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SC26C92C1A,512

NXP Semiconductors

SC26C92C1A,512 by NXP Semiconductors

SC26C92C1A,512 by NXP Semiconductors is a Serial Communication Controller with 5V power supply, 0-70°C operating temperature range, and 0.125 MBps data transfer rate. It is used for asynchronous communication protocols in serial I/O applications requiring low power mode and 8 MHz clock frequency.

Median Price

$7.160

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 4,486 parts In-Stock

1+ parts

$5.310

100+ parts

$5.200

1k+ parts

$5.100

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4,486

$5.310

$5.200

$5.100

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Farnell

UK . 2 parts In-Stock

1+ parts

$7.160

100+ parts

$4.930

1k+ parts

$3.820

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-

2

$7.160

$4.930

$3.820

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Element14

Singapore . 2 parts In-Stock

1+ parts

$12.200

100+ parts

$9.240

1k+ parts

$8.920

10k+ parts

-

2

$12.200

$9.240

$8.920

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Distributors (In-Stock)

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Nova Conductors

Japan . 650 parts In-Stock

1+ parts

$5.264

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650

$5.264

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DF Sales Co.

USA . 3 parts In-Stock

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$10.000

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3

$10.000

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DF Sales Co.

USA . 3 parts In-Stock

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$10.000

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3

$10.000

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Vyrian

USA . 8,208 parts In-Stock

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Anansix

USA . 1,428 parts In-Stock

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Digiode

USA . 425 parts In-Stock

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425

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Zilex Electronics Inc.

Canada . 44 parts In-Stock

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44

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Whistler Technology

UK . 43 parts In-Stock

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43

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A2Z Electronics, Inc.

USA . 21 parts In-Stock

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Bristol Electronics

USA . 21 parts In-Stock

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Rebound Electronics

UK . 9 parts In-Stock

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Classic Components Corporation

USA . 1 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 4,468 parts In-Stock

1+ parts

$5.264

100+ parts

-

1k+ parts

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10k+ parts

$5.159

4,468

$5.264

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-

$5.159

Netroflash

USA . 50 parts In-Stock

1+ parts

$5.264

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50

$5.264

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AZTECH Wire

Italy . 228 parts In-Stock

1+ parts

$15.698

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228

$15.698

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One Stop Electronics

USA . 1,087 parts In-Stock

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$20.000

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1,087

$20.000

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Ampacity Inc.

Singapore . 662 parts In-Stock

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$22.000

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662

$22.000

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Microchip USA

USA . 321 parts In-Stock

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$25.715

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321

$25.715

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Semicontronic

India . 869 parts In-Stock

1+ parts

$33.000

100+ parts

$32.175

1k+ parts

$32.010

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869

$33.000

$32.175

$32.010

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Aztec Data Supply Inc.

USA . 1,536 parts In-Stock

1+ parts

$51.210

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1,536

$51.210

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Corohmni

South Africa . 141 parts In-Stock

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$70.150

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UNI Independent Distributors

Spain . 8,046 parts In-Stock

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Corphita

USA . 4,013 parts In-Stock

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Perfect Parts

USA . 2,510 parts In-Stock

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Argo Parts USA

USA . 975 parts In-Stock

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975

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Overview

Unlock seamless communication and elevate your devices with the SC26C92C1A,512 by NXP Semiconductors. Crafted with precision and expertise, this chip carrier package offers unparalleled performance in serial communication controllers. From enhancing data transfer rates to enabling low power mode, this versatile component ensures reliability and efficiency in various applications. Experience the value of top-notch technology, trusted by industry leaders worldwide. Elevate your projects with NXP Semiconductors today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable or rugged applications.

Surface Mount: YES

Being surface mountable allows for easy assembly onto circuit boards, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 5.5 V

Support for a maximum supply voltage of 5.5V ensures compatibility with a wide range of power sources.

Address Bus Width: 4

A 4-bit address bus width allows for a versatile range of memory addressing capabilities, enhancing overall performance.

Package Shape: SQUARE

The square package shape optimizes space utilization on the PCB, making it efficient for compact designs.

Power Supplies (V): 5

The 5V power supply ensures stable and reliable operation of the product within standard voltage ranges.

No. of Terminals: 44

With 44 terminals, the product offers extensive connectivity options for interfacing with other components in the system.

Package Style (Meter): CHIP CARRIER

The chip carrier package style provides enhanced thermal performance and mechanical protection for the integrated circuits.

Minimum Supply Voltage: 4.5 V

Support for a minimum supply voltage of 4.5V ensures operational reliability even under low voltage conditions.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, the product can withstand high temperature environments without compromising performance.

Maximum Data Transfer Rate: 0.125 MBps

The high data transfer rate of 0.125 MBps enables fast and efficient communication, ideal for real-time applications.

Minimum Operating Temperature: 0 °C

The ability to operate at temperatures as low as 0°C makes the product suitable for a wide range of environmental conditions.

Terminal Finish: Tin (Sn)

Tin terminal finish provides corrosion resistance and facilitates soldering during assembly, ensuring long-term reliability.

Terminal Position: QUAD

The quad terminal positioning enhances stability and ease of connection on the circuit board for consistent performance.

Maximum Seated Height: 4.57 mm

The low maximum seated height of 4.57mm allows for compact device designs and minimizes interference with other components.

Width: 16.5862 mm

The specified width of 16.5862mm enables efficient placement of the product on the PCB, optimizing space utilization.

Data Encoding or Decoding Method: NRZ

The NRZ encoding/decoding method ensures accurate data transmission and reception, reducing errors in communication.

External Data Bus Width: 8

An external data bus width of 8 bits allows for high-speed data transfer and efficient processing capabilities within the system.

Communication Protocol: ASYNC, BIT

Support for asynchronous communication and bit-level protocol enhances the flexibility and compatibility of the product in various systems.

Maximum Clock Frequency: 8 MHz

Operating at a maximum clock frequency of 8MHz, the product can handle high-speed data processing tasks efficiently.

Maximum Time At Peak Reflow Temperature (s): 30

The specified reflow time of 30 seconds at peak temperature ensures proper soldering and reliability during assembly processes.

Peak Reflow Temperature °C: 245

The peak reflow temperature of 245°C ensures effective soldering and component bonding for long-lasting performance.

Length: 16.5862 mm

The specified length of 16.5862mm allows for precise placement and alignment of the product on the PCB for optimal functionality.

Temperature Grade: COMMERCIAL

Designed for commercial-grade applications, the product meets industry standards for performance and reliability in normal operating conditions.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

As a dedicated serial I/O and communication controller, the product facilitates seamless data transfer and interface connectivity for various applications.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption and high noise immunity, enhancing the efficiency and reliability of the product.

Terminal Form: J BEND

The J bend terminal form simplifies the soldering process and provides secure connections for stable performance in the system.

Maximum Supply Current: 25 mA

With a maximum supply current of 25mA, the product operates within efficient power consumption limits for prolonged battery life.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5V ensures consistent and stable power delivery to the product for reliable operation.

No. of Serial I/Os: 2

Having 2 serial I/Os allows for simultaneous data transmission and reception, enhancing communication capabilities in the system.

Terminal Pitch: 1.27 mm

The terminal pitch of 1.27mm enables easy connection and soldering of the product onto the circuit board, ensuring secure electrical contact.

Moisture Sensitivity Level (MSL): 3

With an MSL of 3, the product can withstand moderate moisture exposure during storage and assembly processes without compromising performance.

Low Power Mode: YES

The availability of a low power mode option allows for energy-efficient operation and extended battery life in power-sensitive applications.

No. of I/O Lines: 15

Having 15 I/O lines provides ample connectivity options for interfacing with peripheral devices and components, enhancing system flexibility.

Technical Specifications

Serial Communication Controllers SC26C92C1A,512 attributes and parameters. Explore more Serial Communication Controllers devices from NXP Semiconductors

Specs

Additional Features:

ALSO OPERATES AT 2.5V SUPPLY

Address Bus Width:

4

Boundary Scan:

NO

Maximum Clock Frequency:

8 MHz

Communication Protocol:

ASYNC, BIT

Data Encoding or Decoding Method:

NRZ

Maximum Data Transfer Rate:

.125 MBps

External Data Bus Width:

8

JESD-30 Code:

S-PQCC-J44

JESD-609 Code:

e3

Length:

16.5862 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of I/O Lines:

15

No. of Serial I/Os:

2

No. of Terminals:

44

On Chip Data RAM Width:

0

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC44,.7SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

245

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

0

Maximum Seated Height:

4.57 mm

Sub-Category:

Serial IO/Communication Controllers

Maximum Supply Current:

25 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16.5862 mm

Trade Compliance

SC26C92C1A,512 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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