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HCS512-I/SO

Microchip Technology

HCS512-I/SO by Microchip Technology

HCS512-I/SO by Microchip Technology is a Telecom IC for data encryption circuits. It operates at 5V with 18 terminals in a small outline package style. With a temperature range of -40 to 85°C, it is ideal for industrial applications requiring secure communication.

Median Price

$6.460

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 92 parts In-Stock

1+ parts

$6.460

100+ parts

$5.630

1k+ parts

$5.170

10k+ parts

$4.920

92

$6.460

$5.630

$5.170

$4.920

Mouser Electronics

USA . 89 parts In-Stock

1+ parts

$6.460

100+ parts

$5.630

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-

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89

$6.460

$5.630

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

NAC Semi

USA . 84 parts In-Stock

1+ parts

$6.120

100+ parts

$5.550

1k+ parts

$5.070

10k+ parts

-

84

$6.120

$5.550

$5.070

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Vyrian

USA . 4,641 parts In-Stock

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4,641

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Chip Stock

USA . 1,021 parts In-Stock

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1,021

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Nova Conductors

Japan . 900 parts In-Stock

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900

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Zilex Electronics Inc.

Canada . 213 parts In-Stock

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213

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Pegasus Components GmbH

Germany . 199 parts In-Stock

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199

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 150 parts In-Stock

1+ parts

$5.120

100+ parts

-

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150

$5.120

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Andel Nordic

Denmark . 85 parts In-Stock

1+ parts

$10.623

100+ parts

-

1k+ parts

$10.198

10k+ parts

$10.198

85

$10.623

-

$10.198

$10.198

Authorized Procurement Solutions

USA . 20,000 parts In-Stock

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LOOK Integrated Logistics

Peru . 8,212 parts In-Stock

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Montano Global Distributors

Canada . 6,089 parts In-Stock

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6,089

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NIA Electronics

USA . 4,932 parts In-Stock

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4,932

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Ledger Components

France . 4,932 parts In-Stock

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4,932

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LMD Electronica

Estonia . 407 parts In-Stock

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407

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Netroflash

USA . 50 parts In-Stock

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50

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Overview

Enhance the security and protection of your telecom systems with the HCS512-I/SO by Microchip Technology. This high-quality encryption IC offers unparalleled reliability and performance, ensuring your data remains safe from potential threats. Ideal for a wide range of applications in the telecom industry, this product provides value, efficiency, and peace of mind to customers looking to safeguard their communications. Trust in Microchip Technology's expertise and innovation to keep your information secure.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and resistance to environmental factors, making the product suitable for various operating conditions.

Surface Mount: YES

Allows for easy and efficient assembly onto circuit boards, saving time and effort during manufacturing processes.

Screening Level: TS 16949

Ensures high quality and reliability of the product, meeting industry standards and requirements.

Maximum Operating Temperature: 85 °C

Can operate efficiently in high temperature environments, making it suitable for a wide range of applications.

Width: 7.5 mm

Compact size allows for space-saving integration into electronic devices, making it ideal for compact designs.

Telecom IC Type: DATA ENCRYPTION CIRCUIT

Provides secure encryption of data, ensuring confidentiality and integrity of communications, making it a crucial component in telecom systems.

Technical Specifications

Telecom - Encryption ICs HCS512-I/SO attributes and parameters. Explore more Telecom - Encryption ICs devices from Microchip Technology

Specs

JESD-30 Code:

R-PDSO-G18

JESD-609 Code:

e3

Length:

11.55 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

18

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP18,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Screening Level:

TS 16949

Maximum Seated Height:

2.65 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

10 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

HCS512-I/SO Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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