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HCS512T-I/SO

Microchip Technology

HCS512T-I/SO by Microchip Technology

Microchip Technology's HCS512T-I/SO is a Telecom IC for data encryption circuits. It operates at 5V with 18 terminals in a small outline package. With industrial temperature grade, it features matte tin finish and gull wing terminal form for secure applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,867 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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5,867

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-

-

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Nova Conductors

Japan . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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500

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,027 parts In-Stock

1+ parts

$5.570

100+ parts

-

1k+ parts

-

10k+ parts

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1,027

$5.570

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AZTECH Wire

Italy . 51 parts In-Stock

1+ parts

$16.890

100+ parts

-

1k+ parts

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10k+ parts

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51

$16.890

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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1,000

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RGB Technical Solutions

Ukraine . 145 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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145

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Overview

Enhance your telecom security with the HCS512T-I/SO by Microchip Technology. Designed to provide top-notch encryption capabilities, this small outline IC offers a reliable solution for safeguarding your data transmissions. With a quality manufacturer like Microchip Technology behind it, you can trust in the performance and durability of this product. Perfect for a wide range of applications within the telecom industry, this encryption circuit ensures that your information remains secure and protected. Upgrade your systems today and experience the value and benefits that the HCS512T-I/SO has to offer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is cost-effective and lightweight, making the product suitable for a wide range of applications.

Surface Mount: YES

Surface mount technology allows for efficient and compact PCB assembly, saving space and reducing overall product size.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial environments, ensuring reliability and longevity in demanding conditions.

Nominal Supply Voltage: 5 V

Operates at a standard voltage level, making it compatible with most power supplies and systems.

Technical Specifications

Telecom - Encryption ICs HCS512T-I/SO attributes and parameters. Explore more Telecom - Encryption ICs devices from Microchip Technology

Specs

JESD-30 Code:

R-PDSO-G18

JESD-609 Code:

e3

Length:

11.55 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

18

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP18,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Screening Level:

TS 16949

Maximum Seated Height:

2.65 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

10 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

7.5 mm

Trade Compliance

HCS512T-I/SO Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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