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ENC28J60-I/SO

Microchip Technology

ENC28J60-I/SO by Microchip Technology

ENC28J60-I/SO by Microchip Technology is a Serial Communication Controller with 3.3V power supply, 1.25 MBps data transfer rate, and SPI bus compatibility. It is used in LAN applications for low power mode communication at industrial temperature grades of -40 to 85 °C.

Median Price

$3.881

Lifecycle Status

Suppliers In-Stock

37

In-Stock Inventory

1k+

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 9,444 parts In-Stock

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$3.310

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$2.820

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Newark

USA . 398 parts In-Stock

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$3.350

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$3.350

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Chip1Stop

Japan . 57 parts In-Stock

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$3.370

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$2.510

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Microchip Technology

USA . 156,586 parts In-Stock

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$4.140

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$3.450

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$3.030

DigiKey

USA . 1,625 parts In-Stock

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$4.140

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$3.450

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Mouser Electronics

USA . 1,230 parts In-Stock

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$3.820

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Element14

Singapore . 8,321 parts In-Stock

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Avnet

USA . 2,133 parts In-Stock

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$3.881

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Verical

USA . 398 parts In-Stock

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Master Electronics

USA . 297 parts In-Stock

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$3.620

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Future Electronics

Canada . 9 parts In-Stock

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$3.250

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$3.190

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Distributors (In-Stock)

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Ozdisan Elektronik

Türkiye . 122 parts In-Stock

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$2.029

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Nova Conductors

Japan . 62 parts In-Stock

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$3.780

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Component Electronics Inc.

Canada . 39 parts In-Stock

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$3.850

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$2.880

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$2.500

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39

$3.850

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TME

Poland . 145 parts In-Stock

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$4.280

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$3.920

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$3.780

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NAC Semi

USA . 134,730 parts In-Stock

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$4.310

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$3.910

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$3.570

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Voyager Components

USA . 7 parts In-Stock

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$5.690

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SOS electronic

Slovakia . 6 parts In-Stock

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$6.790

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Chip Stock

USA . 16,700 parts In-Stock

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Vyrian

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Micros

Poland . 600 parts In-Stock

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Lantek

USA . 515 parts In-Stock

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Partservice

France . 350 parts In-Stock

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IBS Electronics

USA . 306 parts In-Stock

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Greenchips

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SIE Connect GmbH - GreenChips

Germany . 197 parts In-Stock

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Schukat

Germany . 126 parts In-Stock

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Cogito LLC

Ukraine . 102 parts In-Stock

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ComSIT Distribution GmbH

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Goldney Electronics S.L.

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ACDS - Activité Composants Distribution Service

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Ack Elektronik San.Tic.Ltd.Sti

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PC Components Company LLC

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Prism Electronics

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Contempo Components LLC

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Semicontronic

India . 21,206 parts In-Stock

1+ parts

$2.810

100+ parts

$2.740

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$2.726

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Ampacity Inc.

Singapore . 17,729 parts In-Stock

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$2.810

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Continental Prestige Electronics

USA . 11,257 parts In-Stock

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$3.200

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Argo Parts USA

USA . 4,442 parts In-Stock

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$3.724

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Advanced Electronics

New Zealand . 46 parts In-Stock

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$21.878

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$20.784

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$20.784

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Microchip USA

USA . 4,410 parts In-Stock

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$26.910

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Corohmni

South Africa . 843 parts In-Stock

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$29.751

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Aztec Data Supply Inc.

USA . 97 parts In-Stock

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$47.490

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Modulus Dynamics

Lithuania . 986 parts In-Stock

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$60.021

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Lixinc

USA . 18,999 parts In-Stock

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Perfect Parts

USA . 16,800 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,658 parts In-Stock

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RC Electronics

USA . 6,805 parts In-Stock

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LMD Electronica

Estonia . 5,774 parts In-Stock

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NIA Electronics

USA . 5,609 parts In-Stock

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Ledger Components

France . 5,609 parts In-Stock

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LOOK Integrated Logistics

Peru . 5,323 parts In-Stock

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Montano Global Distributors

Canada . 3,958 parts In-Stock

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Futuretech Components

Singapore . 3,000 parts In-Stock

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Robosynatics

Brazil . 1,710 parts In-Stock

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Lucentia Tech

USA . 1,710 parts In-Stock

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$51.441

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$50.391

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$50.391

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$50.391

Alle Elektronik GmbH

Germany . 1,476 parts In-Stock

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Eastek

USA . 682 parts In-Stock

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GreenTree Electronics

Israel . 682 parts In-Stock

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iodParts Technologies Inc.

India . 196 parts In-Stock

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Netroflash

USA . 100 parts In-Stock

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$3.704

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$3.591

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Authorized Procurement Solutions

USA . 78 parts In-Stock

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Computer Components Inc. - USA

USA . 27 parts In-Stock

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Speed Components Ltd (Excess)

Israel . 19 parts In-Stock

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Kepictronics

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ChipstoGo Electronic ltd

UK . 6 parts In-Stock

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Overview

Enhance your projects with the Microchip Technology ENC28J60-I/SO, a high-quality Serial Communication Controller that offers seamless connectivity and reliable performance. Manufactured by industry leader Microchip Technology, this product is perfect for a wide range of applications, from IoT devices to industrial automation. With low power mode and a maximum data transfer rate of 1.25 MBps, this controller provides exceptional value and efficiency for customers looking to streamline their operations. Upgrade your designs today with the ENC28J60-I/SO and experience the advantages of top-notch technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, making it suitable for a wide range of applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in power supply options and compatibility with a variety of systems.

On Chip Data RAM Width: 8

The 8-bit width of on-chip data RAM provides sufficient storage capacity for processing data efficiently.

Screening Level: TS 16949

The TS 16949 screening level ensures high quality and reliability, meeting industry standards for performance and durability.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy integration into circuit board layouts and provides a compact form factor.

Power Supplies (V): 3.3

The 3.3V power supply is a common standard in many electronic devices, making the product compatible with a wide range of systems.

No. of Terminals: 28

The 28 terminals provide sufficient connectivity options for interfacing with other components and peripherals.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the circuit board and allows for compact and efficient designs.

Minimum Supply Voltage: 3.1 V

The low minimum supply voltage ensures efficient power consumption and compatibility with lower voltage systems.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range ensures reliable performance even in demanding industrial environments.

Maximum Data Transfer Rate: 1.25 MBps

The high data transfer rate enables fast and efficient communication, making the product suitable for high-speed applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature range allows for reliable performance in extreme cold conditions.

Terminal Finish: Matte Tin (Sn)

The matte tin terminal finish provides good solderability and corrosion resistance, ensuring long-term reliability.

Terminal Position: DUAL

The dual terminal position allows for flexible mounting options and easy integration into various system configurations.

Maximum Seated Height: 2.65 mm

The low seated height saves space on the circuit board, making the product ideal for applications with limited vertical clearance.

RAM Words: 8192

The 8192 RAM words provide ample memory capacity for storing and processing data efficiently.

Width: 7.5 mm

The narrow width of 7.5mm allows for compact and space-saving designs in electronic systems.

Communication Protocol: SYNC; BIT ;BYTE

Support for multiple communication protocols including SYNC, BIT, and BYTE ensures compatibility with various system configurations and requirements.

Maximum Clock Frequency: 25 MHz

The high maximum clock frequency of 25 MHz enables fast and efficient data processing, suitable for high-performance applications.

Maximum Time At Peak Reflow Temperature (s): 40

The 40-second maximum time at peak reflow temperature ensures reliable soldering and assembly during manufacturing processes.

Peak Reflow Temperature °C: 250

The high peak reflow temperature of 250°C ensures stable and durable solder joints, suitable for harsh operating conditions.

Length: 17.9 mm

The compact length of 17.9mm allows for efficient use of space on the circuit board, enabling sleek and compact designs.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable performance and durability in harsh industrial environments.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, LAN

The peripheral IC type enables seamless integration with other communication controllers and LAN interfaces, enhancing connectivity options.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Terminal Form: GULL WING

The gull-wing terminal form provides easy and secure soldering connections, ensuring reliable electrical connections.

Maximum Supply Current: 180 mA

The maximum supply current of 180 mA ensures efficient power usage and compatibility with various power supply configurations.

Nominal Supply Voltage: 3.3 V

The 3.3V nominal supply voltage is a common standard in many electronic systems, ensuring compatibility and reliable performance.

Bus Compatibility: SPI

The SPI bus compatibility allows for easy integration and communication with other SPI-compatible devices, enhancing connectivity options.

Terminal Pitch: 1.27 mm

The 1.27mm terminal pitch provides standard spacing for easy soldering and mounting on the circuit board.

Low Power Mode: YES

The low power mode option allows for energy-efficient operation, extending battery life and reducing overall power consumption.

Technical Specifications

Serial Communication Controllers ENC28J60-I/SO attributes and parameters. Explore more Serial Communication Controllers devices from Microchip Technology

Specs

Address Bus Width:

0

Boundary Scan:

NO

Bus Compatibility:

SPI

Maximum Clock Frequency:

25 MHz

Communication Protocol:

SYNC; BIT ;BYTE

Maximum Data Transfer Rate:

1.25 MBps

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e3

Length:

17.9 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of Serial I/Os:

1

No. of Terminals:

28

On Chip Data RAM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

250

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Words:

8192

Screening Level:

TS 16949

Maximum Seated Height:

2.65 mm

Sub-Category:

Serial IO/Communication Controllers

Maximum Supply Current:

180 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.1 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

7.5 mm

Trade Compliance

ENC28J60-I/SO Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

Category top products 20

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