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HCS300/P

Microchip Technology

HCS300/P by Microchip Technology

HCS300/P by Microchip Technology is a Telecom IC for data encryption circuits. It operates at 0-70°C with 5V supply voltage and 2.5mA current. With TS16949 screening, it comes in an 8-terminal rectangular package ideal for secure communication applications.

Median Price

$1.540

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 2 parts In-Stock

1+ parts

$1.540

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-

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2

$1.540

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Distributors (In-Stock)

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Vyrian

USA . 5,849 parts In-Stock

1+ parts

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5,849

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Nova Conductors

Japan . 870 parts In-Stock

1+ parts

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870

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ACDS - Activité Composants Distribution Service

France . 445 parts In-Stock

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445

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ComSIT Distribution GmbH

Germany . 60 parts In-Stock

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60

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Distributors (Availability)

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Ampacity Inc.

Singapore . 2 parts In-Stock

1+ parts

$1.310

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2

$1.310

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Semicontronic

India . 2 parts In-Stock

1+ parts

$1.310

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$1.277

1k+ parts

$1.271

10k+ parts

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2

$1.310

$1.277

$1.271

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Andel Nordic

Denmark . 500 parts In-Stock

1+ parts

$5.042

100+ parts

-

1k+ parts

$4.840

10k+ parts

$4.840

500

$5.042

-

$4.840

$4.840

Aztec Data Supply Inc.

USA . 4,447 parts In-Stock

1+ parts

$6.203

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4,447

$6.203

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Corohmni

South Africa . 121 parts In-Stock

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$10.996

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121

$10.996

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AZTECH Wire

Italy . 846 parts In-Stock

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$18.172

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846

$18.172

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Kepictronics

USA . 25,855 parts In-Stock

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LOOK Integrated Logistics

Peru . 8,129 parts In-Stock

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Montano Global Distributors

Canada . 4,006 parts In-Stock

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Continental Prestige Electronics

USA . 2,889 parts In-Stock

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LMD Electronica

Estonia . 1,055 parts In-Stock

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NIA Electronics

USA . 846 parts In-Stock

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846

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Ledger Components

France . 846 parts In-Stock

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846

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Assy Fe

Spain . 700 parts In-Stock

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700

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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Argo Parts USA

USA . 386 parts In-Stock

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386

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Bastille Electronics

Australia . 40 parts In-Stock

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40

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Perfect Parts

USA . 10 parts In-Stock

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10

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Overview

Unlock the power of secure data transmission with the HCS300/P by Microchip Technology. As a trusted leader in the telecom industry, Microchip Technology delivers top-quality encryption ICs that ensure your data remains protected at all times. Ideal for applications requiring data encryption, this product offers reliable performance, ease of use, and peace of mind knowing your information is safe from prying eyes. Upgrade to the HCS300/P today and experience the benefits of cutting-edge technology in safeguarding your sensitive data.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - Provides durability and reliability for long-term use.

Screening Level:

TS 16949 - Ensures high quality standards and reliability in performance.

Package Shape:

RECTANGULAR - Allows for easy integration and space-saving design.

No. of Terminals:

8 - Provides flexibility for connectivity options.

Package Style (Meter):

IN-LINE - Offers convenient installation and connection.

Maximum Operating Temperature:

70 °C - Ensures stable performance in various environments.

Minimum Operating Temperature:

0 °C - Suitable for use in both mild and extreme temperatures.

Terminal Finish:

MATTE TIN - Maintains a secure electrical connection for optimal performance.

Terminal Position:

DUAL - Allows for versatile mounting options and configurations.

Maximum Seated Height:

5.33 mm - Ideal for compact and space-constrained applications.

Width:

7.62 mm - Compact size for easy integration into different systems.

Length:

9.271 mm - Provides a balance between space-saving design and functionality.

Temperature Grade:

COMMERCIAL - Suitable for standard operating environments.

Terminal Form:

THROUGH-HOLE - Ensures secure mounting for stability during operation.

Maximum Supply Current:

2.5 mA - Efficient power consumption for energy-saving operation.

Telecom IC Type:

DATA ENCRYPTION CIRCUIT - Ensures secure communication and data protection.

Nominal Supply Voltage:

5 V - Standard voltage compatibility for easy integration into existing systems.

Terminal Pitch:

2.54 mm - Allows for easy connectivity and compatibility with various components.

Technical Specifications

Telecom - Encryption ICs HCS300/P attributes and parameters. Explore more Telecom - Encryption ICs devices from Microchip Technology

Specs

JESD-30 Code:

R-PDIP-T8

JESD-609 Code:

e3

Length:

9.271 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Screening Level:

TS 16949

Maximum Seated Height:

5.33 mm

Maximum Supply Current:

2.5 mA

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

HCS300/P Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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