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TMS75C00NL

Texas Instruments

TMS75C00NL by Texas Instruments

TMS75C00NL by Texas Instruments is a CMOS data encryption circuit with operating temperatures ranging from 0°C to 70°C. It features a dual terminal position in an in-line plastic/epoxy package, suitable for telecom applications requiring secure data transmission.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 4,717 parts In-Stock

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Digiode

USA . 3,077 parts In-Stock

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Mentor Electronics Marketing, LLC

USA . 8 parts In-Stock

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AZTECH Wire

Italy . 660 parts In-Stock

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$10.064

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Parana Technologies

USA . 2,175 parts In-Stock

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$10.993

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$11.453

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$10.993

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DigiPath Technology Company

USA . 1,388 parts In-Stock

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$12.105

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$11.137

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$12.105

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ChromeModa Solutions

Germany . 4,316 parts In-Stock

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$12.352

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$10.129

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IDEA Electronic Components Group

UK . 487 parts In-Stock

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$12.352

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$11.734

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$11.117

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487

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One Stop Electronics

USA . 1,203 parts In-Stock

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Corphita

USA . 2,831 parts In-Stock

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Overview

Enhance the security of your telecommunications systems with the TMS75C00NL by Texas Instruments. Known for their superior quality and reliability, Texas Instruments offers a wide range of innovative solutions in the field of encryption ICs. The TMS75C00NL is a standout product in this category, providing top-notch protection for your data transmissions. Its robust design and advanced technology ensure maximum security, while its user-friendly features make it easy to integrate into your systems. Trust Texas Instruments to deliver cutting-edge solutions that meet your encryption needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and light-weight, making it ideal for portable telecommunication devices.

Package Style (Meter): IN-LINE

The in-line package style allows for easy integration into existing telecom setups, saving space and facilitating efficient data encryption.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this encryption IC can withstand high temperatures in various telecom environments.

Minimum Operating Temperature: 0 °C

The ability to operate at 0°C ensures reliable performance even in cold climates or low-temperature conditions.

Terminal Position: DUAL

The dual terminal position allows for versatile connectivity options, making it compatible with a wide range of telecom devices.

Temperature Grade: COMMERCIAL

Being rated for commercial temperature range ensures that this encryption IC can be used in normal office or commercial settings without any issues.

Technology: CMOS

The CMOS technology used in this IC ensures low power consumption and high speed, making it efficient for data encryption in telecom applications.

Terminal Form: THROUGH-HOLE

The through-hole terminal form provides secure and reliable connections, reducing the risk of signal interference or data loss during encryption.

Telecom IC Type: DATA ENCRYPTION CIRCUIT

This encryption IC is specifically designed for data encryption in telecom networks, ensuring secure and reliable communication between devices.

Technical Specifications

Telecom - Encryption ICs TMS75C00NL attributes and parameters. Explore more Telecom - Encryption ICs devices from Texas Instruments

Specs

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP(UNSPEC)

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Sub-Category:

Telecom Encryption Circuits

Surface Mount:

NO

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Position:

DUAL

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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