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HCS512/SO

Microchip Technology

HCS512/SO by Microchip Technology

HCS512/SO by Microchip Technology is a Telecom IC for data encryption circuits. It operates at 5V with 18 terminals in a small outline package. With TS 16949 screening level, it has a temperature range of 0-70°C and Gull Wing terminal form.

Median Price

$5.844

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

< 1k

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 20 parts In-Stock

1+ parts

$5.829

100+ parts

$5.073

1k+ parts

$4.973

10k+ parts

-

20

$5.829

$5.073

$4.973

-

Microchip Technology

USA . 242 parts In-Stock

1+ parts

$5.860

100+ parts

$5.090

1k+ parts

$4.690

10k+ parts

$4.460

242

$5.860

$5.090

$4.690

$4.460

Mouser Electronics

USA . 18 parts In-Stock

1+ parts

$5.860

100+ parts

$5.090

1k+ parts

-

10k+ parts

-

18

$5.860

$5.090

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-

Verical

USA . 20 parts In-Stock

1+ parts

-

100+ parts

$5.073

1k+ parts

$4.973

10k+ parts

-

20

-

$5.073

$4.973

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 100 parts In-Stock

1+ parts

-

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100

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North Shore Components

USA . 4 parts In-Stock

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4

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Montano Global Distributors

Canada . 7,553 parts In-Stock

1+ parts

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7,553

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

-

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5,000

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LOOK Integrated Logistics

Peru . 3,929 parts In-Stock

1+ parts

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3,929

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NIA Electronics

USA . 3,536 parts In-Stock

1+ parts

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3,536

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Ledger Components

France . 3,536 parts In-Stock

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3,536

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Lixinc

USA . 3,143 parts In-Stock

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3,143

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LMD Electronica

Estonia . 2,287 parts In-Stock

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2,287

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Perfect Parts

USA . 41 parts In-Stock

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41

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Overview

Enhance the security of your telecom systems with the HCS512/SO by Microchip Technology. This high-quality encryption IC offers unparalleled protection for your data, ensuring a secure communication network. With its small outline package and dual terminals, this product is versatile and easy to integrate into various applications. Trust in Microchip Technology's expertise in telecom ICs to provide you with reliable and efficient solutions. Upgrade your system's security today with the HCS512/SO and experience peace of mind knowing your data is safe.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the IC, ensuring long-term reliability.

Surface Mount: YES

Enables easy and convenient assembly onto circuit boards, saving time and effort during production.

Screening Level: TS 16949

Compliance with TS 16949 standards ensures high quality and reliability in automotive applications.

Power Supplies (V): 5

Operates efficiently and reliably with a standard 5V power supply.

No. of Terminals: 18

Provides sufficient connectivity options for interfacing with other components and circuits.

Maximum Operating Temperature: 70 °C

Can withstand high operating temperatures, making it suitable for various environments.

Minimum Operating Temperature: 0 °C

Maintains functionality even in low temperature conditions.

Terminal Finish: Matte Tin (Sn)

Enhances solderability and electrical conductivity for secure connections.

Width: 7.5 mm

Compact size saves space on the circuit board and allows for streamlined design layouts.

Maximum Time At Peak Reflow Temperature (s): 40

Ensures proper soldering during assembly without compromising the IC's performance.

Peak Reflow Temperature °C: 260

Capable of withstanding high reflow temperatures, maintaining structural integrity post-assembly.

Temperature Grade: COMMERCIAL

Meets industry standards for commercial-grade applications.

Maximum Supply Current: 10 mA

Operates efficiently with low power consumption, ideal for energy-conscious designs.

Telecom IC Type: DATA ENCRYPTION CIRCUIT

Provides secure data encryption capabilities for safeguarding sensitive information.

Nominal Supply Voltage: 5 V

Operates within standard voltage parameters, ensuring compatibility with common power sources.

Moisture Sensitivity Level (MSL): 2

Resistant to moisture damage, maintaining performance in humid environments.

Technical Specifications

Telecom - Encryption ICs HCS512/SO attributes and parameters. Explore more Telecom - Encryption ICs devices from Microchip Technology

Specs

JESD-30 Code:

R-PDSO-G18

JESD-609 Code:

e3

Length:

11.55 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

18

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP18,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Screening Level:

TS 16949

Maximum Seated Height:

2.65 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

10 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

7.5 mm

Trade Compliance

HCS512/SO Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

Category top products 20

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