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SC16IS750IBS

NXP Semiconductors

SC16IS750IBS by NXP Semiconductors

The NXP SC16IS750IBS is a Serial Communication Controller with 24 terminals, operating at 3-3.6V. It supports data rates up to 0.625 MBps and features low power mode for industrial applications. With a max clock frequency of 80 MHz, it's ideal for asynchronous communication protocols in various electronic devices.

Median Price

$3.080

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (In-Stock)

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Component Electronics Inc.

Canada . 59 parts In-Stock

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$3.080

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$2.310

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$2.000

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USA . 39,300 parts In-Stock

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Digiode

USA . 4,188 parts In-Stock

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Flip Electronics

USA . 1,734 parts In-Stock

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Cyclops Electronics Ltd

UK . 1,037 parts In-Stock

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Nova Conductors

Japan . 870 parts In-Stock

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Anansix

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Vyrian

USA . 824 parts In-Stock

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Tectiva GmbH

Germany . 210 parts In-Stock

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Bristol Electronics

USA . 118 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 117 parts In-Stock

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Flex Direct, LLC

USA . 86 parts In-Stock

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ComSIT Distribution GmbH

Germany . 9 parts In-Stock

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Distributors (Availability)

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One Stop Electronics

USA . 1,057 parts In-Stock

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$6.000

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1,057

$6.000

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AZTECH Wire

Italy . 824 parts In-Stock

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$18.388

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Ampacity Inc.

Singapore . 1,076 parts In-Stock

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$24.000

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Semicontronic

India . 1,397 parts In-Stock

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$29.000

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$28.275

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$28.130

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Aztec Data Supply Inc.

USA . 2,837 parts In-Stock

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$37.900

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Corohmni

South Africa . 19 parts In-Stock

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$42.886

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19

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GreenTree Electronics

Israel . 27,000 parts In-Stock

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Lixinc

USA . 8,869 parts In-Stock

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Kepictronics

USA . 6,350 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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S.R.D Solutions

India . 4,000 parts In-Stock

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Corphita

USA . 3,411 parts In-Stock

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Argo Parts USA

USA . 3,262 parts In-Stock

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Bastille Electronics

Australia . 2,318 parts In-Stock

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Continental Prestige Electronics

USA . 1,330 parts In-Stock

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UNI Independent Distributors

Spain . 160 parts In-Stock

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Overview

Unlock seamless communication with the SC16IS750IBS by NXP Semiconductors, a premium Serial Communication Controller that takes connectivity to new heights. Designed with precision and quality in mind, this versatile chip caters to a wide range of applications. From industrial automation to consumer electronics, this product offers unbeatable value, reliability, and efficiency. Experience the convenience of high-speed data transfer and low power consumption, all in a compact and durable package. Elevate your projects with the SC16IS750IBS and stay ahead in today's fast-paced world.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package lightweight and durable, ideal for portable or rugged applications.

Surface Mount: YES

Being surface mountable makes installation easier and enables a compact design for space-constrained applications.

Maximum Supply Voltage: 3.6 V

Can operate efficiently with a higher supply voltage, providing versatility in different power supply setups.

Address Bus Width: 2

Having a 2-bit address bus width allows for multiple devices to be connected without conflicts in addressing, enhancing scalability.

Power Supplies (V): 2.5/3.3

Support for multiple power supply options ensures compatibility with various systems and power sources.

No. of Terminals: 24

Having 24 terminals provides flexibility in connecting to external components and peripherals, expanding functionality.

Minimum Supply Voltage: 3 V

Can operate efficiently with a lower supply voltage, helping to conserve power and extend battery life in portable devices.

Maximum Operating Temperature: 85 °C

With a high operating temperature range, this product can withstand harsh environmental conditions and industrial settings.

Maximum Data Transfer Rate: 0.625 MBps

Capable of high data transfer rates, facilitating quick communication and data exchange between connected devices.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature, this product can function reliably in cold environments without performance degradation.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The use of nickel, palladium, and gold terminal finish enhances corrosion resistance and ensures long-term reliability of connections.

Maximum Clock Frequency: 80 MHz

Support for high clock frequencies enables rapid data processing and communication, improving overall system performance.

Maximum Time At Peak Reflow Temperature (s): 30

The 30-second maximum time at peak reflow temperature ensures proper soldering and reliability during manufacturing processes.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this product can undergo soldering processes with standard lead-free solder alloys.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this product can operate reliably in demanding environments with varying temperature conditions.

Technology: CMOS

Utilizing CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of systems and interfaces.

Terminal Form: NO LEAD

The no-lead terminal form simplifies soldering processes, reduces soldering defects, and improves overall manufacturing efficiency.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V ensures stable and efficient operation, meeting common voltage requirements in many applications.

Terminal Pitch: 0.5 mm

The 0.5mm terminal pitch allows for high-density mounting on PCBs, enabling a compact and efficient design layout.

Low Power Mode: YES

Support for low power mode helps reduce energy consumption, prolong battery life, and enhance energy efficiency in power-sensitive applications.

Technical Specifications

Serial Communication Controllers SC16IS750IBS attributes and parameters. Explore more Serial Communication Controllers devices from NXP Semiconductors

Specs

Additional Features:

CAN ALSO OPERATES AT 2.5 V SUPPLY

Address Bus Width:

2

Boundary Scan:

NO

Maximum Clock Frequency:

80 MHz

Communication Protocol:

ASYNC, BIT

Data Encoding or Decoding Method:

NRZ

Maximum Data Transfer Rate:

.625 MBps

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N24

JESD-609 Code:

e4

Length:

4 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of Serial I/Os:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC24,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Serial IO/Communication Controllers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Trade Compliance

SC16IS750IBS Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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