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SC26C92A1A

NXP Semiconductors

SC26C92A1A by NXP Semiconductors

SC26C92A1A by NXP Semiconductors is a Serial Communication Controller with 5V supply, 8MHz clock frequency, and 0.125 MBps data transfer rate. Widely used in industrial applications for asynchronous communication protocols and low power mode support.

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Inventory MP

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LIBRA Elektronik GmbH

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Vigor

Singapore . 1,675 parts In-Stock

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AZTECH Wire

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Overview

Unlock seamless communication with the SC26C92A1A by NXP Semiconductors, a top-tier manufacturer renowned for cutting-edge technology. As a leading Serial Communication Controller, this high-quality product offers unparalleled reliability and performance across a range of applications. Experience the value and benefits of smooth data transfer, low power mode, and industrial-grade temperature tolerance. Elevate your projects with the SC26C92A1A and enjoy the advantage of effortless communication solutions tailored to your needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for applications where weight and durability are important factors.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and cost during production.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage tolerance of 5.5V provides flexibility and reliability in various power supply configurations.

Communication Protocol: ASYNC, BIT

Support for asynchronous and bit communication protocols ensures compatibility with a wide range of devices and systems, enhancing connectivity options.

Maximum Data Transfer Rate: 0.125 MBps

The high maximum data transfer rate of 0.125 MBps enables fast and efficient communication, making this product suitable for high-speed data transfer applications.

Technical Specifications

Serial Communication Controllers SC26C92A1A attributes and parameters. Explore more Serial Communication Controllers devices from NXP Semiconductors

Specs

Additional Features:

ALSO OPERATES AT 2.5V SUPPLY

Address Bus Width:

4

Boundary Scan:

NO

Maximum Clock Frequency:

8 MHz

Communication Protocol:

ASYNC, BIT

Data Encoding or Decoding Method:

NRZ

Maximum Data Transfer Rate:

.125 MBps

External Data Bus Width:

8

JESD-30 Code:

S-PQCC-J44

JESD-609 Code:

e3

Length:

16.585 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of I/O Lines:

15

No. of Serial I/Os:

2

No. of Terminals:

44

On Chip Data RAM Width:

0

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC44,.7SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

245

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

0

Maximum Seated Height:

4.57 mm

Sub-Category:

Serial IO/Communication Controllers

Maximum Supply Current:

25 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16.585 mm

Trade Compliance

SC26C92A1A Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

NSN

5962-01-460-6582, 5962014606582, 5962-01-655-8713, 5962016558713

NIIN

014606582, 016558713

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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