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SCC68681E1A44,529

NXP Semiconductors

SCC68681E1A44,529 by NXP Semiconductors

NXP Semiconductors' SCC68681E1A44,529 is a Serial Communication Controller with 5.5V max supply voltage, 0.125 MBps data transfer rate, and 4 MHz clock frequency. Ideal for industrial applications requiring asynchronous communication and serial I/O interfacing in a compact chip carrier package.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 3,528 parts In-Stock

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Vyrian

USA . 3,243 parts In-Stock

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Anansix

USA . 560 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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One Stop Electronics

USA . 749 parts In-Stock

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$8.000

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749

$8.000

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AZTECH Wire

Italy . 712 parts In-Stock

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$19.339

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Aztec Data Supply Inc.

USA . 3,608 parts In-Stock

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$30.638

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Microchip USA

USA . 436 parts In-Stock

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$58.135

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Corohmni

South Africa . 77 parts In-Stock

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Argo Parts USA

USA . 3,970 parts In-Stock

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Corphita

USA . 2,489 parts In-Stock

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UNI Independent Distributors

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Continental Prestige Electronics

USA . 1,313 parts In-Stock

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Aranea Global

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Overview

Enhance your communication systems with the SCC68681E1A44,529 by NXP Semiconductors. This high-quality Serial Communication Controller offers unparalleled reliability and performance for a wide range of applications. With a durable plastic/epoxy body, surface mount capability, and a maximum supply voltage of 5.5V, this chip carrier package is perfect for industrial-grade projects. Experience seamless data transfer at a rate of 0.125 MBps, with a maximum clock frequency of 4 MHz. Upgrade your serial I/O communications with the SCC68681E1A44,529 and unlock endless possibilities in the world of technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and reliability for long-term use.

Surface Mount: YES

Allows for easy and efficient integration onto circuit boards.

Maximum Supply Voltage: 5.5 V

Provides versatility for a wide range of applications requiring different voltage levels.

Address Bus Width: 4

Offers efficient data transmission and processing capabilities.

Package Shape: SQUARE

Helps in saving space on the circuit board.

No. of Terminals: 44

Provides ample connectivity options for various components.

Package Style (Meter): CHIP CARRIER

Ensures efficient heat dissipation for optimal performance.

Minimum Supply Voltage: 4.5 V

Provides stability even in low voltage scenarios.

Maximum Operating Temperature: 85 °C

Ensures reliable operation even in high-temperature environments.

Maximum Data Transfer Rate: 0.125 MBps

Offers fast and efficient data transfer speeds.

Minimum Operating Temperature: -40 °C

Ensures functionality even in extreme cold conditions.

Terminal Finish: TIN

Provides a reliable connection for long-lasting performance.

Terminal Position: QUAD

Offers a stable connection point for components.

Maximum Seated Height: 4.57 mm

Allows for compact design and efficient use of space.

Width: 16.585 mm

Provides a compact form factor for easy integration.

Data Encoding or Decoding Method: NRZ

Ensures accurate data transmission and reception.

External Data Bus Width: 8

Provides efficient data handling capabilities.

Communication Protocol: ASYNC, BIT

Offers flexibility in communication methods.

Maximum Clock Frequency: 4 MHz

Allows for fast data processing and transmission speeds.

Length: 16.585 mm

Provides a compact form factor for space-constrained applications.

Temperature Grade: INDUSTRIAL

Suitable for use in industrial environments with varying temperature conditions.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

Offers versatile connectivity options for various devices.

Technology: CMOS

Ensures low power consumption and efficient operation.

Terminal Form: J BEND

Provides a secure connection point for components.

Nominal Supply Voltage: 5 V

Standard voltage level for compatibility with a wide range of systems.

No. of Serial I/Os: 2

Offers multiple input/output options for enhanced connectivity.

Bus Compatibility: S68000

Ensures compatibility with various bus systems for seamless integration.

Terminal Pitch: 1.27 mm

Provides a precise connection point for components.

Moisture Sensitivity Level (MSL): 3

Suitable for use in environments with moderate moisture levels.

Technical Specifications

Serial Communication Controllers SCC68681E1A44,529 attributes and parameters. Explore more Serial Communication Controllers devices from NXP Semiconductors

Specs

Address Bus Width:

4

Boundary Scan:

NO

Bus Compatibility:

S68000

Maximum Clock Frequency:

4 MHz

Communication Protocol:

ASYNC, BIT

Data Encoding or Decoding Method:

NRZ

Maximum Data Transfer Rate:

.125 MBps

External Data Bus Width:

8

JESD-30 Code:

S-PQCC-J44

JESD-609 Code:

e3

Length:

16.585 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

3

No. of Serial I/Os:

2

No. of Terminals:

44

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

16.585 mm

Trade Compliance

SCC68681E1A44,529 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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