruments' reputation for excellence and elevate your projects with the AM3703CUS.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the microprocessor, making it suitable for various applications.

Integrated Cache: YES

Having an integrated cache enhances the performance and efficiency of the microprocessor, allowing for faster data access.

Maximum Supply Voltage: 1.2 V

The low maximum supply voltage helps in reducing power consumption and heat generation.

On Chip Data RAM Width: 8

A wider data RAM width allows for processing larger amounts of data simultaneously, improving overall performance.

Address Bus Width: 26

With a wider address bus width, more memory locations can be accessed, increasing the versatility of the microprocessor.

Package Shape: SQUARE

The square package shape helps in easy integration and placement of the microprocessor on a circuit board.

Bit Size: 32

A 32-bit architecture enables faster data processing and calculations, making the microprocessor suitable for complex tasks.

Power Supplies (V): 1.1,1.8

Having multiple power supply options allows for flexibility in designing electronic systems using this microprocessor.

No. of Terminals: 423

A higher number of terminals provide more connectivity options, enabling the microprocessor to interact with various other components.

Minimum Supply Voltage: 0.9 V

The low minimum supply voltage ensures that the microprocessor can operate efficiently even at lower power levels.

Maximum Operating Temperature: 90 °C

The high maximum operating temperature range allows the microprocessor to function in demanding environmental conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures that the microprocessor can be used in a wide range of temperature environments.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

This terminal finish provides good conductivity and corrosion resistance, ensuring long-term reliability of the microprocessor.

Terminal Position: BOTTOM

Having terminals positioned at the bottom simplifies the installation and connection process of the microprocessor.

Maximum Seated Height: 1.4 mm

The low seated height allows for a compact design, making this microprocessor suitable for space-constrained applications.

RAM Words: 65536

With a large number of RAM words, the microprocessor can store and process extensive data efficiently.

Width: 16 mm

The compact width of the microprocessor enables it to be easily integrated into various electronic devices and systems.

Boundary Scan: YES

Having boundary scan capability allows for efficient testing and debugging of the microprocessor during development and production.

External Data Bus Width: 16

A wide external data bus width facilitates faster data transfer between the microprocessor and other components, enhancing overall system performance.

Maximum Clock Frequency: 54 MHz

The high maximum clock frequency enables fast processing speeds, making the microprocessor suitable for high-performance applications.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC-based microprocessor, it offers efficient instruction execution and improved performance for a wide range of applications.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making the microprocessor energy-efficient and reliable.

Terminal Form: BALL

The ball terminal form allows for easy soldering and connection of the microprocessor, ensuring reliable electrical contact.

Maximum Supply Current: 740 mA

The moderate maximum supply current requirement ensures efficient power usage and prevents overheating of the microprocessor.

Nominal Supply Voltage: 1.1 V

Having a stable nominal supply voltage ensures consistent and reliable performance of the microprocessor in various operating conditions.

Terminal Pitch: 0.65 mm

The small terminal pitch allows for high-density mounting and efficient use of space on a circuit board.

Format: FLOATING POINT

The floating-point format enables precise and efficient handling of decimal numbers in mathematical calculations, enhancing the microprocessor's versatility.

Moisture Sensitivity Level (MSL): 3

Having a moderate moisture sensitivity level ensures that the microprocessor can withstand normal exposure to humidity without damaging its functionality.

Speed: 800 rpm

The high speed of the microprocessor allows for quick data processing and execution of instructions, making it suitable for time-sensitive applications.

Low Power Mode: YES

The low power mode option helps in conserving energy and extending the battery life of devices powered by this microprocessor.

Technical Specifications

Microprocessors AM3703CUS attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

26

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

54 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B423

JESD-609 Code:

e1

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

423

On Chip Data RAM Width:

8

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA423,24X24,25

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.1,1.8

Qualification:

Not Qualified

RAM Words:

65536

Maximum Seated Height:

1.4 mm

Speed:

800 rpm

Sub-Category:

Microprocessors

Maximum Supply Current:

740 mA

Maximum Supply Voltage:

1.2 V

Minimum Supply Voltage:

.9 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

16 mm

Peripheral IC Type:

Trade Compliance

AM3703CUS Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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