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TL16CP754CIPMRG4

Texas Instruments

TL16CP754CIPMRG4 by Texas Instruments

TL16CP754CIPMRG4 by Texas Instruments is a Serial Communication Controller with 64 terminals, operating at 48 MHz clock frequency. It supports communication protocols like ASYNC and BIT, with a data transfer rate of 0.375 MBps. Ideal for industrial applications requiring high-speed serial I/O operations.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

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Digiode

USA . 2,614 parts In-Stock

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Nova Conductors

Japan . 91 parts In-Stock

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AZTECH Wire

Italy . 231 parts In-Stock

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$12.275

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One Stop Electronics

USA . 525 parts In-Stock

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$23.000

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Ampacity Inc.

Singapore . 797 parts In-Stock

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Parana Technologies

USA . 2,107 parts In-Stock

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DigiPath Technology Company

USA . 269 parts In-Stock

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$67.253

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$61.873

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ChromeModa Solutions

Germany . 3,833 parts In-Stock

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$68.626

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$56.273

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IDEA Electronic Components Group

UK . 2,223 parts In-Stock

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$65.195

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$61.763

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Corphita

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Continental Prestige Electronics

USA . 3,857 parts In-Stock

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Argo Parts USA

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Microchip USA

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Aranea Global

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Kepictronics

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Overview

Elevate your communication capabilities with the TL16CP754CIPMRG4 by Texas Instruments. Crafted with precision and expertise, this serial communication controller is designed to deliver reliable performance in a wide range of applications. From industrial settings to consumer electronics, this product offers seamless connectivity and efficient data transfer without compromising on quality. Trust in the legacy of Texas Instruments and experience the value and benefits that the TL16CP754CIPMRG4 brings to your projects. Upgrade your systems today and streamline your operations with this cutting-edge solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and lightweight design for easy handling and integration.

Surface Mount: YES

This feature allows for easy installation on PCBs, saving time and effort in the assembly process.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage, this product can handle a wide range of power sources, making it versatile for different applications.

Address Bus Width: 3

A wider address bus width allows for efficient data handling and communication, enhancing the overall performance of the serial communication controller.

No. of Terminals: 64

Having a high number of terminals provides ample connectivity options, allowing for versatile integration and compatibility with other components.

Maximum Data Transfer Rate: 0.375 MBps

The high data transfer rate enables fast and efficient communication, making this product suitable for applications that require quick and reliable data exchange.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in harsh environmental conditions, increasing the product's reliability and durability.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the product to function effectively in cold environments, making it a versatile option for various applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term performance and reliability.

Maximum Clock Frequency: 48 MHz

A high maximum clock frequency allows for faster data processing and communication, making the product ideal for high-speed applications that require real-time data transfer.

Technical Specifications

Serial Communication Controllers TL16CP754CIPMRG4 attributes and parameters. Explore more Serial Communication Controllers devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 1.8V/2.5V/3.3V SUPPLY

Address Bus Width:

3

Boundary Scan:

NO

Maximum Clock Frequency:

48 MHz

Communication Protocol:

ASYNC, BIT

Maximum Data Transfer Rate:

.375 MBps

External Data Bus Width:

8

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

3

No. of Serial I/Os:

4

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/5

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Serial IO/Communication Controllers

Maximum Supply Current:

28 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Trade Compliance

TL16CP754CIPMRG4 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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