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TL16C754BPN

Texas Instruments

TL16C754BPN by Texas Instruments

TL16C754BPN by Texas Instruments is a Serial Communication Controller with 80 terminals, operating at 3.3/5V. It supports data rates up to 0.375 MBps and features low power mode for industrial applications requiring asynchronous communication at up to 50 MHz clock frequency.

Median Price

$41.920

Lifecycle Status

Suppliers In-Stock

26

In-Stock Inventory

1k+

Distributors (Authorized)

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Verical

USA . 1 parts In-Stock

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$41.920

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$29.920

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1

$41.920

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Mouser Electronics

USA . 619 parts In-Stock

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$54.520

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$44.670

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$39.210

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Arrow

USA . 119 parts In-Stock

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$41.493

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Nova Conductors

Japan . 750 parts In-Stock

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$14.248

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750

$14.248

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Component Electronics Inc.

Canada . 9 parts In-Stock

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$15.380

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$11.540

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Digiode

USA . 4,539 parts In-Stock

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Voyager Components

USA . 2 parts In-Stock

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$41.500

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$41.500

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$41.500

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$41.500

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$41.500

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$41.500

Vyrian

USA . 4,660 parts In-Stock

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Chip Stock

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Avant Electronics Limited

UK . 109 parts In-Stock

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Prism Electronics

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Bristol Electronics

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Zilex Electronics Inc.

Canada . 25 parts In-Stock

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First Choice Components Inc.

USA . 17 parts In-Stock

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Classic Components Corporation

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QIE Inc.

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Inventory MP

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Atlantic Semiconductor

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Resion

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Euro-Tech

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A2Z Electronics, Inc.

USA . 8 parts In-Stock

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8

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Component Sense

UK . 5 parts In-Stock

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R&J Components

USA . 4 parts In-Stock

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Tectiva GmbH

Germany . 4 parts In-Stock

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ComSIT Distribution GmbH

Germany . 3 parts In-Stock

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North Shore Components

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Distributors (Availability)

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AZTECH Wire

Italy . 659 parts In-Stock

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$6.139

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659

$6.139

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Continental Prestige Electronics

USA . 6,221 parts In-Stock

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$14.248

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$13.963

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Netroflash

USA . 50 parts In-Stock

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$14.248

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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$15.702

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$14.917

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$14.917

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$15.702

$14.917

$14.917

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Semicontronic

India . 237 parts In-Stock

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$25.740

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$25.096

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$24.968

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$25.740

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$24.968

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Ampacity Inc.

Singapore . 88 parts In-Stock

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$25.740

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Corphita

USA . 4,705 parts In-Stock

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$26.343

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Component Stockers USA

USA . 5 parts In-Stock

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$37.630

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Parana Technologies

USA . 695 parts In-Stock

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$44.133

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695

$44.133

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DigiPath Technology Company

USA . 1,235 parts In-Stock

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$48.596

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$44.709

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1,235

$48.596

$44.709

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ChromeModa Solutions

Germany . 5,114 parts In-Stock

1+ parts

$49.588

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$40.662

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$49.588

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IDEA Electronic Components Group

UK . 1,422 parts In-Stock

1+ parts

$49.588

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$47.109

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$44.629

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$49.588

$47.109

$44.629

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Microchip USA

USA . 321 parts In-Stock

1+ parts

$69.800

100+ parts

$68.590

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$67.980

10k+ parts

$67.370

321

$69.800

$68.590

$67.980

$67.370

Corohmni

South Africa . 846 parts In-Stock

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$71.341

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$71.341

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Kepictronics

USA . 7,500 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,197 parts In-Stock

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Argo Parts USA

USA . 1,452 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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Lixinc

USA . 270 parts In-Stock

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Assy Fe

Spain . 3 parts In-Stock

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Overview

Unlock seamless and reliable serial communication with the Texas Instruments TL16C754BPN. Crafted by a trusted manufacturer, this Serial Communication Controller offers unparalleled quality and performance. Perfect for industrial applications, this product boasts a maximum data transfer rate of 0.375 MBps, ensuring swift and efficient data transmission. With low power mode capabilities and a wide supply voltage range, customers can enjoy the flexibility and value this controller brings to their projects. Revolutionize your communication systems today with the TL16C754BPN.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material is lightweight and durable, making it a good choice for portable electronic devices.

Surface Mount:

YES - Allows for easy and secure mounting on circuit boards, saving space and simplifying assembly processes.

Maximum Supply Voltage:

5.5 V - Provides a wide voltage range for flexibility in different power supply configurations.

Address Bus Width:

3 - Supports efficient communication between multiple devices connected to the controller.

Package Shape:

SQUARE - Ideal for maximizing space utilization on a circuit board.

Power Supplies (V):

3.3/5 - Compatible with various power sources, enabling versatility in system design.

No. of Terminals:

80 - Offers ample connection points for interfacing with other components in the system.

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH - Ensures a compact and slim profile for space-constrained applications.

Minimum Supply Voltage:

4.5 V - Allows operation at lower voltages for energy efficiency and extended battery life.

Maximum Operating Temperature:

85 °C - Ensures reliable performance in high-temperature environments.

Maximum Data Transfer Rate:

0.375 MBps - Enables fast and efficient transmission of data between devices.

Minimum Operating Temperature:

40 °C - Suitable for use in extreme cold conditions without compromising functionality.

Terminal Finish:

NICKEL PALLADIUM GOLD - Provides excellent corrosion resistance and ensures reliable electrical connections.

Terminal Position:

QUAD - Facilitates organized and secure connections on the circuit board.

Maximum Seated Height:

1.6 mm - Low-profile design for compact and space-saving installations.

Width:

12 mm - Compact form factor for efficient placement on a PCB.

Data Encoding or Decoding Method:

NRZ - Allows for simplified data transmission and reception protocols.

External Data Bus Width:

8 - Supports wide data paths for high-speed communication between devices.

Communication Protocol:

ASYNC, BIT - Compatible with industry-standard communication protocols for seamless integration into existing systems.

Maximum Clock Frequency:

50 MHz - Supports high-speed data processing and communication.

Maximum Time At Peak Reflow Temperature (s):

30 - Ensures proper soldering and assembly during manufacturing processes.

Peak Reflow Temperature °C:

260 - Suitable for high-temperature reflow soldering processes.

Length:

12 mm - Compact size for efficient use of space on a PCB.

Temperature Grade:

INDUSTRIAL - Designed to withstand harsh industrial operating conditions.

Peripheral IC Type:

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL - Provides robust serial communication capabilities for various applications.

Technology:

CMOS - Offers low power consumption and compatibility with modern electronic systems.

Terminal Form:

GULL WING - Enables easy and reliable soldering on the circuit board.

Nominal Supply Voltage:

5 V - Standard voltage requirement for compatibility with a wide range of power sources.

No. of Serial I/Os:

4 - Supports multiple simultaneous serial data transfers for enhanced connectivity options.

Terminal Pitch:

0.5 mm - Fine pitch spacing for compact layout designs on the PCB.

Moisture Sensitivity Level (MSL):

3 - Resistant to moisture ingress, ensuring reliability in humid environments.

Low Power Mode:

YES - Allows for energy-efficient operation, prolonging battery life in portable devices.

Technical Specifications

Serial Communication Controllers TL16C754BPN attributes and parameters. Explore more Serial Communication Controllers devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 3.3V SUPPLY

Address Bus Width:

3

Boundary Scan:

NO

Maximum Clock Frequency:

50 MHz

Communication Protocol:

ASYNC, BIT

Data Encoding or Decoding Method:

NRZ

Maximum Data Transfer Rate:

.375 MBps

External Data Bus Width:

8

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Serial I/Os:

4

No. of Terminals:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Serial IO/Communication Controllers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Trade Compliance

TL16C754BPN Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-611-4596, 5962016114596

NIIN

016114596

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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