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SC16C754BIBM,151

NXP Semiconductors

SC16C754BIBM,151 by NXP Semiconductors

SC16C754BIBM,151 by NXP Semiconductors is a Serial Communication Controller with 3.63V max supply voltage and 0.625 MBps data transfer rate. It features 64 terminals in a square package shape and is ideal for industrial applications requiring low power mode and asynchronous communication protocol at up to 80 MHz clock frequency.

Median Price

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5

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1k+

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Vyrian

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Digiode

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Nova Conductors

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Semi Source

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One Stop Electronics

USA . 637 parts In-Stock

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AZTECH Wire

Italy . 189 parts In-Stock

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Corohmni

South Africa . 191 parts In-Stock

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Microchip USA

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Semicontronic

India . 1,362 parts In-Stock

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Ampacity Inc.

Singapore . 798 parts In-Stock

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Aztec Data Supply Inc.

USA . 2,932 parts In-Stock

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Component Stockers USA

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QUARKTWIN TECHNOLOGY LTD

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Authorized Procurement Solutions

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Continental Prestige Electronics

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Bastille Electronics

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Overview

Enhance your communication systems with the SC16C754BIBM,151 by NXP Semiconductors. This top-quality Serial Communication Controller offers unmatched reliability and performance for a wide range of applications. With its low power mode and high-speed data transfer rate, this product provides exceptional value and benefits to customers looking for efficient and effective solutions. Upgrade your technology with NXP Semiconductors and experience the advantages firsthand.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Surface Mount: YES

Allows for easy and efficient integration onto circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 3.63 V

Supports a higher voltage input, making the product versatile and compatible with a wide range of systems.

Address Bus Width: 3

Allows for efficient data transmission and communication between different components.

Package Shape: SQUARE

Optimizes space utilization on the circuit board, ideal for compact designs.

Power Supplies (V): 2.5/5

Supports multiple power supply options, providing flexibility in different system configurations.

No. of Terminals: 64

Offers a sufficient number of connections for various inputs and outputs, ensuring connectivity with other devices.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Facilitates a compact and efficient design, suitable for space-constrained applications.

Minimum Supply Voltage: 2.97 V

Ensures reliable operation even at lower voltage levels, enhancing the product's performance.

Maximum Operating Temperature: 85 °C

Provides durability and reliability in high-temperature environments, ensuring stable operation under challenging conditions.

Maximum Data Transfer Rate: 0.625 MBps

Enables fast and efficient data transmission, crucial for real-time communication and data processing applications.

Minimum Operating Temperature: -40 °C

Maintains functionality in low-temperature environments, making the product suitable for a wide range of operating conditions.

Terminal Finish: TIN

Offers corrosion resistance and reliable electrical connections, ensuring long-term performance.

Terminal Position: QUAD

Facilitates easy installation and secure connections with other components, enhancing overall reliability.

Maximum Seated Height: 1.6 mm

Enables a low-profile design, ideal for applications with height restrictions.

Width: 7 mm

Compact dimensions allow for efficient use of space on the circuit board, supporting sleek and modern designs.

External Data Bus Width: 8

Provides ample bandwidth for data transfer, ensuring fast and efficient communication between devices.

Communication Protocol: ASYNC, BIT

Supports versatile communication protocols, enhancing compatibility with various systems and devices.

Maximum Clock Frequency: 80 MHz

Enables high-speed data processing and communication, crucial for demanding applications.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for efficient soldering processes during assembly, ensuring reliable connections.

Peak Reflow Temperature °C: 260

Withstands high-temperature soldering processes, contributing to the product's overall durability.

Length: 7 mm

Compact length allows for efficient use of space on the circuit board, supporting sleek and modern designs.

Temperature Grade: INDUSTRIAL

Designed to operate in industrial environments, ensuring reliability and performance under harsh conditions.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

Designed for serial communications, making it suitable for a wide range of applications requiring data transfer between devices.

Technology: CMOS

Utilizes low power consumption and provides reliable performance, enhancing energy efficiency and product longevity.

Terminal Form: GULL WING

Facilitates secure soldering connections, ensuring stable electrical connections for optimal performance.

Nominal Supply Voltage: 3.3 V

Provides a stable and common power supply option, ensuring compatibility with a wide range of systems.

No. of Serial I/Os: 4

Supports multiple serial input/output connections, enhancing connectivity options with other devices.

Terminal Pitch: 0.4 mm

Offers a fine pitch for terminals, enabling compact design and efficient use of space on the circuit board.

Low Power Mode: YES

Includes a low power mode for energy-efficient operation, ideal for battery-powered or portable devices.

Technical Specifications

Serial Communication Controllers SC16C754BIBM,151 attributes and parameters. Explore more Serial Communication Controllers devices from NXP Semiconductors

Specs

Additional Features:

ALSO OPERATES AT 2.5V OR 5V SUPPLY

Address Bus Width:

3

Boundary Scan:

NO

Maximum Clock Frequency:

80 MHz

Communication Protocol:

ASYNC, BIT

Maximum Data Transfer Rate:

.625 MBps

External Data Bus Width:

8

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of Serial I/Os:

4

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.35SQ,16

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/5

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Serial IO/Communication Controllers

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

2.97 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

SC16C754BIBM,151 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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