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HCS365/P

Microchip Technology

HCS365/P by Microchip Technology

Microchip Technology's HCS365/P is a Telecom IC for data encryption circuits. It operates at 0-70°C with 5V supply voltage and 5mA current. With TS16949 screening, this rectangular package IC has 8 terminals in an in-line style, ideal for secure communication applications.

Median Price

$2.109

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$2.109

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500

$2.109

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Vyrian

USA . 4,947 parts In-Stock

1+ parts

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4,947

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R&J Components

USA . 294 parts In-Stock

1+ parts

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294

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ACDS - Activité Composants Distribution Service

France . 180 parts In-Stock

1+ parts

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180

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Bristol Electronics

USA . 180 parts In-Stock

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180

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Dan-Mar Components

USA . 180 parts In-Stock

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180

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Argo Parts USA

USA . 4,411 parts In-Stock

1+ parts

$2.109

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4,411

$2.109

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Continental Prestige Electronics

USA . 2,529 parts In-Stock

1+ parts

$2.109

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$2.067

2,529

$2.109

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$2.067

Bastille Electronics

Australia . 10 parts In-Stock

1+ parts

$2.109

100+ parts

$2.004

1k+ parts

$1.903

10k+ parts

$1.877

10

$2.109

$2.004

$1.903

$1.877

Microchip USA

USA . 1,808 parts In-Stock

1+ parts

$14.495

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$14.495

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Aztec Data Supply Inc.

USA . 2,788 parts In-Stock

1+ parts

$14.990

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2,788

$14.990

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AZTECH Wire

Italy . 323 parts In-Stock

1+ parts

$15.629

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323

$15.629

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Corohmni

South Africa . 608 parts In-Stock

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$17.559

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608

$17.559

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Semicontronic

India . 1,278 parts In-Stock

1+ parts

$201.000

100+ parts

$195.975

1k+ parts

$194.970

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1,278

$201.000

$195.975

$194.970

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Fulton Briggs Corp.

USA . 4,359 parts In-Stock

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4,359

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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Overview

Discover a new level of security and protection with the HCS365/P by Microchip Technology. As a trusted manufacturer in the industry, Microchip Technology brings you top-quality Telecom Encryption ICs that are designed to safeguard your data and communications. With its innovative design and reliable performance, this product offers unparalleled value and benefits to customers in need of secure data encryption solutions. Whether it's for telecommunications, networking, or other applications, the HCS365/P provides the peace of mind and assurance you need in today's digital world.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good protection for the internal components, ensuring durability and reliability.

Screening Level: TS 16949

Meets high quality standards for automotive applications, indicating reliability and robustness.

Package Shape: RECTANGULAR

Compact shape allows for easy integration into various telecom devices.

No. of Terminals: 8

Adequate number of terminals for connectivity in telecom systems.

Maximum Operating Temperature: 70 °C

Can operate effectively in various environmental conditions.

Minimum Operating Temperature: 0 °C

Wide temperature range ensures functionality in different climates.

Terminal Finish: MATTE TIN

Provides corrosion resistance for long-term use.

Maximum Seated Height: 5.334 mm

Low profile design for space-constrained applications.

Width: 7.62 mm

Compact width for easy PCB mounting.

Length: 9.271 mm

Optimal length for fitting into telecom equipment.

Temperature Grade: COMMERCIAL

Suitable for standard commercial applications.

Terminal Form: THROUGH-HOLE

Allows for secure mounting on PCBs.

Nominal Supply Voltage: 5 V

Standard voltage requirement for compatibility with existing systems.

Technical Specifications

Telecom - Encryption ICs HCS365/P attributes and parameters. Explore more Telecom - Encryption ICs devices from Microchip Technology

Specs

JESD-30 Code:

R-PDIP-T8

JESD-609 Code:

e3

Length:

9.271 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Screening Level:

TS 16949

Maximum Seated Height:

5.334 mm

Maximum Supply Current:

5 mA

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

HCS365/P Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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