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SC16IS750IBSS900:1

NXP Semiconductors

SC16IS750IBSS900:1 by NXP Semiconductors

NXP Semiconductors' SC16IS750IBSS900:1 is a Serial Communication Controller with 24 terminals, operating at 3-3.6V. It supports data rates up to 0.625 MBps, clocked at 80 MHz, and operates in industrial temperatures from -40 to 85°C. Ideal for asynchronous communication protocols in various applications requiring low power consumption.

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Anansix

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Digiode

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Nova Conductors

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AZTECH Wire

Italy . 615 parts In-Stock

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Ampacity Inc.

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One Stop Electronics

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Corphita

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Continental Prestige Electronics

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Overview

Unlock seamless communication with the SC16IS750IBSS900:1 from NXP Semiconductors. Designed with precision and reliability, this Serial Communication Controller offers unparalleled performance in a variety of applications. From industrial automation to consumer electronics, this versatile product ensures fast data transfer rates and low power consumption. Experience the value and benefits of cutting-edge technology with NXP Semiconductors. Elevate your projects with the SC16IS750IBSS900:1 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and reliability of the product, making it suitable for various environments.

Surface Mount: YES

Easy installation and space-saving design for efficient PCB layout.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options.

Address Bus Width: 2

Efficient data transfer and communication capabilities.

Power Supplies (V): 2.5/3.3

Compatibility with different power sources for versatile applications.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Enhanced heat dissipation and compact design for space-constrained applications.

Minimum Operating Temperature: -40 °C

Wide operating temperature range for reliable performance in harsh conditions.

Maximum Data Transfer Rate: 0.625 MBps

High-speed data transfer for efficient communication processes.

Communication Protocol: ASYNC, BIT

Support for asynchronous communication and bit-level data transfer.

Technology: CMOS

Low power consumption and high noise immunity.

Technical Specifications

Serial Communication Controllers SC16IS750IBSS900:1 attributes and parameters. Explore more Serial Communication Controllers devices from NXP Semiconductors

Specs

Additional Features:

CAN ALSO OPERATES AT 2.5 V SUPPLY

Address Bus Width:

2

Boundary Scan:

NO

Maximum Clock Frequency:

80 MHz

Communication Protocol:

ASYNC, BIT

Data Encoding or Decoding Method:

NRZ

Maximum Data Transfer Rate:

.625 MBps

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N24

Length:

4 mm

Low Power Mode:

YES

No. of Serial I/Os:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC24,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Serial IO/Communication Controllers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

4 mm

Trade Compliance

SC16IS750IBSS900:1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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