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SC16IS750IBS/S900X

NXP Semiconductors

SC16IS750IBS/S900X by NXP Semiconductors

SC16IS750IBS/S900X by NXP Semiconductors is a Serial Communication Controller with a max supply voltage of 3.6V and a max data transfer rate of 0.625 MBps. It is commonly used in industrial applications for asynchronous communication protocols and low power mode operation.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,865 parts In-Stock

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2,865

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Vyrian

USA . 736 parts In-Stock

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736

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Anansix

USA . 515 parts In-Stock

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515

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Nova Conductors

Japan . 500 parts In-Stock

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500

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,540 parts In-Stock

1+ parts

$4.000

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1,540

$4.000

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AZTECH Wire

Italy . 736 parts In-Stock

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$18.022

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736

$18.022

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One Stop Electronics

USA . 431 parts In-Stock

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$28.000

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431

$28.000

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Continental Prestige Electronics

USA . 3,906 parts In-Stock

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3,906

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Corphita

USA . 2,136 parts In-Stock

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Argo Parts USA

USA . 1,665 parts In-Stock

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UNI Independent Distributors

Spain . 1,509 parts In-Stock

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Aranea Global

USA . 500 parts In-Stock

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Overview

Discover the SC16IS750IBS/S900X by NXP Semiconductors, a high-quality Serial Communication Controller that is revolutionizing the industry. With its cutting-edge technology and reliable performance, this product offers unparalleled advantages for a wide range of applications. From industrial automation to IoT devices, the SC16IS750IBS/S900X provides seamless and efficient data transfer at a lightning-fast rate. Its compact design and low power mode make it the perfect choice for space-constrained environments. Trust in NXP Semiconductors' expertise and unlock the value and benefits that this exceptional product brings to your projects.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material provides durability and protection for the product, making it suitable for various environments.

Surface Mount:

YES - This feature allows for easy installation, reducing the need for additional components and making it more convenient to integrate into existing systems.

Maximum Supply Voltage:

3.6 V - With a higher supply voltage, this product can support more power-demanding applications effectively.

Address Bus Width:

2 - The 2-bit address bus width provides flexibility in addressing multiple devices, enhancing the product's versatility.

Package Shape:

SQUARE - The square shape enables efficient utilization of space, making it suitable for compact designs or where space is limited.

No. of Terminals:

24 - The 24 terminals allow for versatile connectivity options, supporting various communication configurations.

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE - This design feature ensures optimal heat dissipation and a slim profile, making it suitable for applications with limited space or thermal constraints.

Minimum Supply Voltage:

3 V - With a lower minimum supply voltage, this product provides support for low-power applications, enhancing energy efficiency.

Maximum Operating Temperature:

85 °C - The high maximum operating temperature allows this product to withstand harsh conditions, ensuring reliable performance in demanding environments.

Maximum Data Transfer Rate:

0.625 MBps - The high data transfer rate enables fast and efficient communication between devices, enhancing overall system performance.

Minimum Operating Temperature:

40 °C - The low minimum operating temperature ensures reliable operation in extreme cold environments, increasing the product's usability range.

Terminal Position:

QUAD - The quad terminal position offers increased flexibility for connecting multiple devices or peripherals, enhancing system compatibility.

Maximum Seated Height:

1 mm - The low maximum seated height allows for compact designs and facilitates integration into devices with space constraints.

Width:

4 mm - The 4 mm width offers a compact form factor, making this product suitable for space-restricted applications or designs.

Data Encoding or Decoding Method:

NRZ - The NRZ data encoding or decoding method ensures accurate and reliable data transmission, reducing data errors and improving overall system reliability.

Communication Protocol:

ASYNC, BIT - The ASYNC and BIT communication protocols provide compatibility and flexibility for different communication requirements, making this product suitable for diverse applications.

Maximum Clock Frequency:

80 MHz - With a high maximum clock frequency, this product provides fast and reliable data processing capabilities, facilitating efficient communication and real-time operations.

Length:

4 mm - The 4 mm length contributes to the compact form factor, making this product suitable for space-constrained applications or designs.

Temperature Grade:

INDUSTRIAL - The industrial temperature grade ensures reliable operation in harsh environments, making this product suitable for industrial applications.

Peripheral IC Type:

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL - This product, as a serial I/O and communication controller, is designed to efficiently handle serial data transmission, making it ideal for applications requiring such functionality.

Technology:

CMOS - The CMOS technology used in this product provides low power consumption and enables high-speed data processing, enhancing energy efficiency and overall performance.

Terminal Form:

NO LEAD - The no-lead terminal form offers reliable electrical connections and simplifies the manufacturing and assembly process, making this product user-friendly and cost-effective.

Nominal Supply Voltage:

3.3 V - The nominal supply voltage ensures stable and consistent power supply, contributing to reliable and uninterrupted operation.

No. of Serial I/Os:

1 - The availability of one serial I/O allows for streamlined communication with other devices, simplifying system integration.

Terminal Pitch:

0.5 mm - The fine terminal pitch of 0.5 mm enables high-density packaging, making this product suitable for applications requiring compact designs or space optimization.

Low Power Mode:

YES - This feature allows the product to operate in a low-power mode, conserving energy and extending battery life, which is beneficial for portable or battery-powered devices.

Technical Specifications

Serial Communication Controllers SC16IS750IBS/S900X attributes and parameters. Explore more Serial Communication Controllers devices from NXP Semiconductors

Specs

Additional Features:

CAN ALSO OPERATES AT 2.5 V SUPPLY

Address Bus Width:

2

Boundary Scan:

NO

Maximum Clock Frequency:

80 MHz

Communication Protocol:

ASYNC, BIT

Data Encoding or Decoding Method:

NRZ

Maximum Data Transfer Rate:

.625 MBps

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N24

Length:

4 mm

Low Power Mode:

YES

No. of Serial I/Os:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

4 mm

Trade Compliance

SC16IS750IBS/S900X Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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