Loading...

HCS365I/SM

Microchip Technology

HCS365I/SM by Microchip Technology

HCS365I/SM by Microchip: Telecom IC for data encryption. Features 8 terminals, operates b/w -40 to 85°C. Small outline package with matte tin finish, ideal for secure communication applications.

Median Price

$2.336

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$2.336

100+ parts

-

1k+ parts

-

10k+ parts

-

100

$2.336

-

-

-

Vyrian

USA . 6,910 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,910

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aranea Global

USA . 100 parts In-Stock

1+ parts

$2.289

100+ parts

-

1k+ parts

$2.197

10k+ parts

-

100

$2.289

-

$2.197

-

Continental Prestige Electronics

USA . 5,778 parts In-Stock

1+ parts

$2.336

100+ parts

-

1k+ parts

-

10k+ parts

$2.289

5,778

$2.336

-

-

$2.289

Argo Parts USA

USA . 4,164 parts In-Stock

1+ parts

$2.336

100+ parts

-

1k+ parts

-

10k+ parts

-

4,164

$2.336

-

-

-

AZTECH Wire

Italy . 674 parts In-Stock

1+ parts

$5.898

100+ parts

-

1k+ parts

-

10k+ parts

-

674

$5.898

-

-

-

Corohmni

South Africa . 837 parts In-Stock

1+ parts

$10.684

100+ parts

-

1k+ parts

-

10k+ parts

-

837

$10.684

-

-

-

Aztec Data Supply Inc.

USA . 3,687 parts In-Stock

1+ parts

$10.710

100+ parts

-

1k+ parts

-

10k+ parts

-

3,687

$10.710

-

-

-

Microchip USA

USA . 2,427 parts In-Stock

1+ parts

$15.210

100+ parts

-

1k+ parts

-

10k+ parts

-

2,427

$15.210

-

-

-

Semicontronic

India . 513 parts In-Stock

1+ parts

$302.000

100+ parts

$294.450

1k+ parts

$292.940

10k+ parts

-

513

$302.000

$294.450

$292.940

-

Ampacity Inc.

Singapore . 862 parts In-Stock

1+ parts

$402.000

100+ parts

-

1k+ parts

-

10k+ parts

-

862

$402.000

-

-

-

West Coast Incorporated

USA . 8,183 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,183

-

-

-

-

Overview

Enhance the security of your telecom systems with the HCS365I/SM by Microchip Technology. With a focus on quality and innovation, Microchip Technology is a trusted manufacturer in the industry. This small outline rectangular package features 8 terminals and a matte tin finish, making it ideal for data encryption circuits in telecommunications. Experience peace of mind knowing that your sensitive information is protected with this reliable and high-performance solution. Upgrade your telecom systems today with the HCS365I/SM.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for applications in the telecom industry where portability and reliability are important.

Surface Mount: YES

Being surface mountable, the product can be easily integrated into PCB designs, saving space and facilitating automated assembly processes.

No. of Terminals: 8

The 8 terminals provide enough connectivity options for the product to interface with other components, enabling seamless integration within telecom systems.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, the product can withstand harsh environmental conditions commonly encountered in telecom applications.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V allows the product to be easily powered using standard power sources, making it convenient for telecom applications.

Technical Specifications

Telecom - Encryption ICs HCS365I/SM attributes and parameters. Explore more Telecom - Encryption ICs devices from Microchip Technology

Specs

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

5.28 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

2.03 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

5.21 mm

Trade Compliance

HCS365I/SM Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20