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HCS101-I/SN

Microchip Technology

HCS101-I/SN by Microchip Technology

HCS101-I/SN by Microchip is a Telecom IC for data encryption circuits. It operates at -40 to 85°C with 5V supply voltage and 2mA current. With TS16949 screening, it comes in a small outline package with Gull Wing terminals, ideal for secure communication applications.

Median Price

$1.310

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 136,400 parts In-Stock

1+ parts

$1.310

100+ parts

$1.240

1k+ parts

$1.120

10k+ parts

$1.070

136,400

$1.310

$1.240

$1.120

$1.070

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 150 parts In-Stock

1+ parts

$1.230

100+ parts

-

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-

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-

150

$1.230

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NAC Semi

USA . 109,100 parts In-Stock

1+ parts

$1.460

100+ parts

$1.320

1k+ parts

$1.190

10k+ parts

-

109,100

$1.460

$1.320

$1.190

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Vyrian

USA . 2,731 parts In-Stock

1+ parts

-

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2,731

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 3,448 parts In-Stock

1+ parts

$1.230

100+ parts

-

1k+ parts

-

10k+ parts

$1.205

3,448

$1.230

-

-

$1.205

Argo Parts USA

USA . 1,965 parts In-Stock

1+ parts

$1.230

100+ parts

-

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1,965

$1.230

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Netroflash

USA . 100 parts In-Stock

1+ parts

$1.230

100+ parts

-

1k+ parts

$1.169

10k+ parts

$1.144

100

$1.230

-

$1.169

$1.144

Semicontronic

India . 70,890 parts In-Stock

1+ parts

$2.420

100+ parts

$2.360

1k+ parts

$2.347

10k+ parts

-

70,890

$2.420

$2.360

$2.347

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AZTECH Wire

Italy . 539 parts In-Stock

1+ parts

$14.400

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539

$14.400

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Corohmni

South Africa . 247 parts In-Stock

1+ parts

$14.941

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247

$14.941

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Aztec Data Supply Inc.

USA . 258 parts In-Stock

1+ parts

$17.288

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258

$17.288

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Lixinc

USA . 8,924 parts In-Stock

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8,924

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A-Z Elektronik GmbH

Germany . 8,456 parts In-Stock

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8,456

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Authorized Procurement Solutions

USA . 4,483 parts In-Stock

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4,483

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Alle Elektronik GmbH

Germany . 4,223 parts In-Stock

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4,223

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West Coast Incorporated

USA . 3,523 parts In-Stock

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3,523

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Kepictronics

USA . 20 parts In-Stock

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20

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Overview

Enhance the security of your telecom systems with the HCS101-I/SN by Microchip Technology. This high-quality encryption IC offers top-notch protection against cyber threats, ensuring the confidentiality of your data. With a small outline package and industrial temperature grade, this product is perfect for a wide range of applications in the telecom industry. Trust Microchip Technology for cutting-edge technology that delivers reliable performance and peace of mind. Elevate your security measures and safeguard your information with the HCS101-I/SN.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and reliability to the product, making it suitable for various operating conditions.

Surface Mount: YES

Being surface mountable allows for easy and efficient integration into various electronic devices and systems.

Screening Level: TS 16949

Compliance with TS 16949 screening level ensures high quality and reliability in the product.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space and easy handling during installation.

No. of Terminals: 8

Having multiple terminals enables connectivity and functionality in a variety of setups.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and electrical conductivity for reliable connections.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures stability and performance even in demanding environments.

Nominal Supply Voltage: 5 V

Standard supply voltage of 5V makes it compatible with common power sources and systems.

Technical Specifications

Telecom - Encryption ICs HCS101-I/SN attributes and parameters. Explore more Telecom - Encryption ICs devices from Microchip Technology

Specs

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Screening Level:

TS 16949

Maximum Seated Height:

1.75 mm

Maximum Supply Current:

2 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

HCS101-I/SN Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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