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HCS101/P

Microchip Technology

HCS101/P by Microchip Technology

HCS101/P by Microchip Technology is a Telecom IC for data encryption circuits. It operates at 0-70°C with a supply voltage of 5V. This rectangular package has 8 terminals, matte tin finish, and measures 7.62mm in width, making it ideal for secure communication applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,342 parts In-Stock

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R&J Components

USA . 535 parts In-Stock

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535

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Nova Conductors

Japan . 500 parts In-Stock

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500

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Distributors (Availability)

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Corohmni

South Africa . 205 parts In-Stock

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$6.006

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205

$6.006

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AZTECH Wire

Italy . 252 parts In-Stock

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$12.666

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$12.666

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Aztec Data Supply Inc.

USA . 1,878 parts In-Stock

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$13.216

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$13.216

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Ampacity Inc.

Singapore . 985 parts In-Stock

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$24.000

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985

$24.000

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Component Stockers USA

USA . 291 parts In-Stock

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$99.990

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291

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Kepictronics

USA . 25,838 parts In-Stock

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QualityLine Systems

Poland . 7,742 parts In-Stock

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XL Components Corporation

Australia . 5,213 parts In-Stock

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Argo Parts USA

USA . 4,467 parts In-Stock

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Marpe Global Electronics

Taiwan . 4,255 parts In-Stock

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Continental Prestige Electronics

USA . 2,314 parts In-Stock

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Microchip USA

USA . 1,212 parts In-Stock

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Perfect Parts

USA . 599 parts In-Stock

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599

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Bastille Electronics

Australia . 100 parts In-Stock

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Overview

Unlock a world of secure communication with the HCS101/P by Microchip Technology. Designed for Telecom - Encryption ICs, this data encryption circuit offers unparalleled quality and reliability that only a trusted manufacturer like Microchip Technology can provide. With its compact rectangular design and dual-terminal position, this encryption IC ensures seamless integration into your systems. Safeguard your data with ease, knowing that the HCS101/P operates at temperatures between 0 to 70°C, making it ideal for a wide range of applications. Experience peace of mind and superior protection with the HCS101/P from Microchip Technology.

Feature Benefit Bullets

Package Body Material

PLASTIC/EPOXY - Provides durability and protection for the IC, making it suitable for a wide range of applications.

Package Shape

RECTANGULAR - Offers a standard shape that is easy to handle and fit into circuit designs.

No. of Terminals

8 - Provides sufficient connections for interfacing with other components in a system.

Package Style (Meter)

IN-LINE - Enables easy integration into existing circuits or systems with minimal space requirements.

Maximum Operating Temperature

70 °C - Ensures reliable performance in varying environmental conditions.

Minimum Operating Temperature

0 °C - Provides flexibility for use in different climate settings.

Terminal Finish

MATTE TIN - Offers reliable electrical connections and corrosion resistance for longevity.

Terminal Position

DUAL - Facilitates secure and stable mounting of the IC onto the PCB.

Maximum Seated Height

4.32 mm - Allows for a compact and efficient layout in the overall system design.

Width

7.62 mm - Contributes to a space-saving footprint for dense circuit layouts.

Length

9.46 mm - Offers a balanced size that is suitable for various applications.

Temperature Grade

COMMERCIAL - Indicates compatibility with standard operating conditions in commercial settings.

Terminal Form

THROUGH-HOLE - Enables easy soldering and secure connections to the PCB.

Telecom IC Type

DATA ENCRYPTION CIRCUIT - Provides advanced encryption capabilities to safeguard data transmission.

Nominal Supply Voltage

5 V - Supports common voltage requirements in telecom applications.

Terminal Pitch

2.54 mm - Allows for easy routing of traces and connections on the PCB layout.

Technical Specifications

Telecom - Encryption ICs HCS101/P attributes and parameters. Explore more Telecom - Encryption ICs devices from Microchip Technology

Specs

JESD-30 Code:

R-PDIP-T8

JESD-609 Code:

e3

Length:

9.46 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

4.32 mm

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

HCS101/P Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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