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TL16C2550PFBRG4

Texas Instruments

TL16C2550PFBRG4 by Texas Instruments

TL16C2550PFBRG4 by Texas Instruments is a Serial Communication Controller with 5.5V max supply voltage, 24MHz clock frequency, and 0.1875MBps data transfer rate. Ideal for applications requiring high-speed asynchronous communication in commercial-grade environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,678 parts In-Stock

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Chip Stock

USA . 2,582 parts In-Stock

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2,582

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Digiode

USA . 2,112 parts In-Stock

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Nova Conductors

Japan . 650 parts In-Stock

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650

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Distributors (Availability)

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AZTECH Wire

Italy . 858 parts In-Stock

1+ parts

$6.051

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858

$6.051

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Ampacity Inc.

Singapore . 1,268 parts In-Stock

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$15.000

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Parana Technologies

USA . 729 parts In-Stock

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$17.600

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$17.792

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729

$17.600

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DigiPath Technology Company

USA . 2,148 parts In-Stock

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$19.380

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$17.829

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$19.380

$17.829

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ChromeModa Solutions

Germany . 3,873 parts In-Stock

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$19.775

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$16.216

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$19.775

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IDEA Electronic Components Group

UK . 2,128 parts In-Stock

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$19.775

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$18.786

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$17.798

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2,128

$19.775

$18.786

$17.798

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One Stop Electronics

USA . 842 parts In-Stock

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$20.000

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Semicontronic

India . 1,644 parts In-Stock

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$27.000

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$26.325

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$26.190

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$26.190

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Continental Prestige Electronics

USA . 5,451 parts In-Stock

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Argo Parts USA

USA . 2,988 parts In-Stock

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Corphita

USA . 1,259 parts In-Stock

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Aranea Global

USA . 100 parts In-Stock

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Overview

Unlock seamless communication with the TL16C2550PFBRG4 from Texas Instruments, a leading manufacturer known for top-quality products. As part of the Serial Communication Controllers category, this device offers reliable data transfer at a blazing speed of 0.1875 MBps. Perfect for various applications, this controller features a durable plastic/epoxy package body and surface mount capability, making it a versatile and efficient solution for your communication needs. Experience the value and benefits of this innovative product today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and cost-effective.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto PCBs.

Maximum Supply Voltage: 5.5 V

Can support a wide range of applications without the risk of overloading.

Address Bus Width: 3

Offers flexibility and compatibility with various system architectures.

Package Shape: SQUARE

Square shape enables efficient use of board space.

Power Supplies (V): 1.8/5

Supports a wide range of power supply options for versatility.

No. of Terminals: 48

Sufficient terminals for connecting to various external devices.

Package Style (Meter): FLATPACK, THIN PROFILE, FINE PITCH

The package style allows for efficient heat dissipation and compact design.

Minimum Supply Voltage: 4.5 V

Ensures stable operation even at lower voltage levels.

Maximum Operating Temperature: 70 °C

Can operate reliably in high-temperature environments.

Maximum Data Transfer Rate: 0.1875 MBps

Provides fast and efficient data transfer speeds.

Minimum Operating Temperature: 0 °C

Can operate in a wide range of temperature conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Ensures good connectivity and resistance to corrosion for long-term use.

Terminal Position: QUAD

Quad terminal position facilitates secure attachment to the PCB.

Maximum Seated Height: 1.2 mm

Low profile design is space-saving and suitable for compact applications.

Width: 7 mm

Compact width for easy integration into various system designs.

External Data Bus Width: 8

Supports high-volume data processing and transfer.

Communication Protocol: ASYNC, BIT

Compatible with common communication protocols for easy integration.

Maximum Clock Frequency: 24 MHz

High clock frequency allows for efficient data processing.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand high-temperature reflow processes for manufacturing.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance for soldering processes.

Length: 7 mm

Compact length for space-efficient PCB layout.

Temperature Grade: COMMERCIAL

Suitable for standard commercial applications.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

Versatile for various serial communication applications.

Technology: CMOS

Uses CMOS technology for low power consumption and high reliability.

Terminal Form: GULL WING

Gull wing terminal form allows for easy soldering and secure connection.

Nominal Supply Voltage: 5 V

Compatible with standard 5V power sources.

No. of Serial I/Os: 2

Provides multiple serial I/O options for versatile connectivity.

Terminal Pitch: 0.5 mm

Fine terminal pitch for easy PCB integration.

Moisture Sensitivity Level (MSL): 2

Moderate moisture sensitivity level for standard handling and storage conditions.

Technical Specifications

Serial Communication Controllers TL16C2550PFBRG4 attributes and parameters. Explore more Serial Communication Controllers devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 1.8V MINIMUM SUPPLY AT 10MHZ

Address Bus Width:

3

Boundary Scan:

NO

Maximum Clock Frequency:

24 MHz

Communication Protocol:

ASYNC, BIT

Maximum Data Transfer Rate:

.1875 MBps

External Data Bus Width:

8

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e4

Length:

7 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

2

No. of Serial I/Os:

2

No. of Terminals:

48

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP48,.35SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Serial IO/Communication Controllers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

TL16C2550PFBRG4 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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