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MCP2515T-E/STVAO

Microchip Technology

MCP2515T-E/STVAO by Microchip Technology

MCP2515T-E/STVAO by Microchip: Serial Communication Controller with 5.5V max supply, 0.125 MBps data rate, and 40 MHz clock freq. Ideal for automotive applications due to AEC-Q100 screening, SPI bus compatibility, and low power mode support.

Median Price

$3.050

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 12,500 parts In-Stock

1+ parts

$3.050

100+ parts

$2.310

1k+ parts

$2.240

10k+ parts

$2.200

12,500

$3.050

$2.310

$2.240

$2.200

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 900 parts In-Stock

1+ parts

$2.120

100+ parts

-

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900

$2.120

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Vyrian

USA . 787 parts In-Stock

1+ parts

-

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787

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 1,604 parts In-Stock

1+ parts

$2.120

100+ parts

-

1k+ parts

-

10k+ parts

$2.078

1,604

$2.120

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-

$2.078

Netroflash

USA . 500 parts In-Stock

1+ parts

$2.120

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500

$2.120

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Argo Parts USA

USA . 9 parts In-Stock

1+ parts

$2.120

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9

$2.120

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Semicontronic

India . 2,264 parts In-Stock

1+ parts

$2.590

100+ parts

$2.525

1k+ parts

$2.512

10k+ parts

-

2,264

$2.590

$2.525

$2.512

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Ampacity Inc.

Singapore . 2,260 parts In-Stock

1+ parts

$2.590

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2,260

$2.590

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AZTECH Wire

Italy . 752 parts In-Stock

1+ parts

$14.018

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752

$14.018

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Corohmni

South Africa . 178 parts In-Stock

1+ parts

$36.902

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178

$36.902

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Aztec Data Supply Inc.

USA . 2,871 parts In-Stock

1+ parts

$78.270

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2,871

$78.270

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Marpe Global Electronics

Taiwan . 3,070 parts In-Stock

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3,070

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QualityLine Systems

Poland . 3,070 parts In-Stock

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3,070

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XL Components Corporation

Australia . 3,070 parts In-Stock

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3,070

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Lixinc

USA . 1,378 parts In-Stock

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1,378

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Overview

Enhance communication in your automotive applications with the MCP2515T-E/STVAO by Microchip Technology. This top-quality Serial Communication Controller offers a reliable solution for efficient data transfer at a maximum rate of 0.125 MBps, all while maintaining a low power mode for energy efficiency. With AEC-Q100 and TS 16949 screening levels, this product guarantees durability and performance even in extreme conditions. Upgrade your systems today with the MCP2515T-E/STVAO and experience seamless connectivity and enhanced functionality like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good durability and reliability for the product.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards.

Maximum Supply Voltage: 5.5 V

Supports a wide range of supply voltages for flexibility in different applications.

Screening Level: AEC-Q100; TS 16949

Compliance with automotive industry standards ensures high quality and reliability.

Package Shape: RECTANGULAR

Rectangular shape is space-efficient and fits well in modern electronic designs.

No. of Terminals: 20

Sufficient number of terminals for connecting various components and peripherals.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact package style saves space and allows for dense PCB layouts.

Minimum Supply Voltage: 4.5 V

Low minimum supply voltage allows operation in low power scenarios.

Maximum Operating Temperature: 125 °C

High operating temperature range ensures the product can withstand harsh conditions.

Maximum Data Transfer Rate: 0.125 MBps

Decent data transfer rate for smooth and efficient communication.

Minimum Operating Temperature: -40 °C

Wide temperature range allows for operation in extreme cold environments.

Terminal Finish: MATTE TIN

Matte tin finish provides good conductivity and corrosion resistance.

Terminal Position: DUAL

Dual terminal position enhances connectivity options for the product.

Maximum Seated Height: 1.2 mm

Low seated height for a slim profile design.

Width: 4.4 mm

Narrow width saves space on the PCB.

Data Encoding or Decoding Method: NRZ

Non-Return-to-Zero encoding method for efficient data transmission.

Communication Protocol: SYNC; BIT ;BYTE

Support for multiple communication protocols for flexibility in different applications.

Maximum Clock Frequency: 40 MHz

High clock frequency allows for fast data processing and communication.

Length: 6.5 mm

Compact length for space-saving designs.

Temperature Grade: AUTOMOTIVE

Specifically designed for automotive applications with high temperature tolerance.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

Dedicated serial communication controller for efficient data exchange.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminal form for easy surface mounting and removal.

Maximum Supply Current: 10 mA

Low supply current for energy-efficient operation.

Nominal Supply Voltage: 5 V

Standard nominal supply voltage for compatibility with common power sources.

Bus Compatibility: SPI

SPI bus compatibility for easy integration with other devices.

Terminal Pitch: 0.65 mm

Fine terminal pitch for high-density PCB layouts.

Low Power Mode: YES

Low power mode feature for energy savings during idle or low activity periods.

Technical Specifications

Serial Communication Controllers MCP2515T-E/STVAO attributes and parameters. Explore more Serial Communication Controllers devices from Microchip Technology

Specs

Address Bus Width:

0

Boundary Scan:

NO

Bus Compatibility:

SPI

Maximum Clock Frequency:

40 MHz

Communication Protocol:

SYNC; BIT ;BYTE

Data Encoding or Decoding Method:

NRZ

Maximum Data Transfer Rate:

.125 MBps

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3

Length:

6.5 mm

Low Power Mode:

YES

No. of Serial I/Os:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Screening Level:

AEC-Q100; TS 16949

Maximum Seated Height:

1.2 mm

Maximum Supply Current:

10 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

MCP2515T-E/STVAO Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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