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TL16C550CIPT

Texas Instruments

TL16C550CIPT by Texas Instruments

TL16C550CIPT by Texas Instruments is a Serial Communication Controller with a max data transfer rate of 0.125 MBps. It has a temperature range of -40 to 85 °C and operates at a max clock frequency of 16 MHz. This controller is commonly used in industrial applications requiring asynchronous communication protocols.

Median Price

$4.470

Lifecycle Status

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26

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1k+

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Rochester

USA . 32 parts In-Stock

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Digiode

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Ampacity Inc.

Singapore . 32 parts In-Stock

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Semicontronic

India . 32 parts In-Stock

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Corphita

USA . 4,510 parts In-Stock

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Component Stockers USA

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AZTECH Wire

Italy . 391 parts In-Stock

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Parana Technologies

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ChromeModa Solutions

Germany . 6,280 parts In-Stock

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IDEA Electronic Components Group

UK . 801 parts In-Stock

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DigiPath Technology Company

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Overview

Experience seamless and efficient serial communication with the TL16C550CIPT by Texas Instruments. As a leading manufacturer, Texas Instruments ensures the highest quality in every product they create. The TL16C550CIPT is no exception, offering reliability and durability for your communication needs. Whether you're looking to connect devices, transfer data, or streamline operations, this serial communication controller delivers unmatched performance. With its low profile, fine pitch package style, it's designed to fit seamlessly into any application. Say goodbye to technical glitches and hello to smooth data transfer with the TL16C550CIPT. Trust Texas Instruments to provide the value, benefits, and advantages you deserve.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This choice of material ensures durability and lightweight construction, making it ideal for applications where weight and reliability are important factors.

Surface Mount: YES

The surface mount capability allows for easy integration onto printed circuit boards, optimizing space usage and enabling efficient manufacturing processes.

Maximum Supply Voltage: 5.25 V

With a high maximum supply voltage, this serial communication controller can handle a wide range of input powers, making it adaptable to various system requirements.

Address Bus Width: 3

The 3-bit address bus width provides sufficient memory addressing capability, allowing for efficient communication and data processing.

Package Shape: SQUARE

The square package shape facilitates easy placement and handling during assembly, enhancing ease of use and integration into electronic devices.

Power Supplies (V): 3.3/5

This compatibility with both 3.3V and 5V power supplies ensures versatility, making it suitable for a broad range of applications that require different voltage levels.

No. of Terminals: 48

With a generous number of terminals, this communication controller offers ample connectivity options, enabling seamless integration with other components in the system.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package style allows for compact designs, saving valuable space in systems with size constraints.

Minimum Supply Voltage: 4.75 V

The low minimum supply voltage requirement accommodates power-limited scenarios, making this controller adaptable to energy-efficient applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this controller can withstand demanding environments without compromising performance, ensuring reliable operation.

Maximum Data Transfer Rate: 0.125 MBps

The high maximum data transfer rate of 0.125 MBps enables fast and efficient communication, enhancing overall system responsiveness.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature enables reliable operation even in extreme cold environments, making it suitable for applications requiring robust performance in harsh conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

This terminal finish provides excellent conductivity, corrosion resistance, and longevity, ensuring reliable connections for extended periods.

Terminal Position: QUAD

The quad terminal position allows for secure and stable connections, reducing the risk of signal loss or interruption, enhancing the overall reliability of the system.

Maximum Seated Height: 1.6 mm

The low maximum seated height ensures compatibility with space-constrained designs, enabling integration in compact electronic products.

Width: 7 mm

The compact width dimension facilitates efficient board layout and space utilization, making it a suitable choice for applications with limited real estate.

Data Encoding or Decoding Method: NRZ

The NRZ (Non-Return-to-Zero) data encoding method is known for its simplicity and high-speed capabilities, making it ideal for rapid data transmission in serial communication.

External Data Bus Width: 8

With an 8-bit external data bus width, this controller can handle a larger volume of data, enabling efficient data processing and communication.

Communication Protocol: ASYNC, BIT

The support for asynchronous and bit-level communication protocols offers flexibility in data transmission, allowing for compatibility with various systems and devices.

Maximum Clock Frequency: 16 MHz

The high maximum clock frequency ensures speedy data processing and communication, enhancing system performance and responsiveness.

Maximum Time At Peak Reflow Temperature (s): 30

This specification indicates the duration for which the controller can withstand peak reflow temperatures, ensuring robustness during manufacturing processes.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance allows for reliable soldering during production, ensuring proper connectivity and durability.

Length: 7 mm

The compact length dimension facilitates efficient board layout and space utilization, making it a suitable choice for applications with limited real estate.

Temperature Grade: INDUSTRIAL

Designed for industrial environments, this serial communication controller can reliably operate under conditions of high temperature, vibration, and humidity, making it suitable for demanding applications.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

This controller serves as a versatile peripheral IC offering serial input/output and communication capabilities, enabling seamless integration into various systems and applications.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption, high noise immunity, and enhanced reliability, making this controller an energy-efficient and robust choice.

Terminal Form: GULL WING

The gull wing terminal form provides secure mechanical attachment, creating firm connections that withstand physical stress and maintain reliable signal transmission.

Maximum Supply Current: 10 mA

With a low maximum supply current requirement, this controller operates efficiently, minimizing power consumption and extending battery life in portable devices.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V ensures compatibility with common power sources, making this controller widely applicable in various electronic systems.

No. of Serial I/Os: 1

Offering 1 serial input/output channel, this controller provides convenient connectivity for devices requiring serial communication, enhancing system versatility.

Terminal Pitch: 0.5 mm

With a small terminal pitch of 0.5 mm, this controller allows for compact integration and efficient board layout, suitable for miniaturized electronic designs.

Moisture Sensitivity Level (MSL): 3

With an MSL rating of 3, this controller can withstand moderate moisture exposure, ensuring reliability during manufacturing and preventing moisture-induced failures in operation.

Technical Specifications

Serial Communication Controllers TL16C550CIPT attributes and parameters. Explore more Serial Communication Controllers devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 3.3V SUPPLY AT 14.9 MHZ

Address Bus Width:

3

Boundary Scan:

NO

Maximum Clock Frequency:

16 MHz

Communication Protocol:

ASYNC, BIT

Data Encoding or Decoding Method:

NRZ

Maximum Data Transfer Rate:

.125 MBps

External Data Bus Width:

8

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e4

Length:

7 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

3

No. of Serial I/Os:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Serial IO/Communication Controllers

Maximum Supply Current:

10 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

TL16C550CIPT Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-592-5426, 5962015925426

NIIN

015925426

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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