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SC16IS750IBS,128

NXP Semiconductors

SC16IS750IBS,128 by NXP Semiconductors

SC16IS750IBS,128 by NXP Semiconductors is a Serial Communication Controller with 24 terminals and operates at a max clock frequency of 80 MHz. It supports communication protocols like ASYNC and BIT, making it ideal for industrial applications requiring high-speed data transfer up to 0.625 MBps. With low power mode capability and a wide temperature range from -40 to 85 °C, this chip carrier package is suitable for various serial IO/communication control tasks.

Median Price

$1.700

Lifecycle Status

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1k+

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Chip1Stop

Japan . 429 parts In-Stock

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$1.700

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Element14

Singapore . 7 parts In-Stock

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$4.830

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$2.990

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$2.690

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7

$4.830

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$2.690

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Farnell

UK . 7 parts In-Stock

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$1.470

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$1.300

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Verical

USA . 4 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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$2.189

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Digiode

USA . 1,683 parts In-Stock

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Anansix

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Vyrian

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Flip Electronics

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Semicontronic

India . 2,076 parts In-Stock

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$1.270

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$1.238

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$1.232

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Ampacity Inc.

Singapore . 1,664 parts In-Stock

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$1.270

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Argo Parts USA

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Netroflash

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$2.189

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$2.146

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Corphita

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$2.745

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Continental Prestige Electronics

USA . 4,489 parts In-Stock

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$3.410

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$2.230

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$1.620

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Microchip USA

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$11.770

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$11.700

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$11.660

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$11.630

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$11.630

Corohmni

South Africa . 271 parts In-Stock

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$21.693

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Aztec Data Supply Inc.

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$36.190

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Modulus Dynamics

Lithuania . 772 parts In-Stock

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$70.944

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$70.944

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

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$88.828

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$84.387

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Perfect Parts

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Lixinc

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QUARKTWIN TECHNOLOGY LTD

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UNI Independent Distributors

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Robosynatics

Brazil . 1,288 parts In-Stock

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Lucentia Tech

USA . 1,288 parts In-Stock

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USA . 500 parts In-Stock

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Overview

Enhance your communication systems with the SC16IS750IBS,128 by NXP Semiconductors, a top-quality Serial Communication Controller designed for seamless data transfer. With a reliable manufacturer like NXP Semiconductors behind it, this chip offers unmatched value and benefits for various applications. Experience improved connectivity, faster data transfer rates, and effortless integration into your projects. Upgrade your devices with the SC16IS750IBS,128 and stay ahead of the competition in the ever-evolving world of technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and long-lasting.

Surface Mount: YES

Allows for easy and efficient mounting on circuit boards, saving space and simplifying the assembly process.

Maximum Supply Voltage: 3.6 V

Can handle higher supply voltages, providing flexibility in power supply options.

Address Bus Width: 2

Efficiently manages address data flow for enhanced performance and reliability.

Package Shape: SQUARE

Square shape allows for easy orientation and placement on circuit boards.

Power Supplies (V): 2.5/3.3

Supports multiple power supply options, increasing compatibility with different systems.

No. of Terminals: 24

Sufficient number of terminals for versatile connectivity and functionality.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Various package styles offer adaptability to different mounting and cooling requirements.

Minimum Supply Voltage: 3 V

Can operate effectively even at lower supply voltages, increasing energy efficiency.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures, ensuring reliable performance in challenging environments.

Maximum Data Transfer Rate: 0.625 MBps

High data transfer rate enables fast and efficient communication between devices.

Minimum Operating Temperature: -40 °C

Can operate in extremely low temperatures, suitable for a wide range of operating environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides excellent conductivity and corrosion resistance for reliable connections.

Terminal Position: QUAD

Quad terminal position allows for stable and secure connections.

Maximum Seated Height: 1 mm

Low profile design saves space on the circuit board.

Width: 4 mm

Compact width allows for tight placement on the board, maximizing space efficiency.

Communication Protocol: ASYNC, BIT

Supports popular communication protocols for seamless integration with existing systems.

Maximum Clock Frequency: 80 MHz

High clock frequency enables fast data processing and communication.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for a sufficient amount of time during assembly.

Peak Reflow Temperature °C: 260

Can endure high reflow temperatures during manufacturing processes.

Length: 4 mm

Compact length allows for flexible placement on the circuit board.

Temperature Grade: INDUSTRIAL

Suitable for industrial applications with rugged design and temperature tolerance.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

Designed for efficient and reliable serial communication tasks.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Terminal Form: NO LEAD

Lead-free terminal form for environmentally friendly and RoHS compliant operation.

Nominal Supply Voltage: 3.3 V

Stable supply voltage for consistent performance.

Terminal Pitch: 0.5 mm

Fine pitch terminals for precise and secure connections.

Low Power Mode: YES

Supports low power mode for energy efficiency and extended battery life.

Technical Specifications

Serial Communication Controllers SC16IS750IBS,128 attributes and parameters. Explore more Serial Communication Controllers devices from NXP Semiconductors

Specs

Additional Features:

ALSO OPERATES AT 2.5V SUPPLY

Address Bus Width:

2

Boundary Scan:

NO

Maximum Clock Frequency:

80 MHz

Communication Protocol:

ASYNC, BIT

Maximum Data Transfer Rate:

.625 MBps

JESD-30 Code:

S-PQCC-N24

JESD-609 Code:

e4

Length:

4 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of Serial I/Os:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC24,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Serial IO/Communication Controllers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Trade Compliance

SC16IS750IBS,128 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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