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LAN7800-I/ML

Microchip Technology

LAN7800-I/ML by Microchip Technology

LAN7800-I/ML by Microchip Technology is a Serial Communication Controller with 60 MBps data transfer rate. It operates in industrial temperature range (-40 to 85 °C) and supports USB bus compatibility. This chip carrier package has 48 terminals, 0.5 mm pitch, and low power mode for various communication applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,241 parts In-Stock

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Nova Conductors

Japan . 37 parts In-Stock

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37

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Aztec Data Supply Inc.

USA . 100 parts In-Stock

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$16.070

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100

$16.070

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Ampacity Inc.

Singapore . 390 parts In-Stock

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$17.000

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390

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AZTECH Wire

Italy . 677 parts In-Stock

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$17.004

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Semicontronic

India . 503 parts In-Stock

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$27.000

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$26.325

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$26.190

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503

$27.000

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$26.190

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Corohmni

South Africa . 279 parts In-Stock

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$60.150

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279

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Marpe Global Electronics

Taiwan . 6,788 parts In-Stock

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QualityLine Systems

Poland . 6,788 parts In-Stock

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XL Components Corporation

Australia . 6,788 parts In-Stock

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Continental Prestige Electronics

USA . 5,416 parts In-Stock

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Argo Parts USA

USA . 953 parts In-Stock

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Bastille Electronics

Australia . 200 parts In-Stock

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Overview

Elevate your communication systems with the LAN7800-I/ML by Microchip Technology, a leading manufacturer in the industry. This Serial Communication Controller offers unmatched quality and reliability for a wide range of applications. With a maximum data transfer rate of 60 MBps and low power mode, this product provides exceptional value and performance. Experience seamless connectivity and efficient operation with the LAN7800-I/ML, setting a new standard in serial communication controllers.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and convenient mounting on a circuit board, saving space and making installation simpler.

Maximum Supply Voltage: 1.26 V

Operates efficiently within a specific voltage range, ensuring stable performance and preventing damage.

Screening Level: ISO/TS-16949

Meets high quality and reliability standards, ensuring the product has undergone rigorous testing.

Package Shape: SQUARE

Square package shape is often more compact and allows for efficient use of space on a PCB.

No. of Terminals: 48

Provides a sufficient number of connection points for interfacing with other components and peripherals.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Incorporates advanced packaging technologies that enhance thermal performance and reduce overall size.

Minimum Supply Voltage: 1.1 V

Can operate at low voltage levels, improving energy efficiency and reducing power consumption.

Maximum Operating Temperature: 85 °C

Capable of functioning reliably in high-temperature environments, increasing the product's versatility.

Maximum Data Transfer Rate: 60 MBps

Enables fast and efficient data transfer, ideal for applications requiring high-speed communication.

Minimum Operating Temperature: -40 °C

Designed to withstand extreme cold temperatures, making it suitable for a wide range of operating conditions.

Terminal Position: QUAD

Quad terminal configuration allows for multiple connections in a compact layout, optimizing PCB space usage.

Maximum Seated Height: 1 mm

Low profile design with a maximum seated height of 1 mm helps minimize overall system height requirements.

Width: 7 mm

Compact width dimensions make integration into tight spaces or alongside other components easier.

Boundary Scan: YES

Supports boundary-scan testing for improved debugging, testing, and fault isolation capabilities.

Communication Protocol: ASYNC, BIT; SYNC, BYTE; ETHERNET

Offers versatile communication options compatible with various data transmission protocols, enhancing flexibility.

Length: 7 mm

Short length dimension facilitates placement in space-constrained designs, maximizing PCB real estate usage.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial environments with extended temperature ranges and rugged construction.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

Specifically designed for serial communication and data input/output tasks, ensuring optimal performance in such applications.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of voltages.

Terminal Form: NO LEAD

No lead terminals reduce the risk of solder bridges and simplify automated assembly processes.

Nominal Supply Voltage: 1.2 V

Operating within the nominal supply voltage range provides stability and performance consistency.

No. of Serial I/Os: 4

Four serial I/O interfaces enable versatile connection options for communicating with multiple devices simultaneously.

Bus Compatibility: USB

USB bus compatibility allows for easy integration with USB-enabled devices and peripherals, enhancing connectivity.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5 mm enables high-density mounting and interconnection in space-constrained applications.

Low Power Mode: YES

Incorporates a low power mode feature that conserves energy during idle or low activity periods, extending battery life.

Technical Specifications

Serial Communication Controllers LAN7800-I/ML attributes and parameters. Explore more Serial Communication Controllers devices from Microchip Technology

Specs

Additional Features:

25 MHZ NOMINAL CRYSTAL FREQUENCY AVAILABLE

Address Bus Width:

0

Boundary Scan:

YES

Bus Compatibility:

USB

Communication Protocol:

ASYNC, BIT; SYNC, BYTE; ETHERNET

Maximum Data Transfer Rate:

60 MBps

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N48

Length:

7 mm

Low Power Mode:

YES

No. of Serial I/Os:

4

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Screening Level:

ISO/TS-16949

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.1 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Trade Compliance

LAN7800-I/ML Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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