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SCC2681AC1N28,129

NXP Semiconductors

SCC2681AC1N28,129 by NXP Semiconductors

NXP Semiconductors' SCC2681AC1N28,129 is a Serial Communication Controller with 5.25V max supply voltage and 0-70°C operating temperature range. It features 0.125 MBps data transfer rate, ASYNC communication protocol, and 4 MHz clock frequency. Ideal for applications requiring reliable serial I/O communication in commercial-grade systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Anansix

USA . 2,664 parts In-Stock

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Digiode

USA . 1,305 parts In-Stock

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Vyrian

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Nova Conductors

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Ampacity Inc.

Singapore . 1,013 parts In-Stock

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AZTECH Wire

Italy . 738 parts In-Stock

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One Stop Electronics

USA . 1,469 parts In-Stock

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Argo Parts USA

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Continental Prestige Electronics

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Corphita

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Bastille Electronics

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Overview

Elevate your communication systems with the SCC2681AC1N28,129 by NXP Semiconductors. Crafted with precision and reliability in mind, this Serial Communication Controller offers seamless data transfer at a maximum rate of 0.125 MBps. With a commercial temperature grade and a sturdy plastic/epoxy package body material, this product ensures optimal performance and durability. Expand your technological capabilities with the SCC2681AC1N28,129, perfect for a wide range of applications requiring efficient serial communication. Experience the value and benefits of NXP Semiconductors' top-of-the-line components today.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material provides durability and reliability for the product.

Maximum Supply Voltage:

5.25 V - Higher supply voltage allows for flexibility in power source compatibility.

Address Bus Width:

4 - Sufficient address bus width for effective communication within the system.

Package Shape:

RECTANGULAR - Rectangular shape allows for easy integration and installation in various systems.

No. of Terminals:

28 - Sufficient terminals for connecting to other components and peripherals.

Package Style (Meter):

IN-LINE - In-line package style allows for streamlined and space-efficient design.

Minimum Supply Voltage:

4.75 V - Lower minimum supply voltage ensures operational stability in varying power conditions.

Maximum Operating Temperature:

70 °C - High operating temperature range ensures performance in various environments.

Maximum Data Transfer Rate:

0.125 MBps - Fast data transfer rate for efficient communication between devices.

Minimum Operating Temperature:

0 °C - Low minimum operating temperature allows for use in cold environments.

Terminal Position:

DUAL - Dual terminal position for versatile connectivity options.

Maximum Seated Height:

5.1 mm - Low seated height for compact and space-saving installation.

Width:

15.24 mm - Standard width for easy integration into existing systems.

Data Encoding or Decoding Method:

NRZ - Efficient data encoding method for accurate communication.

External Data Bus Width:

8 - Wide external data bus width for high-speed data transfer capabilities.

Communication Protocol:

ASYNC, BIT - Compatible communication protocols for seamless data exchange.

Maximum Clock Frequency:

4 MHz - High clock frequency for rapid processing and communication.

Length:

35.5 mm - Standard length for compatibility with various system configurations.

Temperature Grade:

COMMERCIAL - Commercial temperature grade suitable for typical operating conditions.

Peripheral IC Type:

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL - Specialized IC type for handling serial communication tasks.

Technology:

CMOS - CMOS technology for low power consumption and efficient operation.

Terminal Form:

THROUGH-HOLE - Through-hole terminal form for secure and reliable connections.

Nominal Supply Voltage:

5 V - Standard nominal supply voltage for compatibility with common power sources.

No. of Serial I/Os:

2 - Sufficient number of serial I/Os for versatile connectivity options.

Terminal Pitch:

2.54 mm - Standard terminal pitch for easy soldering and connection processes.

Technical Specifications

Serial Communication Controllers SCC2681AC1N28,129 attributes and parameters. Explore more Serial Communication Controllers devices from NXP Semiconductors

Specs

Address Bus Width:

4

Boundary Scan:

NO

Maximum Clock Frequency:

4 MHz

Communication Protocol:

ASYNC, BIT

Data Encoding or Decoding Method:

NRZ

Maximum Data Transfer Rate:

.125 MBps

External Data Bus Width:

8

JESD-30 Code:

R-PDIP-T28

Length:

35.5 mm

Low Power Mode:

NO

No. of Serial I/Os:

2

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Maximum Seated Height:

5.1 mm

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

15.24 mm

Trade Compliance

SCC2681AC1N28,129 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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