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SCC2691AC1D24,518

NXP Semiconductors

SCC2691AC1D24,518 by NXP Semiconductors

NXP Semiconductors' SCC2691AC1D24,518 is a Serial Communication Controller with 5.5V max supply voltage, 4MHz clock frequency, and 0.0046875 MBps data transfer rate. Ideal for serial IO/communication applications requiring low power mode and asynchronous communication protocol.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,846 parts In-Stock

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Digiode

USA . 628 parts In-Stock

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Anansix

USA . 499 parts In-Stock

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499

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Nova Conductors

Japan . 10 parts In-Stock

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One Stop Electronics

USA . 1,311 parts In-Stock

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$2.000

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AZTECH Wire

Italy . 252 parts In-Stock

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$13.799

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Ampacity Inc.

Singapore . 1,364 parts In-Stock

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$22.000

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QUARKTWIN TECHNOLOGY LTD

USA . 19,736 parts In-Stock

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Microchip USA

USA . 4,685 parts In-Stock

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Continental Prestige Electronics

USA . 3,247 parts In-Stock

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Bastille Electronics

Australia . 2,487 parts In-Stock

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UNI Independent Distributors

Spain . 1,931 parts In-Stock

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Argo Parts USA

USA . 1,419 parts In-Stock

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Perfect Parts

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Corphita

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Overview

Unlock seamless and reliable communication with the SCC2691AC1D24,518 by NXP Semiconductors. Crafted with precision and expertise, this Serial Communication Controller offers unparalleled performance in various applications. Whether you need to enhance data transfer speeds or streamline your system's operations, this product delivers exceptional value and efficiency. Experience the benefits of cutting-edge technology with the SCC2691AC1D24,518 and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the product lightweight and durable, ideal for portable or rugged applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving space and reducing production costs.

Maximum Supply Voltage: 5.5 V

High maximum supply voltage ensures compatibility with a wide range of power sources, increasing flexibility in design.

Address Bus Width: 3

Address bus width of 3 allows for efficient communication and data transfer within the system, enhancing performance.

Package Shape: RECTANGULAR

Rectangular package shape facilitates easy integration into a variety of electronic devices and systems.

No. of Terminals: 24

Ample number of terminals provide connectivity options and flexibility for interfacing with other components.

Package Style (Meter): SMALL OUTLINE

Small outline package style conserves space on the PCB, enabling compact and efficient design layouts.

Minimum Supply Voltage: 4.5 V

Low minimum supply voltage ensures energy efficiency and helps extend the product's operating life.

Maximum Data Transfer Rate: 0.0046875 MBps

High data transfer rate enables fast and efficient communication between devices, reducing latency and improving overall system performance.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature range ensures reliable operation even in harsh environmental conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel Palladium Gold terminal finish provides excellent conductivity and corrosion resistance, ensuring stable and reliable connections.

Terminal Position: DUAL

Dual terminal position offers redundancy and improves signal integrity, reducing the risk of connection failures.

Maximum Seated Height: 2.65 mm

Low maximum seated height allows for slim and compact device designs, ideal for space-constrained applications.

Width: 7.5 mm

Narrow width makes the product suitable for compact PCB layouts and space-conscious designs.

Data Encoding or Decoding Method: NRZ

NRZ encoding/decoding method ensures accurate data transmission and reception, minimizing errors in communication.

External Data Bus Width: 8

Wide external data bus width of 8 enhances data throughput and processing speed, improving overall system performance.

Communication Protocol: ASYNC, BIT

Support for asynchronous communication and bit-level protocol allows for versatile and efficient data exchange.

Maximum Clock Frequency: 4 MHz

High maximum clock frequency of 4 MHz enables rapid data processing and real-time communication, suitable for high-speed applications.

Length: 15.4 mm

Compact length makes the product suitable for space-constrained designs while maintaining functionality and performance.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures reliable performance in typical operating environments, making the product suitable for a wide range of applications.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

Peripheral IC type specializing in serial IO and communication control offers versatile connectivity and data management capabilities.

Technology: CMOS

CMOS technology delivers low power consumption, high noise immunity, and reliable operation, enhancing the product's efficiency and performance.

Terminal Form: GULL WING

Gull wing terminal form provides robust mechanical support and ease of assembly, ensuring secure connections and reliable operation.

Maximum Supply Current: 2 mA

Low maximum supply current minimizes power consumption and heat generation, contributing to energy efficiency and prolonged device lifespan.

Nominal Supply Voltage: 5 V

Stable nominal supply voltage of 5 V offers compatibility with standard power sources, ensuring consistent and reliable performance.

Terminal Pitch: 1.27 mm

Narrow terminal pitch of 1.27 mm facilitates precise and compact PCB layout, enabling high-density integration and efficient use of space.

Low Power Mode: YES

Low power mode feature enhances energy efficiency and extends battery life, making the product an environmentally friendly and cost-effective choice.

Technical Specifications

Serial Communication Controllers SCC2691AC1D24,518 attributes and parameters. Explore more Serial Communication Controllers devices from NXP Semiconductors

Specs

Address Bus Width:

3

Boundary Scan:

NO

Maximum Clock Frequency:

4 MHz

Communication Protocol:

ASYNC, BIT

Data Encoding or Decoding Method:

NRZ

Maximum Data Transfer Rate:

.0046875 MBps

External Data Bus Width:

8

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

15.4 mm

Low Power Mode:

YES

No. of DMA Channels:

0

No. of I/O Lines:

1

No. of Serial I/Os:

1

No. of Terminals:

24

On Chip Data RAM Width:

0

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

RAM Words:

0

Maximum Seated Height:

2.65 mm

Maximum Supply Current:

2 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

SCC2691AC1D24,518 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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