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SCC2691AC1D24,112

NXP Semiconductors

SCC2691AC1D24,112 by NXP Semiconductors

NXP Semiconductors' SCC2691AC1D24,112 is a Serial Communication Controller with 3-bit address bus width and 8-bit external data bus width. It operates b/w 0-70°C, supports up to 4 MHz clock frequency, and has a max data transfer rate of 0.0046875 MBps. Ideal for applications requiring asynchronous communication protocols in commercial-grade environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Anansix

USA . 2,239 parts In-Stock

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Digiode

USA . 1,659 parts In-Stock

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Vyrian

USA . 1,156 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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Ampacity Inc.

Singapore . 657 parts In-Stock

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$7.000

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657

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AZTECH Wire

Italy . 200 parts In-Stock

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$12.828

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One Stop Electronics

USA . 1,005 parts In-Stock

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$24.000

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UNI Independent Distributors

Spain . 7,318 parts In-Stock

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Corphita

USA . 4,781 parts In-Stock

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Argo Parts USA

USA . 4,447 parts In-Stock

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Bastille Electronics

Australia . 3,964 parts In-Stock

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Continental Prestige Electronics

USA . 1,118 parts In-Stock

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Overview

Elevate your communication systems with the SCC2691AC1D24,112 by NXP Semiconductors. Designed with precision and quality in mind, this Serial Communication Controller offers seamless data transfer and reliable performance. Whether you're looking to enhance your industrial automation or telecommunications projects, this product delivers unparalleled value and efficiency. Say goodbye to communication limitations and hello to endless possibilities with the SCC2691AC1D24,112. Upgrade today and experience the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, contributing to its long-lasting performance.

Surface Mount: YES

Being surface mountable allows for easy integration onto circuit boards, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage, the product can handle a wide range of power inputs, increasing its versatility.

Address Bus Width: 3

The address bus width of 3 allows for efficient communication and data transfer within the device, enhancing its overall performance.

Package Shape: RECTANGULAR

The rectangular package shape is commonly used and easily mountable, making it compatible with a variety of circuits and applications.

No. of Terminals: 24

Having 24 terminals provides ample connectivity options, allowing for versatile integration with other components and systems.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the circuit board, making it ideal for compact designs and applications with limited space.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage ensures efficient power consumption and operation, leading to energy savings and extended device longevity.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, the product can withstand elevated heat levels, ensuring reliable performance in various environments.

Maximum Data Transfer Rate: 0.0046875 MBps

The high maximum data transfer rate enables fast and efficient communication, reducing latency and improving overall system responsiveness.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures the product can function even in colder conditions, making it suitable for a wide range of temperature environments.

Terminal Position: DUAL

The dual terminal position provides redundancy and flexibility in connectivity, enhancing reliability and ease of use.

Maximum Seated Height: 2.65 mm

The low maximum seated height allows for a compact overall design, making the product suitable for slim devices and applications.

Width: 7.5 mm

The moderate width of 7.5 mm offers a balance between space efficiency and ease of handling during installation, making it versatile for various setups.

Data Encoding or Decoding Method: NRZ

The use of NRZ (Non-Return-to-Zero) encoding or decoding method ensures accurate data transmission and reception, reducing errors and improving data integrity.

External Data Bus Width: 8

The wide external data bus width of 8 allows for faster data transfer and processing, enhancing the overall speed and efficiency of the product.

Communication Protocol: ASYNC, BIT

Support for asynchronous communication and bit-level protocol enables flexible and adaptable data exchange between systems, enhancing interoperability.

Maximum Clock Frequency: 4 MHz

The high maximum clock frequency of 4 MHz enables rapid signal processing and synchronization, leading to efficient data transmission and reception.

Length: 15.4 mm

The moderate length of 15.4 mm offers a balanced size for the product, allowing for easy integration without compromising on performance or functionality.

Temperature Grade: COMMERCIAL

Designed for commercial use, the product meets industry standards for reliable operation and performance in typical business environments.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

As a serial IO/communication controller, the product facilitates efficient serial communication, making it suitable for a wide range of applications that require serial data transfer.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption and high noise immunity, contributing to energy efficiency and stable operation in various conditions.

Terminal Form: GULL WING

The gull wing terminal form provides reliable solder connections and secure attachment, enhancing the overall durability and longevity of the product.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5 V ensures compatibility with standard power sources, simplifying integration and operation in a wide range of applications.

Terminal Pitch: 1.27 mm

With a standard terminal pitch of 1.27 mm, the product offers compatibility and ease of connection with common soldering techniques and equipment.

Low Power Mode: YES

The availability of a low power mode enhances energy efficiency and extends battery life, making the product a cost-effective and sustainable choice for long-term use.

Technical Specifications

Serial Communication Controllers SCC2691AC1D24,112 attributes and parameters. Explore more Serial Communication Controllers devices from NXP Semiconductors

Specs

Address Bus Width:

3

Boundary Scan:

NO

Maximum Clock Frequency:

4 MHz

Communication Protocol:

ASYNC, BIT

Data Encoding or Decoding Method:

NRZ

Maximum Data Transfer Rate:

.0046875 MBps

External Data Bus Width:

8

JESD-30 Code:

R-PDSO-G24

Length:

15.4 mm

Low Power Mode:

YES

No. of Serial I/Os:

1

No. of Terminals:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

SCC2691AC1D24,112 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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