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NHI350AM4SLJ3Z

Intel

NHI350AM4SLJ3Z by Intel

Intel's NHI350AM4SLJ3Z is a Serial IO/Communication Controller with 256 terminals in a square grid array package. Operating b/w -10 to 55 °C, it supports SYNC, BIT, and BYTE communication protocols for PCI and I2C buses. This CMOS technology device consumes up to 2218 mA at 1 V in low power mode, ideal for LAN applications.

Median Price

$56.670

Lifecycle Status

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10

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Arrow

USA . 437 parts In-Stock

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$56.670

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$46.670

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Verical

USA . 437 parts In-Stock

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$56.670

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Digiode

USA . 296 parts In-Stock

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$46.531

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Nova Conductors

Japan . 500 parts In-Stock

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Rutronik

Germany . 4 parts In-Stock

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Chip Stock

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Cyclops Electronics Ltd

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Vyrian

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ACDS - Activité Composants Distribution Service

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Bristol Electronics

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Aztec Data Supply Inc.

USA . 1,714 parts In-Stock

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$25.420

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Ampacity Inc.

Singapore . 102 parts In-Stock

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$41.590

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Corphita

USA . 197 parts In-Stock

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Semicontronic

India . 128 parts In-Stock

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$48.170

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$46.966

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$46.725

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MARBEL Systems

Belgium . 6,097 parts In-Stock

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$55.456

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Corohmni

South Africa . 55 parts In-Stock

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Texas Native Microelectronics

USA . 3,567 parts In-Stock

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$63.743

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$61.193

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$59.281

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Continental Prestige Electronics

USA . 1,666 parts In-Stock

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Netroflash

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Kenton Components

USA . 255 parts In-Stock

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$76.492

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$67.313

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Authorized Procurement Solutions

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Argo Parts USA

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Robosynatics

Brazil . 250 parts In-Stock

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Qasali Group International

UK . 155 parts In-Stock

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Futuretech Components

Singapore . 130 parts In-Stock

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GreenTree Electronics

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Glotronic Ltd.

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Overview

Intel's i350 Ethernet Controllers are a single, compact, low-power component that supports quad port and dual port gigabit Ethernet designs. The device offers four fully-integrated gigabit Ethernet media access control (MAC), physical layer (PHY) ports and four SGMII/SerDes ports that can be connected to an external PHY. The I350 supports PCI Express (PCIe v2.1 (2.5GT/s and 5GT/s)). The device enables two-port or four port 1000BASE-T implementations using integrated PHY's. It can be used for server system configurations such as rack mounted or pedestal servers, in an ad-on NIC or LAN on Motherboard (LOM) design. Another possible system configuration is for blade servers where the i350 can support up to 4 SerDes ports as LOM or mezzanine card. It can also be used in embedded applications such as switch add-on cards and network appliances.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort.

Package Shape: SQUARE

Square packages are typically more stable and easier to handle during assembly, reducing the risk of damage.

No. of Terminals: 256

Provides versatility and the ability to connect to multiple devices or components simultaneously.

Package Style (Meter): GRID ARRAY

Grid array packages offer high density integration and better thermal and electrical performance.

Maximum Operating Temperature: 55 °C

Ensures reliable performance even in high temperature environments.

Minimum Operating Temperature: -10 °C

Can operate in cold conditions without any issues.

Communication Protocol: SYNC; BIT ;BYTE

Supports multiple communication protocols for flexibility in connectivity.

Temperature Grade: COMMERCIAL

Suitable for commercial applications where standard temperature ranges are expected.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, LAN

Includes features for serial communication and LAN connectivity, expanding the range of applications this product can be used in.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for efficient and reliable operation.

Terminal Form: NO LEAD

Leadless terminals can provide better signal integrity and thermal performance compared to leaded terminals.

Maximum Supply Current: 2218 mA

High supply current enables the product to drive multiple loads or components without issues.

Nominal Supply Voltage: 1 V

Operates at a standard voltage level, making it compatible with many power sources.

Bus Compatibility: PCI; I2C

Supports popular bus standards for easy integration into existing systems.

Terminal Pitch: 1 mm

Compact terminal pitch allows for high density packaging and space-saving designs.

Low Power Mode: YES

Includes a low power mode for energy efficiency and extended battery life in portable applications.

Technical Specifications

Serial Communication Controllers NHI350AM4SLJ3Z attributes and parameters. Explore more Serial Communication Controllers devices from Intel

Specs

Boundary Scan:

NO

Bus Compatibility:

PCI; I2C

Communication Protocol:

SYNC; BIT ;BYTE

JESD-30 Code:

S-PBGA-B256

Low Power Mode:

YES

No. of Terminals:

256

Maximum Operating Temperature:

55 Cel

Minimum Operating Temperature:

-10 Cel

Package Body Material:

UNSPECIFIED

Package Code:

BGA

Package Equivalence Code:

BGA256,16X16,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Power Supplies (V):

1

Qualification:

Not Qualified

Sub-Category:

Serial IO/Communication Controllers

Maximum Supply Current:

2218 mA

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

UNSPECIFIED

Trade Compliance

NHI350AM4SLJ3Z Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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