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LAN7431T/YXX

Microchip Technology

LAN7431T/YXX by Microchip Technology

The Microchip Technology LAN7431T/YXX is a Serial Communication Controller with 256 MBps data transfer rate, suitable for Ethernet communication. It operates b/w 0-70 °C and supports SYNC, BYTE protocols. With 72 terminals in a square package, it's ideal for PCI bus compatibility.

Median Price

$3.163

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 40 parts In-Stock

1+ parts

$3.163

100+ parts

$2.647

1k+ parts

-

10k+ parts

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40

$3.163

$2.647

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Verical

USA . 40 parts In-Stock

1+ parts

$3.163

100+ parts

$2.647

1k+ parts

-

10k+ parts

-

40

$3.163

$2.647

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-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$6.895

100+ parts

-

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100

$6.895

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Vyrian

USA . 6,837 parts In-Stock

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6,837

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 407 parts In-Stock

1+ parts

$5.050

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-

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407

$5.050

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Aranea Global

USA . 100 parts In-Stock

1+ parts

$6.757

100+ parts

-

1k+ parts

$6.487

10k+ parts

-

100

$6.757

-

$6.487

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AZTECH Wire

Italy . 1,086 parts In-Stock

1+ parts

$8.640

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1,086

$8.640

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Advanced Electronics

New Zealand . 350 parts In-Stock

1+ parts

$12.204

100+ parts

$11.106

1k+ parts

$10.007

10k+ parts

-

350

$12.204

$11.106

$10.007

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Corohmni

South Africa . 174 parts In-Stock

1+ parts

$46.657

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-

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174

$46.657

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Marpe Global Electronics

Taiwan . 6,579 parts In-Stock

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6,579

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QualityLine Systems

Poland . 6,579 parts In-Stock

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6,579

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XL Components Corporation

Australia . 6,579 parts In-Stock

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6,579

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Overview

Enhance your communication systems with the cutting-edge LAN7431T/YXX by Microchip Technology. As a leader in the industry, Microchip Technology ensures top-notch quality and reliability in all their products. Perfect for serial communication controllers, this surface mount device offers lightning-fast data transfer rates of up to 256 MBps, making it ideal for a wide range of applications. With low power mode capabilities and compatibility with PCI bus, the LAN7431T/YXX provides exceptional value and performance for all your communication needs. Upgrade your systems today and experience seamless connectivity like never before!

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and secure attachment to a circuit board, saving space and providing a more reliable connection.

No. of Terminals: 72

Provides a wide range of connectivity options, allowing for versatile integration with other components.

Maximum Data Transfer Rate: 256 MBps

Enables high-speed data transmission, making the product suitable for applications requiring fast communication.

Maximum Clock Frequency: 25 MHz

Supports efficient data processing and synchronization, enhancing overall performance.

Moisture Sensitivity Level (MSL): 3

Indicates the level of protection against moisture, ensuring reliability in various environmental conditions.

Low Power Mode: YES

Helps reduce power consumption, making the product energy-efficient and suitable for battery-operated devices.

Technical Specifications

Serial Communication Controllers LAN7431T/YXX attributes and parameters. Explore more Serial Communication Controllers devices from Microchip Technology

Specs

Additional Features:

ALSO HAVING NETWORK PROTOCOLS IEEE 802.3AZ; IEEE 802.1Q; IEEE 802.3X

Address Bus Width:

0

Boundary Scan:

YES

Bus Compatibility:

PCI

Maximum Clock Frequency:

25 MHz

Communication Protocol:

SYNC, BYTE; ETHERNET

Maximum Data Transfer Rate:

256 MBps

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N72

JESD-609 Code:

e3

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Serial I/Os:

4

No. of Terminals:

72

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Screening Level:

TS 16949

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Trade Compliance

LAN7431T/YXX Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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