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SCC68681E1N40,112

NXP Semiconductors

SCC68681E1N40,112 by NXP Semiconductors

NXP Semiconductors' SCC68681E1N40,112 is a Serial Communication Controller with 5V supply, 4 MHz clock frequency, and 0.125 MBps data transfer rate. Widely used in industrial applications for asynchronous communication protocols and serial I/O tasks due to its CMOS technology and compatibility with S68000 bus.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Vyrian

USA . 8,489 parts In-Stock

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Anansix

USA . 2,689 parts In-Stock

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Digiode

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Nova Conductors

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Microchip USA

USA . 491 parts In-Stock

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$11.281

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AZTECH Wire

Italy . 431 parts In-Stock

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One Stop Electronics

USA . 802 parts In-Stock

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Ampacity Inc.

Singapore . 1,080 parts In-Stock

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Corphita

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Aranea Global

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Overview

Upgrade your serial communication systems with the SCC68681E1N40,112 from NXP Semiconductors. As a leading manufacturer in the industry, NXP ensures top-notch quality and reliability in every product they create. This Serial Communication Controller offers unmatched efficiency and performance, making it ideal for a wide range of applications. From industrial automation to consumer electronics, this versatile device provides seamless data transfer at a lightning-fast speed of 0.125 MBps. Trust NXP Semiconductors to deliver cutting-edge technology that elevates your projects to the next level. Experience the difference with the SCC68681E1N40,112 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental factors, making this product suitable for various applications.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage, this product allows for flexibility in power supply options and can handle higher voltage inputs if needed.

Address Bus Width: 4

The 4-bit address bus width provides sufficient address space for communication and control operations.

Maximum Data Transfer Rate: 0.125 MBps

The high maximum data transfer rate of 0.125 MBps ensures fast and efficient data communication, making this product suitable for high-speed applications.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this product can function effectively in extreme cold environments.

Maximum Clock Frequency: 4 MHz

The high maximum clock frequency of 4 MHz enables rapid data processing and communication, making this product ideal for high-performance applications.

No. of Serial I/Os: 2

Having 2 serial I/Os allows for multiple communication channels, enabling the product to handle more data streams simultaneously.

Technical Specifications

Serial Communication Controllers SCC68681E1N40,112 attributes and parameters. Explore more Serial Communication Controllers devices from NXP Semiconductors

Specs

Address Bus Width:

4

Boundary Scan:

NO

Bus Compatibility:

S68000

Maximum Clock Frequency:

4 MHz

Communication Protocol:

ASYNC, BIT

Data Encoding or Decoding Method:

NRZ

Maximum Data Transfer Rate:

.125 MBps

External Data Bus Width:

8

JESD-30 Code:

R-PDIP-T40

JESD-609 Code:

e3

Length:

52 mm

Low Power Mode:

NO

No. of Serial I/Os:

2

No. of Terminals:

40

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP40,.6

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

4.7 mm

Sub-Category:

Serial IO/Communication Controllers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

15.24 mm

Trade Compliance

SCC68681E1N40,112 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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