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LAN7431-I/YXX

Microchip Technology

LAN7431-I/YXX by Microchip Technology

LAN7431-I/YXX by Microchip Technology is a Serial Communication Controller with 72 terminals, supporting SYNC and BYTE communication protocols for Ethernet. It operates at -40 to 85 °C, with a data transfer rate of 256 MBps and max clock frequency of 25 MHz. Ideal for PCI bus compatibility in industrial applications requiring low power mode.

Median Price

$8.532

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 8 parts In-Stock

1+ parts

$8.513

100+ parts

$7.000

1k+ parts

-

10k+ parts

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8

$8.513

$7.000

-

-

DigiKey

USA . 992 parts In-Stock

1+ parts

$8.550

100+ parts

$6.888

1k+ parts

-

10k+ parts

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992

$8.550

$6.888

-

-

Mouser Electronics

USA . 119 parts In-Stock

1+ parts

$8.550

100+ parts

$7.060

1k+ parts

-

10k+ parts

-

119

$8.550

$7.060

-

-

Farnell

UK . 26 parts In-Stock

1+ parts

$8.908

100+ parts

$7.961

1k+ parts

$7.494

10k+ parts

-

26

$8.908

$7.961

$7.494

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Element14

Singapore . 26 parts In-Stock

1+ parts

$9.289

100+ parts

$8.164

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-

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26

$9.289

$8.164

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Master Electronics

USA . 188 parts In-Stock

1+ parts

-

100+ parts

$6.910

1k+ parts

$6.650

10k+ parts

$6.620

188

-

$6.910

$6.650

$6.620

Verical

USA . 185 parts In-Stock

1+ parts

-

100+ parts

$8.129

1k+ parts

$7.906

10k+ parts

-

185

-

$8.129

$7.906

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RS (Exports)

UK . 75 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$7.430

10k+ parts

-

75

-

-

$7.430

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$7.510

100+ parts

-

1k+ parts

-

10k+ parts

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500

$7.510

-

-

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Vyrian

USA . 8,938 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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8,938

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-

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IBS Electronics

USA . 188 parts In-Stock

1+ parts

-

100+ parts

$9.691

1k+ parts

$9.327

10k+ parts

$9.285

188

-

$9.691

$9.327

$9.285

ComSIT Distribution GmbH

Germany . 3 parts In-Stock

1+ parts

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100+ parts

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3

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 105 parts In-Stock

1+ parts

$6.020

100+ parts

-

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105

$6.020

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-

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Continental Prestige Electronics

USA . 105 parts In-Stock

1+ parts

$6.930

100+ parts

$5.720

1k+ parts

-

10k+ parts

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105

$6.930

$5.720

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

$7.510

100+ parts

$7.360

1k+ parts

-

10k+ parts

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1,000

$7.510

$7.360

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-

Semicontronic

India . 68 parts In-Stock

1+ parts

$13.100

100+ parts

$12.772

1k+ parts

$12.707

10k+ parts

-

68

$13.100

$12.772

$12.707

-

Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$18.348

100+ parts

$16.697

1k+ parts

$15.045

10k+ parts

-

1,000

$18.348

$16.697

$15.045

-

Aztec Data Supply Inc.

USA . 4,201 parts In-Stock

1+ parts

$72.000

100+ parts

-

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4,201

$72.000

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Corohmni

South Africa . 166 parts In-Stock

1+ parts

$75.224

100+ parts

-

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166

$75.224

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Lixinc

USA . 10,147 parts In-Stock

1+ parts

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10,147

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Fulton Briggs Corp.

USA . 7,030 parts In-Stock

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7,030

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Eastek

USA . 2,016 parts In-Stock

1+ parts

-

100+ parts

$11.040

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2,016

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$11.040

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Computer Components Inc. - USA

USA . 2,000 parts In-Stock

1+ parts

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100+ parts

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2,000

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

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100+ parts

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1,000

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Argo Parts USA

USA . 535 parts In-Stock

1+ parts

-

100+ parts

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535

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Overview

Enhance your communication systems with the LAN7431-I/YXX from Microchip Technology, a leading manufacturer known for top-quality products. As a Serial Communication Controller, this device offers high-speed data transfer rates of up to 256 MBps and is compatible with PCI bus systems. Ideal for industrial applications, it operates efficiently in extreme temperatures and low power mode, ensuring reliable performance. Upgrade your network infrastructure with the LAN7431-I/YXX and experience seamless connectivity and enhanced communication capabilities.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and efficient PCB assembly, saving time and effort in production.

Maximum Supply Voltage: 1.32 V

Provides flexibility in voltage requirements for different applications.

Screening Level: TS 16949

Ensures high quality and reliability as per the automotive industry standards.

Package Shape: SQUARE

Square package shape allows for efficient use of PCB space and better thermal performance.

No. of Terminals: 72

Provides a wide range of interface options and connectivity for various peripherals.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Innovative package style offering thermal management and space-saving benefits.

Minimum Supply Voltage: 1.14 V

Allows operation in low voltage conditions, increasing efficiency and reducing power consumption.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, suitable for industrial applications.

Maximum Data Transfer Rate: 256 MBps

High data transfer rate ensures smooth and fast communication between devices.

Minimum Operating Temperature: -40 °C

Capable of operating in extreme cold conditions, making it versatile for various environments.

Terminal Finish: MATTE TIN

Provides a durable and reliable finish for long-term use.

Terminal Position: QUAD

Quad terminal position allows for efficient routing and connection of signals.

Maximum Seated Height: 1 mm

Low profile design for compact and space-constrained applications.

Width: 10 mm

Compact width for easy integration into different system designs.

Boundary Scan: YES

Allows for testing and debugging of connections and signals in the system.

Communication Protocol: SYNC, BYTE; ETHERNET

Support for multiple communication protocols ensures compatibility with a wide range of devices.

Maximum Clock Frequency: 25 MHz

High clock frequency for fast data processing and communication.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering and reflow process during manufacturing.

Peak Reflow Temperature °C: 260

High peak reflow temperature for secure and robust solder joints.

Length: 10 mm

Compact length for space-saving and efficient PCB layout.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range for reliable operation in harsh environments.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

Designed for serial communication and I/O control, suitable for a range of applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Terminal Form: NO LEAD

Lead-free terminal form for environmentally friendly and RoHS compliant design.

Nominal Supply Voltage: 1.2 V

Stable and efficient supply voltage for consistent performance.

No. of Serial I/Os: 4

Multiple serial I/Os for versatile connectivity options.

Bus Compatibility: PCI

PCI bus compatibility for seamless integration into existing systems and platforms.

Terminal Pitch: 0.5 mm

Fine terminal pitch for high-density PCB layout and miniaturization.

Moisture Sensitivity Level (MSL): 3

MSL level 3 ensures proper handling and storage to prevent moisture-related damage.

Low Power Mode: YES

Low power mode for energy efficiency and extended battery life.

Technical Specifications

Serial Communication Controllers LAN7431-I/YXX attributes and parameters. Explore more Serial Communication Controllers devices from Microchip Technology

Specs

Additional Features:

ALSO HAVING NETWORK PROTOCOLS IEEE 802.3AZ; IEEE 802.1Q; IEEE 802.3X

Address Bus Width:

0

Boundary Scan:

YES

Bus Compatibility:

PCI

Maximum Clock Frequency:

25 MHz

Communication Protocol:

SYNC, BYTE; ETHERNET

Maximum Data Transfer Rate:

256 MBps

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N72

JESD-609 Code:

e3

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Serial I/Os:

4

No. of Terminals:

72

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Screening Level:

TS 16949

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Trade Compliance

LAN7431-I/YXX Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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