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MC68EN360CAI25L

NXP Semiconductors

MC68EN360CAI25L by NXP Semiconductors

MC68EN360CAI25L by NXP Semiconductors is a Serial Communication Controller with 32-bit address and external data bus width. It supports various communication protocols like ASYNC, BIT, SYNC, BYTE, HDLC, SDLC, BISYNC at a max clock frequency of 25 MHz. Ideal for low power applications with 2 DMA channels and compatibility with the 68000 bus.

Median Price

$117.910

Lifecycle Status

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9

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1k+

MC68EN360CAI25L by NXP Semiconductors
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Rochester

USA . 1 parts In-Stock

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$117.910

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$110.840

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$103.760

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$103.760

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Nova Conductors

Japan . 84 parts In-Stock

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$92.817

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Digiode

USA . 3,827 parts In-Stock

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$130.055

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Vyrian

USA . 2,627 parts In-Stock

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Anansix

USA . 2,530 parts In-Stock

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Flip Electronics

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Chip Stock

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Bristol Electronics

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AZTECH Wire

Italy . 236 parts In-Stock

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$5.270

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Corohmni

South Africa . 311 parts In-Stock

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$15.514

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Continental Prestige Electronics

USA . 3,914 parts In-Stock

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$92.817

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$90.961

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One Stop Electronics

USA . 1 parts In-Stock

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$116.360

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Ampacity Inc.

Singapore . 1 parts In-Stock

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Semicontronic

India . 1 parts In-Stock

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$116.360

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$113.451

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$112.869

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Corphita

USA . 3,117 parts In-Stock

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Microchip USA

USA . 2,673 parts In-Stock

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$138.450

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$138.450

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$138.450

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$138.450

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$138.450

Perfect Parts

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Argo Parts USA

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Robosynatics

Brazil . 3,890 parts In-Stock

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$76.524

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Lucentia Tech

USA . 3,890 parts In-Stock

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$78.119

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$76.524

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Overview

Enhance your communication systems with the MC68EN360CAI25L from NXP Semiconductors. As a leading manufacturer in the industry, NXP ensures top-quality products. This Serial Communication Controller offers seamless data transfer at a rate of 1.25 MBps, making it ideal for various applications. With its low power mode and versatile communication protocols, this controller provides unmatched value and efficiency to customers. Upgrade your systems with the MC68EN360CAI25L and experience superior performance like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Surface Mount: YES

Allows for easy installation on circuit boards, saving space and facilitating mass production.

Address Bus Width: 32

Supports a wide range of memory addressing capabilities for efficient data transfer and processing.

Package Shape: SQUARE

Facilitates uniform distribution of components within the package, optimizing space utilization.

No. of Terminals: 240

Provides multiple connection points for interfacing with other devices, enhancing versatility and functionality.

Package Style (Meter): FLATPACK

Ensures easy handling and installation of the component in various electronic systems.

Maximum Data Transfer Rate: 1.25 MBps

Enables high-speed data communication, making the product suitable for applications requiring rapid data exchange.

Terminal Finish: TIN

Provides excellent conductivity and corrosion resistance, ensuring reliable connections for seamless data transfer.

Terminal Position: QUAD

Facilitates easy identification and organization of terminals, simplifying installation and maintenance processes.

Boundary Scan: YES

Allows for advanced testing and debugging capabilities, enhancing overall product reliability and performance.

External Data Bus Width: 32

Supports high-speed data transmission between the product and external devices, ensuring efficient communication.

Communication Protocol: ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; BISYNC

Compatibility with various communication protocols allows for versatile connectivity options, making the product suitable for diverse applications.

Maximum Clock Frequency: 25 MHz

Enables fast data processing and communication, enhancing the overall performance of the product.

Maximum Time At Peak Reflow Temperature (s): 40

Ensures reliable soldering of the component during manufacturing processes, minimizing potential defects and ensuring product quality.

Peak Reflow Temperature °C: 260

Supports high-temperature soldering processes, ensuring secure connections and long-term reliability of the product.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

Designed for controlling and managing serial communication, making it a suitable choice for devices requiring serial data interfaces.

Technology: CMOS

Utilizes low power consumption and provides high-speed operation, making the product energy-efficient and reliable.

Terminal Form: GULL WING

Facilitates easy assembly and soldering processes, ensuring secure connections and efficient integration into electronic systems.

No. of DMA Channels: 2

Supports efficient data transfer and processing without CPU intervention, enhancing overall system performance.

Bus Compatibility: 68000

Compatible with 68000 bus architecture, ensuring seamless integration with a wide range of microprocessors and systems.

Moisture Sensitivity Level (MSL): 3

Ensures proper handling and storage requirements to prevent moisture-related damage, maintaining product reliability.

Low Power Mode: YES

Allows for power-saving capabilities, extending battery life and reducing energy consumption in portable devices.

Technical Specifications

Serial Communication Controllers MC68EN360CAI25L attributes and parameters. Explore more Serial Communication Controllers devices from NXP Semiconductors

Specs

Address Bus Width:

32

Boundary Scan:

YES

Bus Compatibility:

68000

Maximum Clock Frequency:

25 MHz

Communication Protocol:

ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; BISYNC

Maximum Data Transfer Rate:

1.25 MBps

External Data Bus Width:

32

JESD-30 Code:

S-PQFP-G240

JESD-609 Code:

e3

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

2

No. of Terminals:

240

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN

Terminal Form:

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Trade Compliance

MC68EN360CAI25L Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

NSN

5962-01-572-8886, 5962015728886

NIIN

015728886

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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