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TL16C2550IPFBRG4

Texas Instruments

TL16C2550IPFBRG4 by Texas Instruments

TL16C2550IPFBRG4 by Texas Instruments is a Serial Communication Controller with 5.5V max supply voltage, 24MHz clock frequency, and 0.1875MBps data transfer rate. Ideal for industrial applications requiring high-speed asynchronous communication over 2 serial I/Os.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,319 parts In-Stock

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3,319

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Digiode

USA . 2,456 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

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AZTECH Wire

Italy . 851 parts In-Stock

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$9.620

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851

$9.620

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One Stop Electronics

USA . 1,414 parts In-Stock

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$18.000

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$18.000

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Ampacity Inc.

Singapore . 590 parts In-Stock

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$27.000

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Parana Technologies

USA . 1,391 parts In-Stock

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$34.473

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DigiPath Technology Company

USA . 2,250 parts In-Stock

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$37.959

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$37.959

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ChromeModa Solutions

Germany . 2,482 parts In-Stock

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$38.734

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$31.762

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IDEA Electronic Components Group

UK . 2,369 parts In-Stock

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$38.734

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$36.797

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$34.861

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2,369

$38.734

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$34.861

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Continental Prestige Electronics

USA . 4,599 parts In-Stock

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Corphita

USA . 3,810 parts In-Stock

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Bastille Electronics

Australia . 450 parts In-Stock

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Argo Parts USA

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iodParts Technologies Inc.

India . 94 parts In-Stock

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Overview

Unlock seamless and efficient communication with the TL16C2550IPFBRG4 by Texas Instruments, a cutting-edge Serial Communication Controller. Crafted with precision and reliability in mind, this product offers unmatched value and performance for a wide range of applications. From industrial automation to consumer electronics, experience the benefits of fast data transfer rates, versatile communication protocols, and durable construction. Elevate your projects with the quality and expertise of Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for various applications without adding unnecessary weight.

Surface Mount: YES

Surface mount components are easier to assemble on circuit boards, making the product more user-friendly for manufacturers.

Maximum Supply Voltage: 5.5 V

The ability to handle up to 5.5 V ensures compatibility with a wide range of power sources, increasing the product's versatility.

Address Bus Width: 3

A wider address bus allows for more efficient communication and data transfer, enhancing the overall performance of the product.

Package Shape: SQUARE

The square package shape is space-efficient and easy to integrate into existing circuit designs, making the product suitable for compact applications.

Power Supplies (V): 1.8/5

The availability of multiple power supply options provides flexibility in operating the product under different voltage conditions.

No. of Terminals: 48

Having a higher number of terminals allows for more connections and functionalities, making the product versatile and adaptable to different setups.

Package Style (Meter): FLATPACK, THIN PROFILE, FINE PITCH

The combination of flatpack, thin profile, and fine pitch package style enhances the product's performance in high-density applications and enables easy integration into tight spaces.

Minimum Supply Voltage: 4.5 V

The ability to operate at low voltages ensures efficient power consumption and compatibility with various power sources.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions and maintain stable performance under extreme heat.

Maximum Data Transfer Rate: 0.1875 MBps

The high data transfer rate ensures fast and reliable communication, making the product suitable for time-sensitive applications.

Minimum Operating Temperature: -40 °C

The ability to operate at low temperatures allows the product to function in cold environments without compromising performance.

Terminal Finish: NICKEL PALLADIUM GOLD

This terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable connections for long-term use.

Terminal Position: QUAD

The quad terminal position allows for multiple connections in a compact space, optimizing the design and layout of the product.

Maximum Seated Height: 1.2 mm

A low seated height saves space and allows for a more compact design, making the product ideal for slim and portable devices.

Width: 7 mm

The compact width of the product makes it suitable for applications with limited space, ensuring easy integration into various electronic systems.

External Data Bus Width: 8

A wide external data bus allows for faster data transfer and improved efficiency in handling large volumes of information.

Communication Protocol: ASYNC, BIT

Support for asynchronous communication and bit-level protocol enables versatile and reliable data exchange in diverse applications.

Maximum Clock Frequency: 24 MHz

The high clock frequency ensures rapid data processing and communication, making the product suitable for high-speed applications.

Maximum Time At Peak Reflow Temperature (s): 30

The ability to withstand peak reflow temperatures for extended periods ensures robust performance during the manufacturing process.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance ensures reliable soldering and assembly of the product under elevated temperatures.

Length: 7 mm

The compact length of the product makes it easy to fit into tight spaces and simplifies the overall design of electronic systems.

Temperature Grade: INDUSTRIAL

The industrial temperature grade indicates that the product is suitable for use in rugged environments and harsh conditions, ensuring reliable performance in demanding applications.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

The peripheral IC type supports serial communication and provides interface capabilities, making the product versatile and compatible with various devices.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency and reliability of the product.

Terminal Form: GULL WING

The gull wing terminal form makes soldering and connections easier, ensuring secure and stable connections for optimal performance.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5 V provides a standard operating voltage level for consistent and stable performance in various applications.

No. of Serial I/Os: 2

Having multiple serial I/Os allows for simultaneous data transfer and communication, enhancing the product's capability and flexibility.

Terminal Pitch: 0.5 mm

The small terminal pitch enables dense packaging and efficient use of space on circuit boards, making the product suitable for compact designs.

Moisture Sensitivity Level (MSL): 2

The moisture sensitivity level of 2 indicates that the product has moderate sensitivity to moisture, making it suitable for a variety of environments with controlled humidity levels.

Technical Specifications

Serial Communication Controllers TL16C2550IPFBRG4 attributes and parameters. Explore more Serial Communication Controllers devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 1.8V MINIMUM SUPPLY AT 10MHZ

Address Bus Width:

3

Boundary Scan:

NO

Maximum Clock Frequency:

24 MHz

Communication Protocol:

ASYNC, BIT

Maximum Data Transfer Rate:

.1875 MBps

External Data Bus Width:

8

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e4

Length:

7 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

2

No. of Serial I/Os:

2

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP48,.35SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Serial IO/Communication Controllers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

TL16C2550IPFBRG4 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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