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LAN7850-I/4F

Microchip Technology

LAN7850-I/4F by Microchip Technology

LAN7850-I/4F by Microchip offers 125 MBps data rate, 25 MHz clock frequency, and operates from -40 to 85 °C. Ideal for industrial applications requiring high-speed serial communication controllers with SYNC, BYTE, and Ethernet protocols.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 800 parts In-Stock

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800

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Vyrian

USA . 408 parts In-Stock

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408

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Distributors (Availability)

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Ampacity Inc.

Singapore . 877 parts In-Stock

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$13.000

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877

$13.000

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AZTECH Wire

Italy . 877 parts In-Stock

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$18.889

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877

$18.889

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Semicontronic

India . 860 parts In-Stock

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$23.000

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$22.425

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$22.310

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860

$23.000

$22.425

$22.310

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Aztec Data Supply Inc.

USA . 2,973 parts In-Stock

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$45.890

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2,973

$45.890

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Corohmni

South Africa . 97 parts In-Stock

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$54.964

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97

$54.964

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Continental Prestige Electronics

USA . 6,502 parts In-Stock

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West Coast Incorporated

USA . 1,974 parts In-Stock

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Argo Parts USA

USA . 883 parts In-Stock

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883

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Bastille Electronics

Australia . 450 parts In-Stock

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Overview

Experience seamless and reliable connectivity with the LAN7850-I/4F by Microchip Technology. As a leading manufacturer in serial communication controllers, Microchip Technology ensures top-notch quality and performance in every product they create. The LAN7850-I/4F offers high-speed data transfer rates of up to 125 MBps, making it perfect for various applications in industries such as automotive, industrial automation, and consumer electronics. With its low power mode and industrial temperature grade, this chip carrier is designed to provide lasting value and benefits to our customers. Upgrade your communication protocols with the LAN7850-I/4F and stay connected effortlessly.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Surface Mount: YES

Allows for easy and efficient installation on a circuit board, saving time and effort during assembly.

Maximum Supply Voltage: 1.26 V

Allows for a wide range of input voltages, increasing compatibility with different systems.

Screening Level: TS 16949

Meets stringent quality standards, ensuring reliability and performance in various industrial applications.

Package Shape: SQUARE

Optimizes space utilization on the circuit board, ideal for compact designs.

No. of Terminals: 56

Provides a high level of connectivity, allowing for versatile integration with other components.

Maximum Data Transfer Rate: 125 MBps

Enables fast and efficient data communication, essential for high-speed applications.

Maximum Clock Frequency: 25 MHz

Supports high-frequency operation, ensuring smooth and reliable data transmission.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh environmental conditions, suitable for industrial use.

Technology: CMOS

Utilizes low power consumption and offers high noise immunity, enhancing overall efficiency.

Technical Specifications

Serial Communication Controllers LAN7850-I/4F attributes and parameters. Explore more Serial Communication Controllers devices from Microchip Technology

Specs

Boundary Scan:

YES

Maximum Clock Frequency:

25 MHz

Communication Protocol:

SYNC, BYTE; ETHERNET

Maximum Data Transfer Rate:

125 MBps

JESD-30 Code:

S-PQCC-N56

Length:

8 mm

Low Power Mode:

YES

No. of DMA Channels:

0

No. of I/O Lines:

11

No. of Serial I/Os:

0

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC56,.31SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG

Screening Level:

TS 16949

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.1 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

8 mm

Trade Compliance

LAN7850-I/4F Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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