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TMS75C00FNL

Texas Instruments

TMS75C00FNL by Texas Instruments

TMS75C00FNL by Texas Instruments is a CMOS Telecom IC with data encryption circuit. It operates b/w 0-70°C, in a quad terminal style chip carrier package. Ideal for secure communication applications requiring surface mount technology.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,211 parts In-Stock

1+ parts

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3,211

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Digiode

USA . 66 parts In-Stock

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66

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 511 parts In-Stock

1+ parts

$11.331

100+ parts

-

1k+ parts

$11.762

10k+ parts

-

511

$11.331

-

$11.762

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DigiPath Technology Company

USA . 1,421 parts In-Stock

1+ parts

$12.476

100+ parts

$11.478

1k+ parts

-

10k+ parts

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1,421

$12.476

$11.478

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ChromeModa Solutions

Germany . 4,415 parts In-Stock

1+ parts

$12.731

100+ parts

$10.439

1k+ parts

-

10k+ parts

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4,415

$12.731

$10.439

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IDEA Electronic Components Group

UK . 743 parts In-Stock

1+ parts

$12.731

100+ parts

$12.094

1k+ parts

$11.458

10k+ parts

-

743

$12.731

$12.094

$11.458

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AZTECH Wire

Italy . 888 parts In-Stock

1+ parts

$17.200

100+ parts

-

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888

$17.200

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One Stop Electronics

USA . 305 parts In-Stock

1+ parts

$223.000

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305

$223.000

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Corphita

USA . 2,590 parts In-Stock

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2,590

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Overview

Unlock the power of secure communication with the TMS75C00FNL by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality encryption ICs for telecom applications. The TMS75C00FNL offers unrivaled protection for your data, ensuring peace of mind for your business. With its advanced technology and reliable performance, this chip carrier package is ideal for a wide range of commercial applications. Trust Texas Instruments to provide you with the tools you need to stay ahead in today's digital world.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection for the internal components, ensuring reliability and durability.

Surface Mount: YES

This feature allows for easy and convenient installation on PCBs, saving space and reducing assembly time.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers high density and good heat dissipation, making it suitable for high-performance applications.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, this product can withstand demanding operating conditions without compromising performance.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures that the product can function reliably even in colder environments.

Terminal Position: QUAD

The quad terminal position allows for easy and secure connections, enhancing the overall reliability of the product.

Temperature Grade: COMMERCIAL

This temperature grade is suitable for commercial applications, offering a good balance between performance and cost.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making this product energy-efficient and reliable.

Terminal Form: J BEND

The J bend terminal form offers mechanical stability and easy soldering, ensuring secure connections and longevity.

Telecom IC Type: DATA ENCRYPTION CIRCUIT

As a data encryption circuit, this product ensures secure communication and data protection, making it an essential component for telecom applications.

Technical Specifications

Telecom - Encryption ICs TMS75C00FNL attributes and parameters. Explore more Telecom - Encryption ICs devices from Texas Instruments

Specs

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC(UNSPEC)

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Sub-Category:

Telecom Encryption Circuits

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Position:

QUAD

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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