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TMS7500NL

Texas Instruments

TMS7500NL by Texas Instruments

TMS7500NL by Texas Instruments is a MOS technology-based Telecom IC for data encryption circuits. It operates b/w 0°C to 70°C, with dual terminals in an in-line package style. Ideal for commercial applications requiring secure data transmission.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,254 parts In-Stock

1+ parts

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9,254

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Digiode

USA . 135 parts In-Stock

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135

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,120 parts In-Stock

1+ parts

$12.243

100+ parts

$1,136.933

1k+ parts

$11.019

10k+ parts

-

2,120

$12.243

$1,136.933

$11.019

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DigiPath Technology Company

USA . 973 parts In-Stock

1+ parts

$13.481

100+ parts

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973

$13.481

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ChromeModa Solutions

Germany . 6,401 parts In-Stock

1+ parts

$13.756

100+ parts

$11.280

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-

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6,401

$13.756

$11.280

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IDEA Electronic Components Group

UK . 619 parts In-Stock

1+ parts

$13.756

100+ parts

$13.068

1k+ parts

$12.380

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619

$13.756

$13.068

$12.380

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AZTECH Wire

Italy . 513 parts In-Stock

1+ parts

$17.881

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513

$17.881

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One Stop Electronics

USA . 1,273 parts In-Stock

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$743.000

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1,273

$743.000

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Corphita

USA . 2,487 parts In-Stock

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2,487

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Overview

Unlock the power of secure communication with the TMS7500NL by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers high-quality encryption ICs that provide advanced data protection for telecom applications. The TMS7500NL offers reliable performance in a durable plastic/epoxy package, making it ideal for a wide range of commercial temperature environments. Ensure the confidentiality and integrity of your data with this cutting-edge technology, providing peace of mind to customers in need of robust encryption solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the product lightweight and durable, suitable for various telecom applications.

Package Style (Meter): IN-LINE

The in-line package style allows for easy integration into existing telecom systems or circuits, making it a convenient choice for encryption ICs.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this product can withstand high temperature environments, ensuring reliable performance in demanding conditions.

Minimum Operating Temperature: 0 °C

The product's minimum operating temperature of 0°C ensures that it can function effectively even in low temperature environments, providing consistent performance across a wide range of operating conditions.

Terminal Position: DUAL

Having dual terminal positions allows for flexibility in connecting the encryption IC to other components or circuits, ensuring compatibility and ease of integration.

Temperature Grade: COMMERCIAL

The commercial temperature grade indicates that this product is designed for standard commercial operating conditions, suitable for a wide range of telecom applications.

Technology: MOS

Utilizing MOS technology ensures efficient and reliable data encryption, making this product an effective choice for securing telecom data transmissions.

Terminal Form: THROUGH-HOLE

The through-hole terminal form simplifies the installation and connection process, making it easier to incorporate this encryption IC into various telecom devices or systems.

Telecom IC Type: DATA ENCRYPTION CIRCUIT

As a data encryption circuit, this product is specifically designed to secure sensitive information during telecom transmissions, making it an essential component for maintaining data confidentiality and security.

Technical Specifications

Telecom - Encryption ICs TMS7500NL attributes and parameters. Explore more Telecom - Encryption ICs devices from Texas Instruments

Specs

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP(UNSPEC)

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Sub-Category:

Telecom Encryption Circuits

Surface Mount:

NO

Technology:

MOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Position:

DUAL

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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