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HCS300T-I/SNVAO

Microchip Technology

HCS300T-I/SNVAO by Microchip Technology

Microchip Technology's HCS300T-I/SNVAO is a Telecom IC for data encryption circuits. It operates at -40 to 85°C with 5V supply voltage and 2.5mA current. The small outline package has 8 terminals, Gull Wing form, and matte tin finish, making it suitable for secure communication applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 718 parts In-Stock

1+ parts

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718

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Nova Conductors

Japan . 48 parts In-Stock

1+ parts

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48

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 2,892 parts In-Stock

1+ parts

$1.660

100+ parts

$1.618

1k+ parts

$1.610

10k+ parts

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2,892

$1.660

$1.618

$1.610

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Corohmni

South Africa . 8 parts In-Stock

1+ parts

$6.599

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8

$6.599

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AZTECH Wire

Italy . 851 parts In-Stock

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$6.945

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851

$6.945

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Aztec Data Supply Inc.

USA . 84 parts In-Stock

1+ parts

$8.530

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84

$8.530

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Ampacity Inc.

Singapore . 462 parts In-Stock

1+ parts

$599.000

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462

$599.000

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Fulton Briggs Corp.

USA . 7,739 parts In-Stock

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7,739

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Continental Prestige Electronics

USA . 6,177 parts In-Stock

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6,177

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Lixinc

USA . 4,592 parts In-Stock

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4,592

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Argo Parts USA

USA . 3,520 parts In-Stock

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3,520

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Bastille Electronics

Australia . 450 parts In-Stock

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450

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Overview

Unlock the power of secure communication with the HCS300T-I/SNVAO by Microchip Technology. This telecom encryption IC is designed to provide top-notch data protection for various applications, ensuring peace of mind for users. With a reputation for high-quality products and cutting-edge technology, Microchip Technology delivers a reliable solution that guarantees optimal performance. Elevate your security standards and safeguard your information with the HCS300T-I/SNVAO, offering unparalleled value and peace of mind for customers seeking advanced encryption solutions. Trust in Microchip Technology to keep your data safe and secure.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and cost-effective material, ensuring longevity and affordability of the product.

Surface Mount: YES

Easy to install and compatible with modern PCB assembly processes.

Screening Level: TS 16949

High quality assurance standards, ensuring reliability and performance.

Package Shape: RECTANGULAR

Space-efficient design, allowing for compact integration in electronic devices.

No. of Terminals: 8

Sufficient number of terminals for connectivity and communication purposes.

Maximum Operating Temperature: 85 °C

Wide temperature range for versatile applications.

Minimum Operating Temperature: -40 °C

Suitable for use in varying environmental conditions.

Maximum Seated Height: 1.75 mm

Low profile for space-constrained installations.

Nominal Supply Voltage: 5 V

Common voltage requirement for compatibility with standard power sources.

Technical Specifications

Telecom - Encryption ICs HCS300T-I/SNVAO attributes and parameters. Explore more Telecom - Encryption ICs devices from Microchip Technology

Specs

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Screening Level:

TS 16949

Maximum Seated Height:

1.75 mm

Maximum Supply Current:

2.5 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

HCS300T-I/SNVAO Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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