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LAN91C111-NU

Microchip Technology

LAN91C111-NU by Microchip Technology

LAN91C111-NU by Microchip Technology is a Serial Communication Controller with 128 terminals, supporting data rates up to 12.5 MBps. It operates b/w 0-70°C and has low power mode, making it ideal for Ethernet communication in various applications requiring high-speed data transfer at a max clock frequency of 25 MHz.

Median Price

$30.684

Lifecycle Status

Suppliers In-Stock

31

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Future Electronics

Canada . 532 parts In-Stock

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$27.020

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$25.730

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Chip1Stop

Japan . 509 parts In-Stock

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Arrow

USA . 3 parts In-Stock

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$26.550

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Farnell

UK . 116 parts In-Stock

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$30.274

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$29.142

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$28.577

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Element14

Singapore . 114 parts In-Stock

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$31.095

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$27.728

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Distrelec

Netherlands . 80 parts In-Stock

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DigiKey

USA . 1,261 parts In-Stock

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$25.725

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Mouser Electronics

USA . 578 parts In-Stock

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Newark

USA . 57 parts In-Stock

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$27.460

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Master Electronics

USA . 845 parts In-Stock

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Verical

USA . 845 parts In-Stock

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Avnet

USA . 90 parts In-Stock

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Distributors (In-Stock)

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Nova Conductors

Japan . 36 parts In-Stock

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Electro Sonic

Canada . 11,255 parts In-Stock

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$25.840

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$25.310

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IBS Electronics

USA . 1,467 parts In-Stock

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$33.969

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Semtec, LLC

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Chip Stock

USA . 7,596 parts In-Stock

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Vyrian

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Cyclops Electronics Ltd

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Bristol Electronics

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Atlantic Semiconductor

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Martec Srl

Italy . 35 parts In-Stock

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Elcom Components

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Sensible Micro Corp

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ComSIT Distribution GmbH

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Semi Source

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Prism Electronics

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QIE Inc.

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ACDS - Activité Composants Distribution Service

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Ampacity Inc.

Singapore . 599 parts In-Stock

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$19.970

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Semicontronic

India . 520 parts In-Stock

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$19.970

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$19.471

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$19.371

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Continental Prestige Electronics

USA . 3 parts In-Stock

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$22.430

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$20.180

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$22.430

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Corohmni

South Africa . 1,812 parts In-Stock

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$27.998

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CoreStaff

Japan . 90 parts In-Stock

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$39.502

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$39.502

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Aztec Data Supply Inc.

USA . 3,353 parts In-Stock

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$78.290

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GreenTree Electronics

Israel . 10,260 parts In-Stock

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LOOK Integrated Logistics

Peru . 8,288 parts In-Stock

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Kepictronics

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Montano Global Distributors

Canada . 7,924 parts In-Stock

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NIA Electronics

USA . 7,885 parts In-Stock

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Ledger Components

France . 7,885 parts In-Stock

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Perfect Parts

USA . 6,720 parts In-Stock

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Alle Elektronik GmbH

Germany . 5,033 parts In-Stock

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LMD Electronica

Estonia . 4,712 parts In-Stock

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Futuretech Components

Singapore . 3,000 parts In-Stock

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Argo Parts USA

USA . 2,762 parts In-Stock

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Epart123

USA . 1,800 parts In-Stock

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Assy Fe

Spain . 1,800 parts In-Stock

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Eastek

USA . 170 parts In-Stock

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Computer Components Inc. - USA

USA . 118 parts In-Stock

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Infinite Electronics LLP (Excess)

. 94 parts In-Stock

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ChipstoGo Electronic ltd

UK . 7 parts In-Stock

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Overview

Unlock seamless and efficient data communication with the LAN91C111-NU by Microchip Technology. This industry-leading Serial Communication Controller offers unparalleled reliability and performance, making it ideal for a wide range of applications. With its advanced technology and high data transfer rate, this product delivers exceptional value and benefits to customers looking for top-notch connectivity solutions. Experience the advantages of Microchip's quality engineering and innovative design with the LAN91C111-NU today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the internal components of the product, ensuring a longer lifespan.

Surface Mount: YES

Surface mount technology allows for efficient and compact assembly of the product, saving space and potentially reducing costs.

Maximum Supply Voltage: 3.63 V

Higher maximum supply voltage provides flexibility in power input options, allowing compatibility with a wide range of power sources.

Address Bus Width: 16

Wider address bus width enables the product to handle larger amounts of memory and data, improving performance and capacity.

Screening Level: TS 16949

TS 16949 screening ensures high quality and reliability in the manufacturing process, resulting in a dependable and consistent product.

Package Shape: SQUARE

Square package shape facilitates easier integration and placement within circuit boards, optimizing space usage and layout design.

No. of Terminals: 128

Higher number of terminals allows for more connectivity options and functions, enhancing the versatility and compatibility of the product.

Package Style (Meter): FLATPACK, THIN PROFILE, FINE PITCH

The combination of flatpack, thin profile, and fine pitch package style offers a slim and compact form factor, ideal for space-constrained applications.

Minimum Supply Voltage: 2.97 V

Lower minimum supply voltage allows for operation in lower power scenarios, increasing energy efficiency and potentially extending battery life.

Maximum Operating Temperature: 70 °C

High maximum operating temperature ensures reliable performance even in demanding environmental conditions, offering robust stability and durability.

Maximum Data Transfer Rate: 12.5 MBps

High data transfer rate allows for quick and efficient communication, vital for fast-paced applications and real-time data processing.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature ensures functionality in cold environments, making the product suitable for a wide range of operating conditions.

Terminal Finish: MATTE TIN

Matte tin finish provides corrosion resistance and solderability, ensuring reliable connections and longevity of the product.

Terminal Position: QUAD

Quad terminal position offers enhanced stability and robustness during assembly and operation, reducing the risk of connection issues or damage.

Maximum Seated Height: 1.2 mm

Low maximum seated height contributes to a slim and compact design, useful for applications where space is limited or a streamlined profile is preferred.

Width: 14 mm

Moderate width measurement allows for a balance between space efficiency and ease of integration, providing versatility in various installation setups.

Data Encoding or Decoding Method: NRZ; BIPH-LEVEL(MANCHESTER)

Advanced data encoding/decoding methods ensure accurate and efficient data transmission, reducing errors and improving overall system reliability.

External Data Bus Width: 32

Wide external data bus width accommodates larger data transfers, supporting high-bandwidth applications and increasing data processing capabilities.

Communication Protocol: SYNC, BIT, BYTE, ETHERNET

Support for multiple communication protocols offers compatibility with various systems and networks, enhancing connectivity and interoperability.

Maximum Clock Frequency: 25 MHz

High maximum clock frequency enables fast data processing and communication speed, crucial for handling real-time tasks and demanding applications.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures secure soldering connections during assembly, enhancing the product's durability and reliability in harsh conditions.

Length: 14 mm

Compact length dimension contributes to the overall small footprint of the product, making it suitable for space-constrained installations and compact designs.

Temperature Grade: COMMERCIAL

Commercial temperature grade indicates suitability for standard operating environments, providing reliability and performance in typical commercial applications.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, LAN

Inclusion of serial IO/communication controller and LAN peripheral IC types expands the product's connectivity options and capabilities, enhancing its versatility.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ensuring efficient operation and reliable performance in a variety of applications.

Terminal Form: GULL WING

Gull wing terminal form provides secure and reliable connections during assembly, reducing the risk of solder joint failures and signal interruptions.

Maximum Supply Current: 140 mA

Moderate maximum supply current consumption indicates energy efficiency and optimized power usage, important for prolonging battery life and reducing operating costs.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage ensures consistent performance and compatibility with standard power sources, offering reliable operation in various scenarios.

No. of Serial I/Os: 4

Multiple serial I/Os increase connectivity options and data transfer capabilities, enabling the product to handle diverse communication requirements effectively.

Bus Compatibility: 680X0; 683XX

Compatibility with 680X0 and 683XX bus architectures ensures integration with a wide range of systems and devices, enhancing interoperability and flexibility.

Terminal Pitch: 0.4 mm

Fine terminal pitch allows for compact and densely populated designs, useful for high-density PCB layouts and space-constrained applications.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates a moderate moisture sensitivity, suitable for standard handling and storage conditions without strict humidity control requirements.

Low Power Mode: YES

Inclusion of low power mode enhances energy efficiency and reduces power consumption during idle or low-demand periods, promoting sustainable operation and battery life.

Technical Specifications

Serial Communication Controllers LAN91C111-NU attributes and parameters. Explore more Serial Communication Controllers devices from Microchip Technology

Specs

Address Bus Width:

16

Boundary Scan:

NO

Bus Compatibility:

680X0; 683XX

Maximum Clock Frequency:

25 MHz

Communication Protocol:

SYNC, BIT, BYTE, ETHERNET

Data Encoding or Decoding Method:

NRZ; BIPH-LEVEL(MANCHESTER)

Maximum Data Transfer Rate:

12.5 MBps

External Data Bus Width:

32

JESD-30 Code:

S-PQFP-G128

JESD-609 Code:

e3

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Serial I/Os:

4

No. of Terminals:

128

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP128,.63SQ,16

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Screening Level:

TS 16949

Maximum Seated Height:

1.2 mm

Maximum Supply Current:

140 mA

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

2.97 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width:

14 mm

Trade Compliance

LAN91C111-NU Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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