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LAN7431-V/YXX

Microchip Technology

LAN7431-V/YXX by Microchip Technology

LAN7431-V/YXX by Microchip Technology is a Serial Communication Controller with a max data transfer rate of 256 MBps. It has a low power mode and is suitable for applications requiring high-speed Ethernet communication.

Median Price

$8.880

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 17 parts In-Stock

1+ parts

$8.880

100+ parts

$6.730

1k+ parts

$6.220

10k+ parts

$5.890

17

$8.880

$6.730

$6.220

$5.890

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 150 parts In-Stock

1+ parts

$7.729

100+ parts

-

1k+ parts

-

10k+ parts

-

150

$7.729

-

-

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Chip Stock

USA . 4,600 parts In-Stock

1+ parts

-

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4,600

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-

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Vyrian

USA . 4,322 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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4,322

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-

-

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Cyclops Electronics Ltd

UK . 504 parts In-Stock

1+ parts

-

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1k+ parts

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504

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Netroflash

USA . 500 parts In-Stock

1+ parts

$7.729

100+ parts

-

1k+ parts

-

10k+ parts

-

500

$7.729

-

-

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Ampacity Inc.

Singapore . 1,034 parts In-Stock

1+ parts

$16.430

100+ parts

-

1k+ parts

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10k+ parts

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1,034

$16.430

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AZTECH Wire

Italy . 204 parts In-Stock

1+ parts

$19.880

100+ parts

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204

$19.880

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Microchip USA

USA . 8,099 parts In-Stock

1+ parts

$21.301

100+ parts

-

1k+ parts

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10k+ parts

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8,099

$21.301

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Corohmni

South Africa . 257 parts In-Stock

1+ parts

$71.606

100+ parts

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1k+ parts

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257

$71.606

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Lixinc

USA . 14,818 parts In-Stock

1+ parts

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14,818

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RGB Technical Solutions

Ukraine . 4,294 parts In-Stock

1+ parts

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4,294

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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3,000

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Overview

Discover the LAN7431-V/YXX by Microchip Technology, a cutting-edge Serial Communication Controller that brings exceptional quality and unrivaled advantages to your projects. With Microchip's stellar reputation as a manufacturer, you can trust in the high-performance and reliability of this product. Experience seamless data transfer at an impressive rate of 256 MBps, while enjoying the benefits of low power mode and wide temperature range. This versatile controller is perfect for various applications, offering convenient communication protocols such as SYNC, BYTE, and ETHERNET. Upgrade your projects with the LAN7431-V/YXX and unlock a world of possibilities!

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy installation onto PCBs, saving space and making the product suitable for compact designs.

Maximum Supply Voltage: 1.32 V

Operates efficiently at a maximum supply voltage of 1.32V, ensuring stable performance within the specified voltage range.

Screening Level: AEC-Q100; TS 16949

Compliant with automotive industry standards, ensuring reliability and quality for automotive applications.

Package Shape: SQUARE

Square package shape allows for easier handling and placement on PCBs compared to irregular shapes, facilitating manufacturing processes.

No. of Terminals: 72

Having a higher number of terminals provides more connectivity options and flexibility in integrating the product into various systems.

Minimum Supply Voltage: 1.14 V

Can operate at low supply voltages down to 1.14V, enabling energy-efficient operation and potentially extending battery life in portable devices.

Maximum Operating Temperature: 105 °C

Capable of operating at high temperatures of up to 105 °C, suitable for industrial environments with elevated thermal conditions.

Maximum Data Transfer Rate: 256 MBps

High data transfer rate of 256 MBps enables fast and efficient communication, making it ideal for applications requiring quick data exchange.

Minimum Operating Temperature: -40 °C

Can withstand extremely cold temperatures down to -40 °C, making it suitable for use in harsh environments or outdoor applications.

Terminal Finish: Matte Tin (Sn) - annealed

Matte tin finish provides corrosion resistance and reliable electrical contact, ensuring long-term performance and durability.

Terminal Position: QUAD

Quad-terminal position allows for secure and stable connections, reducing the risk of signal loss or disconnection during operation.

Maximum Seated Height: 1 mm

Low seated height of 1mm saves space on the PCB and contributes to a sleek design, beneficial for slim and compact electronic devices.

Width: 10 mm

Narrow width of 10mm enables easy integration into tight spaces or densely populated PCB layouts, enhancing design flexibility.

Boundary Scan: YES

Boundary scan capability simplifies testing and troubleshooting during product development and manufacturing, ensuring high quality and reliability.

Communication Protocol: SYNC, BYTE; ETHERNET

Supports multiple communication protocols, allowing compatibility with various systems and devices for versatile connectivity options.

Maximum Clock Frequency: 25 MHz

High clock frequency of 25 MHz enables rapid data processing and communication, enhancing overall system performance.

Maximum Time At Peak Reflow Temperature (s): 30

Withstands peak reflow temperatures for up to 30 seconds, ensuring proper soldering and assembly during manufacturing processes.

Peak Reflow Temperature °C: 260

Capable of withstanding high peak reflow temperatures of 260 °C, ensuring robustness and reliability in assembly processes.

Length: 10 mm

Compact length of 10mm contributes to a space-saving design and easy installation, suitable for applications with size constraints.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable operation in harsh industrial environments with extreme temperature variations.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

Designed as a specialized communication controller for serial I/O applications, providing efficient data transfer and communication capabilities.

Technology: CMOS

Utilizes CMOS technology for low power consumption, high noise immunity, and fast switching speeds, enhancing overall performance and efficiency.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations and requirements, ensuring eco-friendly manufacturing processes.

Nominal Supply Voltage: 1.2 V

Stable nominal supply voltage of 1.2V ensures consistent performance and power efficiency, suitable for a wide range of applications.

No. of Serial I/Os: 4

Multiple serial I/O interfaces allow for versatile connectivity options and simultaneous data transfer, enhancing communication capabilities.

Bus Compatibility: PCI

PCI bus compatibility ensures seamless integration with PCI-based systems, expanding the product's compatibility and applicability in various platforms.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm enables high-density packaging and precise PCB layout, suitable for compact and miniaturized designs.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level of 3 indicates moderate sensitivity to moisture, requiring standard handling and storage procedures to maintain product integrity.

Low Power Mode: YES

Supports low power mode for energy-efficient operation, prolonging battery life and reducing power consumption in portable or battery-operated devices.

Technical Specifications

Serial Communication Controllers LAN7431-V/YXX attributes and parameters. Explore more Serial Communication Controllers devices from Microchip Technology

Specs

Additional Features:

ALSO HAVING NETWORK PROTOCOLS IEEE 802.3AZ; IEEE 802.1Q; IEEE 802.3X

Address Bus Width:

0

Boundary Scan:

YES

Bus Compatibility:

PCI

Maximum Clock Frequency:

25 MHz

Communication Protocol:

SYNC, BYTE; ETHERNET

Maximum Data Transfer Rate:

256 MBps

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N72

JESD-609 Code:

e3

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Serial I/Os:

4

No. of Terminals:

72

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100; TS 16949

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Trade Compliance

LAN7431-V/YXX Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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