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LAN7850T-I/8JX

Microchip Technology

LAN7850T-I/8JX by Microchip Technology

LAN7850T-I/8JX by Microchip: Serial Communication Controller with 125 MBps data rate, 25 MHz clock frequency. Ideal for USB bus compatibility and low power mode applications in industrial settings. Features include 56 terminals, -40 to 85 °C operating temperature range, and boundary scan capability.

Median Price

$11.430

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$11.430

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10

$11.430

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Chip Stock

USA . 9,480 parts In-Stock

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9,480

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Vyrian

USA . 3,156 parts In-Stock

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3,156

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Goldney Electronics S.L.

Spain . 81 parts In-Stock

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81

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Distributors (Availability)

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Semicontronic

India . 5,727 parts In-Stock

1+ parts

$8.300

100+ parts

$8.092

1k+ parts

$8.051

10k+ parts

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5,727

$8.300

$8.092

$8.051

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Ampacity Inc.

Singapore . 5,720 parts In-Stock

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$8.300

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5,720

$8.300

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AZTECH Wire

Italy . 77 parts In-Stock

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$8.540

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77

$8.540

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Continental Prestige Electronics

USA . 5,662 parts In-Stock

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$11.430

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$11.201

5,662

$11.430

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$11.201

Netroflash

USA . 100 parts In-Stock

1+ parts

$11.430

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$11.201

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100

$11.430

$11.201

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Microchip USA

USA . 4,033 parts In-Stock

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$23.461

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4,033

$23.461

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Aztec Data Supply Inc.

USA . 930 parts In-Stock

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$23.890

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930

$23.890

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Corohmni

South Africa . 49 parts In-Stock

1+ parts

$30.755

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49

$30.755

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Lixinc

USA . 10,736 parts In-Stock

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10,736

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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West Coast Incorporated

USA . 3,404 parts In-Stock

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Argo Parts USA

USA . 1,058 parts In-Stock

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Overview

Experience seamless and efficient communication with the LAN7850T-I/8JX by Microchip Technology. Crafted with precision and reliability in mind, this Serial Communication Controller offers unparalleled performance and versatility for a wide range of applications. With its advanced technology and industrial-grade design, this product ensures optimal functionality and speed, making it the perfect choice for all your communication needs. Trust in Microchip Technology to deliver top-notch quality and innovation that will elevate your projects to the next level. Choose the LAN7850T-I/8JX today and experience the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for various applications and environments.

Maximum Supply Voltage: 1.26 V

Offers a higher supply voltage capacity, allowing for additional flexibility in power input.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of these package styles ensures efficient heat dissipation and a compact design for space-constrained applications.

Maximum Data Transfer Rate: 125 MBps

High data transfer rate enables faster communication, ideal for applications that require quick and efficient data exchange.

Maximum Clock Frequency: 25 MHz

Higher clock frequency allows for faster processing speeds, enhancing overall performance.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, LAN

Equipped with advanced peripheral ICs for serial communication and LAN connectivity, expanding the product's compatibility and functionality.

Bus Compatibility: USB

Support for USB bus compatibility enables easy integration into various systems and devices that use USB interfaces.

Technical Specifications

Serial Communication Controllers LAN7850T-I/8JX attributes and parameters. Explore more Serial Communication Controllers devices from Microchip Technology

Specs

Address Bus Width:

0

Boundary Scan:

YES

Bus Compatibility:

USB

Maximum Clock Frequency:

25 MHz

Communication Protocol:

ASYNC, BIT; SYNC, BYTE

Maximum Data Transfer Rate:

125 MBps

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N56

Length:

8 mm

Low Power Mode:

YES

No. of Serial I/Os:

2

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC56,.31SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

1 mm

Maximum Supply Current:

183 mA

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.1 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

8 mm

Trade Compliance

LAN7850T-I/8JX Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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