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HCS300-I/SNVAO

Microchip Technology

HCS300-I/SNVAO by Microchip Technology

HCS300-I/SNVAO by Microchip: Telecom IC for data encryption. Features 8 terminals, operates b/w -40 to 85°C. Small outline package with matte tin finish, suitable for industrial applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,664 parts In-Stock

1+ parts

-

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1k+ parts

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6,664

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Nova Conductors

Japan . 300 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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300

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 6,375 parts In-Stock

1+ parts

$1.560

100+ parts

$1.521

1k+ parts

$1.513

10k+ parts

-

6,375

$1.560

$1.521

$1.513

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Ampacity Inc.

Singapore . 6,664 parts In-Stock

1+ parts

$3.400

100+ parts

-

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6,664

$3.400

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Corohmni

South Africa . 199 parts In-Stock

1+ parts

$10.132

100+ parts

-

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199

$10.132

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Aztec Data Supply Inc.

USA . 4,625 parts In-Stock

1+ parts

$12.590

100+ parts

-

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10k+ parts

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4,625

$12.590

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-

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Marpe Global Electronics

Taiwan . 8,159 parts In-Stock

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8,159

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Continental Prestige Electronics

USA . 6,729 parts In-Stock

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6,729

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QualityLine Systems

Poland . 4,567 parts In-Stock

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4,567

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Argo Parts USA

USA . 4,023 parts In-Stock

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4,023

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XL Components Corporation

Australia . 1,019 parts In-Stock

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1,019

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Bastille Electronics

Australia . 100 parts In-Stock

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100

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Overview

Enhance the security of your telecom systems with the HCS300-I/SNVAO from Microchip Technology. This high-quality encryption IC offers unparalleled protection for your data, ensuring peace of mind for your business. With its reliable manufacturer and industrial-grade temperature range, this small outline package is perfect for a wide range of applications. Trust in the value and benefits that Microchip Technology brings to the table, and invest in the superior performance of the HCS300-I/SNVAO for your encryption needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to impact, making this product suitable for harsh environments.

Surface Mount: YES

Being surface mountable allows for easy installation on circuit boards, saving space and making for a more efficient design.

Screening Level: TS 16949

TS 16949 screening level ensures high quality standards and reliability, making this product ideal for critical applications.

No. of Terminals: 8

Having 8 terminals provides ample connectivity options, allowing for versatile integration into different systems.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this product can withstand elevated temperatures, ensuring reliable performance under demanding conditions.

Telecom IC Type: DATA ENCRYPTION CIRCUIT

The data encryption circuit type enhances the security features of this product, making it a suitable choice for ensuring secure communication in telecom applications.

Technical Specifications

Telecom - Encryption ICs HCS300-I/SNVAO attributes and parameters. Explore more Telecom - Encryption ICs devices from Microchip Technology

Specs

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Screening Level:

TS 16949

Maximum Seated Height:

1.75 mm

Maximum Supply Current:

2.5 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

HCS300-I/SNVAO Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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