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TL16C550CIPTRG4

Texas Instruments

TL16C550CIPTRG4 by Texas Instruments

TL16C550CIPTRG4 by Texas Instruments is a Serial Communication Controller with 48 terminals, operating at 3.3/5V. It supports data rates up to 0.125 MBps and communication protocols like ASYNC and BIT. Ideal for industrial applications requiring high-speed serial I/O capabilities.

Median Price

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Lifecycle Status

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7

In-Stock Inventory

1k+

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Vyrian

USA . 3,160 parts In-Stock

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Digiode

USA . 2,053 parts In-Stock

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Chip Stock

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North Shore Components

USA . 407 parts In-Stock

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Bristol Electronics

USA . 386 parts In-Stock

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 309 parts In-Stock

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Nova Conductors

Japan . 74 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 415 parts In-Stock

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$13.761

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Ampacity Inc.

Singapore . 837 parts In-Stock

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$17.000

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Parana Technologies

USA . 704 parts In-Stock

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$19.302

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$19.328

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One Stop Electronics

USA . 1,354 parts In-Stock

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DigiPath Technology Company

USA . 866 parts In-Stock

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$21.254

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$19.554

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IDEA Electronic Components Group

UK . 400 parts In-Stock

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$21.688

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$20.604

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ChromeModa Solutions

Germany . 295 parts In-Stock

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Semicontronic

India . 1,219 parts In-Stock

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Advanced Electronics

New Zealand . 77 parts In-Stock

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Corohmni

South Africa . 97 parts In-Stock

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Corphita

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Microchip USA

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Continental Prestige Electronics

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Argo Parts USA

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Bastille Electronics

Australia . 300 parts In-Stock

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Kepictronics

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Overview

Enhance your communication systems with the TL16C550CIPTRG4 by Texas Instruments, a top-tier manufacturer known for its high-quality products. As a leading Serial Communication Controller, this device offers unmatched reliability and performance in various applications. With its advanced features and robust design, customers can benefit from seamless data transfer, enhanced connectivity, and improved efficiency. Elevate your projects with the value and advantages that this exceptional product brings to the table. Trust Texas Instruments for cutting-edge solutions that meet your needs and exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package lightweight and durable, ideal for applications where weight and strength are important factors.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving time and effort during manufacturing.

Maximum Supply Voltage: 5.25 V

The higher maximum supply voltage allows for flexibility in power supply options and ensures stable operation within the specified range.

Package Shape: SQUARE

The square package shape helps in optimizing PCB layout and space utilization, making it suitable for compact designs.

Maximum Data Transfer Rate: 0.125 MBps

With a maximum data transfer rate of 0.125 MBps, this controller offers fast communication speeds suitable for various serial communication applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation across a wide range of temperatures, making it suitable for industrial applications where temperature fluctuations are common.

Technical Specifications

Serial Communication Controllers TL16C550CIPTRG4 attributes and parameters. Explore more Serial Communication Controllers devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 3.3V SUPPLY AT 14.9 MHZ

Address Bus Width:

3

Boundary Scan:

NO

Maximum Clock Frequency:

16 MHz

Communication Protocol:

ASYNC, BIT

Data Encoding or Decoding Method:

NRZ

Maximum Data Transfer Rate:

.125 MBps

External Data Bus Width:

8

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e4

Length:

7 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

3

No. of Serial I/Os:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Serial IO/Communication Controllers

Maximum Supply Current:

10 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

TL16C550CIPTRG4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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