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ST19NP18ER28PVMT

STMicroelectronics

ST19NP18ER28PVMT by STMicroelectronics

ST19NP18ER28PVMT by STMicroelectronics is a Telecom IC for data encryption circuits. It operates at 3.3V with 28 terminals in a small outline, thin profile package. With a temperature range of 0-70 °C, it is suitable for commercial applications requiring secure data transmission.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 2,500 parts In-Stock

1+ parts

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2,500

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Dan-Mar Components

USA . 2,500 parts In-Stock

1+ parts

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2,500

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Anansix

USA . 1,247 parts In-Stock

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1,247

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Vyrian

USA . 1,119 parts In-Stock

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1,119

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Digiode

USA . 962 parts In-Stock

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962

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Microfarads

USA . 22 parts In-Stock

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22

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 845 parts In-Stock

1+ parts

$12.731

100+ parts

-

1k+ parts

$11.458

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845

$12.731

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$11.458

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MKK Technologies

India . 1,145 parts In-Stock

1+ parts

$23.940

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1,145

$23.940

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DigiPath Technology Company

USA . 1,145 parts In-Stock

1+ parts

$23.940

100+ parts

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1,145

$23.940

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A-Z Elektronik GmbH

Germany . 6,734 parts In-Stock

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6,734

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Corphita

USA . 4,109 parts In-Stock

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4,109

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Kepictronics

USA . 4,038 parts In-Stock

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4,038

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Parana Technologies

USA . 152 parts In-Stock

1+ parts

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$15.222

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152

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$15.222

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Overview

Unlock the power of secure communication with the ST19NP18ER28PVMT by STMicroelectronics. This cutting-edge Telecom Encryption IC offers unparalleled quality and reliability, backed by the prestigious manufacturer's reputation for excellence. Ideal for a wide range of applications, this product provides customers with enhanced data protection and peace of mind. Trust in STMicroelectronics to deliver top-notch performance and security with the ST19NP18ER28PVMT - your key to seamless encrypted communication.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the sensitive encryption IC components inside.

Surface Mount: YES

Enables easy and efficient installation on circuit boards, saving time and effort during production.

Power Supplies (V): 3.3

Operates at a low voltage, making it energy-efficient and suitable for various electronic devices.

No. of Terminals: 28

Offers flexibility in connectivity options and allows for integration with a wide range of systems.

Maximum Operating Temperature: 70 °C

Ensures stable performance even in high-temperature environments, increasing reliability.

Minimum Operating Temperature: 0 °C

Can withstand low temperatures, making it suitable for use in various climates and conditions.

Telecom IC Type: DATA ENCRYPTION CIRCUIT

Provides secure communication and data protection, making it an essential component in modern telecommunications systems.

Technology: CMOS

Utilizes low power consumption and offers high speed, enhancing the overall efficiency of the encryption IC.

Technical Specifications

Telecom - Encryption ICs ST19NP18ER28PVMT attributes and parameters. Explore more Telecom - Encryption ICs devices from STMicroelectronics

Specs

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP28,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Sub-Category:

Telecom Encryption Circuits

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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