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SC16IS750IPW-F

NXP Semiconductors

SC16IS750IPW-F by NXP Semiconductors

NXP Semiconductors' SC16IS750IPW-F is a Serial Communication Controller with 24 terminals, operating at temperatures from -40 to 85°C. It supports power supplies of 2.5/3.3V and features Gull Wing terminals for industrial applications requiring serial IO/communication control in a small outline package.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,821 parts In-Stock

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2,821

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Digiode

USA . 2,613 parts In-Stock

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2,613

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Vyrian

USA . 307 parts In-Stock

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307

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,327 parts In-Stock

1+ parts

$5.000

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1,327

$5.000

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AZTECH Wire

Italy . 307 parts In-Stock

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$8.945

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307

$8.945

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One Stop Electronics

USA . 988 parts In-Stock

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$24.000

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988

$24.000

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Corohmni

South Africa . 326 parts In-Stock

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$74.912

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326

$74.912

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Aztec Data Supply Inc.

USA . 1,483 parts In-Stock

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$77.870

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1,483

$77.870

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UNI Independent Distributors

Spain . 5,967 parts In-Stock

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5,967

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Argo Parts USA

USA . 3,912 parts In-Stock

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3,912

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Corphita

USA . 1,720 parts In-Stock

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1,720

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Continental Prestige Electronics

USA . 365 parts In-Stock

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365

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Aranea Global

USA . 100 parts In-Stock

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100

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Overview

Enhance your product designs with the SC16IS750IPW-F by NXP Semiconductors, a top-notch Serial Communication Controller that offers unmatched quality and reliability. Manufactured by industry leader NXP Semiconductors, this versatile component is ideal for a wide range of applications. With its advanced features and innovative design, the SC16IS750IPW-F provides exceptional value, efficiency, and performance. Upgrade your projects today with this exceptional product and experience the benefits it brings to your applications.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for applications where weight and portability are important factors.

Surface Mount: YES

Being surface mountable enables easy and efficient assembly on circuit boards, saving time and space in the manufacturing process.

Power Supplies (V): 2.5/3.3

Compatibility with different power supply voltages allows flexibility in usage and integration with various systems and devices.

No. of Terminals: 24

Having a sufficient number of terminals enables the device to connect to multiple external components or peripherals, enhancing its functionality.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The compact and thin profile of the package style saves space on the PCB, making it suitable for devices with limited board space.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures that the product can withstand demanding industrial environments without overheating or malfunctioning.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the product to function reliably even in extremely cold conditions, making it suitable for a wide range of environments.

Terminal Position: DUAL

Dual terminal position provides redundancy and improves signal integrity, enhancing the reliability and performance of the product.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade temperature ranges, ensuring stability and consistent performance in harsh operating conditions.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

The specific type of IC controllers enables seamless and efficient serial communication, making it suitable for various data transfer and communication applications.

Terminal Form: GULL WING

Gull-wing terminals are easy to solder and provide a reliable connection, ensuring secure attachment to the PCB for long-lasting performance.

Terminal Pitch: 0.635 mm

The fine terminal pitch allows for high-density mounting, making the product suitable for applications where space-saving on the PCB is essential.

Technical Specifications

Serial Communication Controllers SC16IS750IPW-F attributes and parameters. Explore more Serial Communication Controllers devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G24

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP24,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Sub-Category:

Serial IO/Communication Controllers

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Trade Compliance

SC16IS750IPW-F Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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